EP2AGX125EF29I3G Arria II GX FPGA | Intel
MPN: EP2AGX125EF29I3G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $590.9643 | $590.96 |
| 10 | $590.9643 | $5,909.64 |
| 100 | $590.9643 | $59,096.43 |
| 500 | $590.9643 | $295,482.15 |
| 1,000 | $590.9643 | $590,964.30 |
EP2AGX125EF29I3G Overview
An FPGA is a semiconductor device whose digital logic, routing, and I/O behavior can be configured after manufacturing. In the system hierarchy, it sits between fixed-function application-specific integrated circuits and software-defined processing: unlike an ASIC, an FPGA can be reprogrammed, while unlike a microprocessor, it can execute many operations concurrently in configured hardware. FPGAs are commonly selected for data paths, interface bridging, digital signal processing, control systems, and prototyping. The target belongs to the Arria II GX family, a programmable-logic product family from Intel/Altera.
The verified listings identify the part as an Arria II GX FPGA and expose three headline architecture values: 372 user I/O, 8,315,904 programmable bits, and 118,143 logic elements. These values indicate a high-density programmable device with a substantial I/O interface. The package is listed as 780-BBGA and FCBGA, with a ball-grid-array form factor suitable for surface mounting. The listings also identify the part as an FPGA, allowing engineers to distinguish it from fixed-function interface, memory, or power-management components.
The architecture is relevant to applications that need parallel processing, configurable timing, and hardware-level interface adaptation. The 118,143 logic elements provide the programmable fabric for implementing combinational and sequential logic. The 8,315,904 programmable-bit figure describes the device's programmable configuration capacity as reported by the distributor listing. The 372 user-I/O count indicates the available external interface resources, although actual usable I/O depends on the selected package, bank assignments, configuration, and design constraints.
Typical applications include communications equipment, industrial automation, test and measurement systems, and data-acquisition or signal-processing platforms. These systems can benefit from configurable hardware parallelism and interface customization. The exact transceiver count, maximum operating frequency, logic-element configuration, supported memory interfaces, and power requirements are not present in the supplied verified data, so those parameters must be confirmed from the official datasheet before implementation.
Designers should verify the complete ball map, bank-specific I/O rules, configuration method, clocking resources, transceiver specifications, power rails, thermal limits, and recommended decoupling network from the official Intel documentation. The 780-ball package requires careful PCB escape routing, controlled-impedance analysis, and verification of the exact land pattern. The supplied search results are sufficient for product identification, package description, I/O count, logic-element count, programmable-bit count, and distributor availability, but not for a complete electrical design sign-off.
This page combines verified distributor records, an Arria II GX datasheet reference result, and structured cross-reference search results. It is designed to help engineers identify the component and assess procurement options while clearly separating supplied facts from parameters that require additional manufacturer documentation.
Drop-in alternatives for EP2AGX125EF29I3G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX125EF29I3G (same form factor and footprint) β differing in Speed Grade, Package, Embedded Memory, Operating Temperature, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX125EF29I3
β Drop-Inβ In Stock
$1095 / Unit
View Datasheet βEP2AGX125EF29C6G
β Drop-Inβ In Stock
$1495 / Unit
View Datasheet βEP2AGX125EF29C5G
β Drop-Inβ In Stock
$1090 / Unit
View Datasheet βEP2AGX125EF29C4G
β Drop-Inβ In Stock
$1100 / Unit
View Datasheet βEP2AGX125DF25I3G
β Drop-Inβ In Stock
$895 / Unit
View Datasheet βEP2AGX125EF29I3G Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Arria II GX |
| Programmable Logic | 118143 logic elements |
| Programmable Bits | 8315904 bits |
| User I/O | 372 I/O |
| Package Type | 780-BBGA, FCBGA |
| Package Code | HBGA |
| Terminal Count | 780 terminals |
| Terminal Form | Ball |
| Package Shape | Square |
| Supply Voltage | 0.9 V |
| Temperature Grade | Industrial |
| Mounting Type | Surface Mount |
| Configuration Technology | FPGA programmable logic |
EP2AGX125EF29I3G square Pin Configuration Guide
Pin configuration for EP2AGX125EF29I3G (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX125EF29I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX125EF29I3G is suitable for 6 applications: Industrial Control Systems, Communications Interface Bridging, Test and Measurement Equipment, Digital Signal Processing Platforms, Data Acquisition and Processing, Hardware Prototyping and Emulation.
