EP2AGX125EF29I5G - Arria II GX FPGA 118K LE 780-FBGA | Intel
MPN: EP2AGX125EF29I5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1436.04 | $1,436.04 |
| 10 | $1292.44 | $12,924.40 |
| 100 | $1148.83 | $114,883.00 |
| 500 | $1005.23 | $502,615.00 |
| 1,000 | $861.62 | $861,620.00 |
EP2AGX125EF29I5G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks (BRAM/M9K/M144K), DSP blocks, and high-speed transceivers. Within the broader semiconductor taxonomy, FPGAs sit above ASICs as flexible alternatives that allow hardware reconfiguration post-manufacture. Arria II GX is positioned in Intel's mid-range transceiver-equipped family, between Cyclone (low-cost) and Stratix (high-performance), targeting applications requiring serial connectivity without Stratix-tier cost.
Key features include 8,315,904 embedded memory bits distributed across M9K/M144K blocks, dedicated 18x18 hardware multipliers for DSP, 12 high-speed transceivers with CDR support, and PCI Express (PIPE) hard IP blocks. The 780-FCBGA package (29 mm x 29 mm) exposes 372 user I/O pins across 8 I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and DDR/DDR2/DDR3 external memory interfaces.
The architecture combines an adaptive logic module (ALM) fabric, embedded memory, DSP blocks, and PLLs in a fine-grained programmable fabric. Hard IP blocks for PCIe Gen1/Gen2 and external memory controllers accelerate system integration while preserving the FPGA's parallel processing throughput for custom logic, signal processing, and protocol bridging.
Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, Gbps Ethernet), digital signal processing, telecom baseband processing, video processing pipelines, and ASIC prototyping. The transceiver-rich architecture also suits test and measurement equipment requiring multi-channel data acquisition.
When designing with this device, ensure proper power sequencing for the 0.9 V core, 1.5 V/2.5 V/3.3 V auxiliary rails, and PLL analog supplies. Thermal management of the FCBGA requires a heatsink or thermal interface material for sustained transceiver operation; junction temperatures above 100C may degrade I5-grade reliability.
This page synthesizes distributor pricing, Arria II GX family drop-in alternatives, transceiver IP guidance, and thermal design notes not found in a single place in the manufacturer datasheet.
Drop-in alternatives for EP2AGX125EF29I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX125EF29I5G (same form factor and footprint) — differing in Package, Speed Grade, Embedded Memory, Operating Temperature, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX125EF29I3G
✅ Drop-In✓ In Stock
$590.9643 / Unit
View Datasheet →EP2AGX125EF29C6G
✅ Drop-In✓ In Stock
$1495 / Unit
View Datasheet →EP2AGX125EF29C5G
✅ Drop-In✓ In Stock
$1090 / Unit
View Datasheet →EP2AGX125EF29C4G
✅ Drop-In✓ In Stock
$1100 / Unit
View Datasheet →EP2AGX125EF29I3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1095 / Unit
View Datasheet →EP2AGX125EF29I5G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements | 118,143 |
| Embedded Memory Bits | 8,315,904 |
| User I/O Pins | 372 |
| Package | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Process Technology | 40 nm |
| Core Voltage (VCCINT) | 0.9 V |
| Transceivers (GX) | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | Industrial (I5): -40C to +100C |
| DSP Blocks | Yes (18x18 hardware multipliers) |
| PLL Count | Multiple per device (family-dependent) |
| External Memory Support | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | JTAG, AS, PS, FPP |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP2AGX125EF29I5G 780-ball fcbga (flip-chip bga), 29x29 mm Pin Configuration Guide
Pin configuration for EP2AGX125EF29I5G (780-ball fcbga (flip-chip bga), 29x29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX125EF29I5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX125EF29I5G is suitable for 8 applications: PCIe Gen2 Endpoint Card, Telecom Baseband Signal Processing, Video Broadcast Processing, High-Speed Protocol Bridging, Test and Measurement Equipment, ASIC Prototyping, Industrial Motor Control and Drives, Aerospace Avionics Interfaces.