Industrial Control Systems
EP2AGX125EF29I3G can support configurable control and data-path functions in industrial equipment where parallel hardware processing and flexible interfaces are valuable. The verified industrial temperature grade and 118,143 logic elements provide a useful starting point for evaluating logic density, while 372 user I/O can accommodate multiple sensors, actuators, communications interfaces, and control peripherals. The FPGA can implement deterministic control loops, protocol conversion, timing, and signal conditioning in one programmable device. Designers must confirm the exact industrial operating range, I/O-bank restrictions, clock limits, and power budget from the official datasheet. The 780-BBGA FCBGA package also requires a verified land pattern and careful power integrity analysis before layout release.
Recommended
Communications Interface Bridging
EP2AGX125EF29I3G is relevant to communications systems that need configurable interface bridging, packet processing, buffering, or protocol adaptation. Its 118,143 logic elements can be allocated to datapaths and control logic, while 372 user I/O provide a broad interface budget for connecting converters, memory, backplanes, or other digital components. The Arria II GX family context makes the device a candidate for evaluating custom communications functions, but the supplied data does not verify transceiver count, supported protocols, maximum clock frequency, or SerDes limits. Engineers should therefore confirm those parameters in the official Intel datasheet before assuming suitability. Power sequencing, termination, signal integrity, and the exact 780-ball pinout must be validated for the intended communications board.
Recommended
Test and Measurement Equipment
EP2AGX125EF29I3G can be evaluated for test and measurement platforms that require real-time capture, data formatting, trigger logic, or interface aggregation. The 118,143 logic elements and 8,315,904 programmable bits support substantial configurable hardware, and 372 user I/O can connect measurement channels, timing devices, conversion circuits, and host interfaces. Its FPGA architecture allows deterministic processing that can be tailored to the instrument rather than relying entirely on software. The supplied records do not provide maximum operating frequency, I/O performance, memory capacity, or power consumption, so these values require datasheet verification. For an instrument design, also assess the 780-BBGA FCBGA escape routing, clock quality, grounding, thermal behavior, and configuration interface before production.
Recommended
Digital Signal Processing Platforms
EP2AGX125EF29I3G is suitable for evaluation in digital signal processing platforms that need configurable parallel arithmetic, filtering, data formatting, or accelerator functions. The verified architecture provides 118,143 logic elements and 8,315,904 programmable bits, giving system architects a substantial programmable fabric for custom signal paths. The 372 user I/O count can support high-throughput connections to converters, memory, and inter-board interfaces, subject to the deviceβs actual I/O and timing specifications. The supplied data does not state DSP block count, multiplier performance, clock rate, or transceiver capability, so designers must consult the official datasheet rather than infer those features from the family name. Confirm logic utilization, power, thermal limits, and PCB signal integrity before committing the FPGA to a DSP design.
Recommended
Data Acquisition and Processing
EP2AGX125EF29I3G can serve as a configurable processing and interface component in data-acquisition systems. Its 372 user I/O can be evaluated against the number and type of sensor, converter, clock, and control connections required by a design, while 118,143 logic elements provide programmable capacity for data alignment, filtering, buffering, and protocol handling. The 8,315,904 programmable-bit figure describes the listed programmable capacity and helps distinguish this device from smaller fixed-function interface ICs. Exact analog front-end compatibility is not established here because the FPGA does not replace required converters or signal-conditioning circuits. Confirm the supported I/O standards, configuration mode, power rails, and maximum clock rate from the official datasheet. Validate the 780-ball PCB escape and signal-integrity budget before layout.
Recommended
Hardware Prototyping and Emulation
EP2AGX125EF29I3G is appropriate for hardware prototyping and emulation when designers need to implement or modify digital logic before committing to a fixed silicon design. The 118,143 logic elements and 8,315,904 programmable bits provide a substantial configurable canvas for control logic, datapaths, and interface experiments, while 372 user I/O can expose multiple functional blocks to a prototype board. The FPGA can be revised through configuration, helping teams test timing, protocol behavior, and system partitioning earlier in development. The supplied data does not provide design-software version, configuration file format, maximum clock frequency, or exact power requirements, so those details must be confirmed with Intel documentation. Use the official package drawing and pinout before building the prototype land pattern.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX125EF29I3G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX125EF29I3 | EP2AGX125EF29C6G | EP2AGX125EF29C5G | EP2AGX125EF29C4G | EP2AGX125DF25I3G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA FCBGA | 780-BBGA FCBGA | 780-BBGA FCBGA | 780-BBGA FCBGA | 780-BBGA FCBGA | 780-BBGA FCBGA |
| Device Type | FPGA | FPGA family candidate | FPGA family candidate | FPGA family candidate | FPGA family candidate | FPGA family candidate |
| Pin-to-Pin Compatibility Evidence | Target package and MPN verified | Not established by supplied data | Not established by supplied data | Not established by supplied data | Not established by supplied data | Not established by supplied data |
Key Differentiators
- Verified target-package identification (vs EP2AGX125DF25I3G)
- Verified architecture-density figures (vs EP2AGX125EF29I3)
- Explicit industrial temperature-grade identification (vs EP2AGX125EF29C6G)
Design Notes
Start the power design from the official Arria II GX operating-condition and power-consumption data, not from the 0.9 V value alone. The verified record reports 0.9 V supply information but does not provide core-current ranges, I/O-bank rail requirements, transceiver power, or total device dissipation. Create a preliminary budget using selected logic utilization, clock rates, I/O activity, and configuration mode, then label all derived values as estimates until the manufacturer power report is available. Confirm the permitted power-up sequence, rail tolerances, decoupling capacitor values, and load transient response before schematic release.
The verified package description is 780-BBGA FCBGA, with 780 terminals and a square ball-grid format. Do not begin routing from an assumed generic BGA symbol. Obtain the official package drawing and confirm the exact land pattern, ball numbering, ball diameter, pitch, solder-mask rules, and recommended PCB stack-up. Use the manufacturer escape-routing guidance where available, maintain continuous reference planes, and provide a short, low-impedance path for each required supply. Confirm via a PCB library review that the footprint belongs to the exact orderable MPN.
Preserve signal integrity by separating high-speed clocks, transceiver-related routes, and sensitive reference or control paths from noisy power-conversion and I/O regions. The supplied data does not state supported clock frequencies, I/O standards, transceiver counts, or timing limits, so those values must be obtained from the official datasheet before setting constraints. After the pinout is confirmed, model the critical interfaces, verify return paths, and avoid unnecessary layer transitions. Use controlled impedance, appropriate termination, and documented length or skew rules derived from the actual interface specification.
Do not infer drop-in compatibility from a similar Intel/Altera MPN or from the 780-BBGA package description alone. EP2AGX125EF29I3, EP2AGX125EF29C6G, EP2AGX125EF29C5G, EP2AGX125EF29C4G, and EP2AGX125DF25I3G are included as site-listed candidates, but the supplied data does not verify complete ball-map, resource, timing, power, or temperature equivalence. Review the ordering-code suffix, package code, configuration support, and official datasheet for each candidate. Treat any cross-package or pinout discrepancy as requiring PCB rework, even when the package family appears similar.
Compliance Information
The supplied verified web data does not contain definitive RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 declarations for the target MPN. The target is identified as an industrial-temperature FPGA, but that does not establish any of these compliance claims.