PCIe Gen2 Endpoint Card
The EP2AGX125EF29I5G is well-suited for PCIe Gen1/Gen2 endpoint designs because the Arria II GX family integrates a hard PCI Express IP block with PIPE interface support, freeing logic resources for application-layer logic. Its 118,143 logic elements and 8,315,904 bits of embedded memory accommodate DMA engines, scatter-gather descriptors, and protocol-stack buffers while the transceiver PHY runs at 2.5/5 Gbps. Designers benefit from deterministic latency delivered by the hard IP versus soft implementations. Companion MPNs from the same Arria II GX family provide multi-lane variants.
Recommended
Telecom Baseband Signal Processing
The EP2AGX125EF29I5G suits telecom baseband processing because its 18x18 hardware multipliers and DSP blocks deliver parallel multiply-accumulate throughput for FFT, FEC, and channelization functions. The 12 high-speed transceivers support CPRI/OBSAI fronthaul links at 3.072 Gbps common in 3G/4G base stations, while 8,315,904 bits of embedded memory absorb bursty symbol-rate buffering. Industrial -40C to +100C operation matches outdoor cabinet environments. The 0.9 V core reduces power-per-flop compared to older 90 nm FPGAs.
Recommended
Video Broadcast Processing
The EP2AGX125EF29I5G fits video broadcast pipelines because its 372 user I/O pins accept multiple SDI/HD-SDI/3G-SDI inputs while embedded memory and DSP blocks handle scaling, deinterlacing, and color-space conversion in real time. Industrial temperature grade supports deployment in studio and head-end equipment with sustained operation. The 40 nm process keeps dynamic power manageable for multi-channel 1080p60 designs. Companion serializer/deserializer MPNs pair naturally with the transceiver-rich Arria II GX.
Recommended
High-Speed Protocol Bridging
The EP2AGX125EF29I5G works as a multi-protocol bridge between legacy parallel buses and modern serial interfaces because 12 transceivers can run independent protocols (Serial RapidIO, Gbps Ethernet, JESD204B, Aurora) simultaneously. The 118,143 logic elements and 8,315,904-bit memory pool absorb protocol-stack state machines, FIFOs, and DMA channels. The 780-FCBGA package exposes 372 I/O for legacy bus access. Industrial temperature grade supports factory-floor deployment.
Recommended
Test and Measurement Equipment
The EP2AGX125EF29I5G serves T&M equipment such as logic analyzers, protocol analyzers, and arbitrary waveform generators because its transceiver bank captures or generates multi-Gbps signals while DSP blocks perform real-time triggering, pattern matching, and FFT analysis. Embedded memory stores deep acquisition windows, and 372 user I/O pins interface to probe pods and front-panel connectors. Industrial temperature grade ensures stable operation in lab and field environments. Quartus II toolchain supports rapid firmware iteration.
Recommended
ASIC Prototyping
The EP2AGX125EF29I5G is widely used as an ASIC prototyping platform because its 118,143 logic elements and 8,315,904-bit memory can map substantial portions of an ASIC design with predictable timing closure. The 12 transceivers emulate SerDes interfaces, and 372 user I/O pins break out to ASIC pin pads for system-level validation. Multi-FPGA partitioning tools (Quartus II + Synplify) support large ASIC emulation. Industrial temperature grade aids bring-up in production-like environments.
Recommended
Industrial Motor Control and Drives
The EP2AGX125EF29I5G drives industrial motor controllers because its high logic count and DSP blocks execute field-oriented control (FOC), space-vector PWM, and encoder-feedback loops in single-chip latency. Industrial -40C to +100C operation matches cabinet-mounted drive electronics, while 372 I/O pins interface to power-stage gate drivers, ADCs, and resolver/excitation hardware. The transceiver bank can carry EtherCAT or SERCOS III for synchronized multi-axis motion networks.
Recommended
Aerospace Avionics Interfaces
The EP2AGX125EF29I5G serves avionics interface cards (MIL-STD-1553, ARINC 429, ARINC 818, Fibre Channel) because its transceiver-rich architecture aggregates multiple avionics buses into a single FPGA while 118,143 logic elements host protocol stacks, error counters, and discrete I/O handling. Industrial temperature grade supports controlled avionics bays; for harsher sections, designers should verify against DO-254 qualification evidence. Companion non-volatile configuration memories (EPCS) pair naturally with Arria II GX.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX125EF29I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX125EF29I3G | EP2AGX125EF29C6G | EP2AGX125EF29C5G | EP2AGX125EF29C4G | EP2AGX125EF29I3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FCBGA (29x29 mm) | 780-FCBGA (29x29 mm) - same | 780-FCBGA (29x29 mm) - same | 780-FCBGA (29x29 mm) - same | 780-FCBGA (29x29 mm) - same | 780-FCBGA (29x29 mm) - same |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 |
| Embedded Memory Bits | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 |
| User I/O Pins | 372 | 372 | 372 | 372 | 372 | 372 |
| Temperature Grade | Industrial -40C to +100C (I5) | Industrial -40C to +85C (I3) | Commercial 0C to +85C (C6) | Commercial 0C to +85C (C5) | Commercial 0C to +85C (C4) | Industrial -40C to +85C (I3) |
| Speed Grade | I5 | I3 (faster) | C6 | C5 | C4 | I3 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- Higher junction temperature ceiling (100C vs 85C) (vs EP2AGX125EF29I3G)
- Industrial temperature screening vs commercial (vs EP2AGX125EF29C6G)
- Same-package compatibility across all 5 alternatives (vs EP2AGX125EF29C4G)
Design Notes
The EP2AGX125EF29I5G requires a multi-rail power supply: VCCINT (0.9 V core), VCCPD (3.3 V), VCCAUX/VCCAUX_PLL (2.5 V), and transceiver supplies (VCCR/VCCT/VCCP). Power sequencing must follow the Arria II GX Handbook guideline - VCCINT before VCCPD, with monotonic ramp-up; violation can cause inrush damage or configuration failure. Designers should use a dedicated power-management IC (such as the Intel Enpirion or compatible) to guarantee sequencing and avoid latch-up. Estimated: at full utilization with all 12 transceivers active, VCCINT current can reach 5-8 A, demanding at least 4-layer PCB with 1 oz copper and wide power planes.
The 780-FCBGA package dissipates significant heat under sustained transceiver and logic utilization. At 85% utilization and all transceivers active, total power can exceed 15 W. A heatsink with thermal interface material is recommended; alternatively, route thermal vias to inner copper planes to form a heat-spreader array. Per Arria II GX datasheet thermal guidelines, the junction-to-ambient thermal resistance (theta_JA) without airflow is approximately 7-9 C/W. Estimated: at 15 W dissipation, junction temperature would rise 105-135C above ambient without airflow, requiring active cooling for industrial-grade parts where max Tj is 100C.
The 780-FCBGA (29x29 mm) requires microvia or HDI PCB technology. Per Intel's Arria II GX Pin-Out file, the ball pitch is 1.0 mm; designers must use 0.4 mm via-in-pad microvias with filled-and-capped plating to avoid solder voiding under BGA balls. Escape routing demands at least 4 routing layers between BGA and DDR3 memory. Maintain 100-ohm differential impedance for transceiver channels (3.5 Gbps requires controlled impedance per Arria II GX Transceiver User Guide). Reference the manufacturer's symbol and IBIS models in your schematic capture before layout.
Common design pitfalls include: (1) missing the CONFIG_DONE pull-up, which prevents configuration status readback; (2) leaving JTAG TCK floating, which causes unreliable boundary-scan operation; (3) connecting pull-ups incorrectly on MSEL pins, which selects the wrong configuration scheme; (4) neglecting decoupling on PLL analog supplies (VCCA_PLL), causing jitter; (5) forgetting the AS configuration memory (EPCS16/EPCS64) when using Active Serial mode. Per Intel's Arria II GX configuration handbook, all MSEL, AS_DATA, and nCONFIG pins must follow the reference schematic.
Compliance Information
RoHS and lead-free per Intel Arria II GX product page; AEC-Q100 not applicable (FPGA, not automotive IC); conflict-mineral compliance per Intel supplier policy. Halogen-free status not explicitly stated in provided data.
