EP2AGX45DF29C4G - Arria II GX FPGA, 42K LE, 364 I/O, 780-FCBGA
MPN: EP2AGX45DF29C4G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $662.47 | $662.47 |
| 10 | $595 | $5,950.00 |
| 100 | $530 | $53,000.00 |
| 500 | $475 | $237,500.00 |
| 1,000 | $430 | $430,000.00 |
EP2AGX45DF29C4G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and digital ICs, alongside CPLDs and structured ASICs. Unlike fixed-function ASICs, FPGAs can be reconfigured after manufacturing, which makes them ideal for prototyping, low-volume production, and applications where standards evolve quickly. The Arria II GX family specifically targets mid-range applications requiring transceivers and moderate logic density.
The device features 8-input adaptive logic modules (ALMs) per logic element, 36 x 36 bit multipliers for DSP operations, embedded memory blocks up to 9 Kbits each, and hard PCI Express Gen1 controllers. Configuration is supported through active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, with built-in encryption using 256-bit AES for IP protection. The 780-ball FCBGA package offers high signal density with a compact 29 mm x 29 mm footprint suitable for space-constrained designs.
Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed data acquisition systems, broadcast video processing, industrial machine vision, and serial connectivity aggregation. The integrated transceivers support standards such as CPRI, OBSAI, Gigabit Ethernet, SATA, and PCI Express Gen1, enabling direct interface to backplanes, optical modules, and high-speed ADCs/DACs without external PHY devices.
When designing with the EP2AGX45DF29C4G, ensure proper power sequencing for the 0.9 V core and 1.5 V/2.5 V/3.0 V I/O rails per Intel's Power Management Design Guidelines. Thermal management is essential because FCBGA packages rely on PCB thermal vias and airflow for heat dissipation - the device's maximum junction temperature of 100 C must not be exceeded under worst-case operating conditions.
This page consolidates distributor pricing, parametric alternatives, and practical design considerations not found in the manufacturer datasheet alone, providing engineers with a quick reference for sourcing, second-source verification, and design-in risk assessment.
Drop-in alternatives for EP2AGX45DF29C4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45DF29C4G (same form factor and footprint) β differing in Speed Grade, Package, Operating Temperature, Mounting Type, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX45DF29C3N
β Drop-Inβ In Stock
$178 / Unit
View Datasheet βEP2AGX45DF29C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$510 / Unit
View Datasheet βEP2AGX45DF29C6N
β Drop-Inβ In Stock
$175 / Unit
View Datasheet βEP2AGX45DF29I5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$318 / Unit
View Datasheet βEP2AGX65DF29C4G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$219 / Unit
View Datasheet βEP2AGX45DF29C4G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Number of Logic Elements | 42959 |
| Number of Logic Array Blocks (LABs) | 2234 |
| Total Memory Bits | 3517440 |
| Embedded Memory | 9 Kbit blocks (M9K) |
| Number of I/O | 364 |
| Number of Transceivers | 8 (3.75 Gbps) |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Package | 780-BBGA, FC-FBGA (29 mm) |
| Operating Temperature | 0C to +85C (Commercial, 'C' suffix) |
| Speed Grade | 4 |
| Mounting Type | Surface Mount |
| Configuration Memory | AES 256-bit encryption |
| RoHS Status | Compliant (lead-free) |
EP2AGX45DF29C4G 780-bbga, fc-fbga (29 mm) Pin Configuration Guide
Pin configuration for EP2AGX45DF29C4G (780-bbga, fc-fbga (29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45DF29C4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45DF29C4G is suitable for 7 applications: Wireless Baseband Processing, Software-Defined Radio (SDR), High-Speed Data Acquisition Systems, Broadcast Video Processing, Industrial Machine Vision, Serial Connectivity Aggregation, Medical Imaging Systems.
Wireless Baseband Processing
The EP2AGX45DF29C4G's 42,959 logic elements, integrated 3.75 Gbps transceivers, and 364 user I/O pins make it well suited for wireless baseband signal processing. The 18x18 multipliers and DSP blocks handle uplink/downlink channelisation while the transceivers connect directly to CPRI/OBSAI fronthaul interfaces. Placed on a baseband card with external RF front-end and ADC/DAC companions, it supports standards like LTE and WiMAX. The 0.9 V core supply keeps per-channel power low, and the F29 FCBGA footprint enables compact radio card layouts. Industrial-grade variants should be considered for outdoor base-station deployments.
Recommended
Software-Defined Radio (SDR)
The EP2AGX45DF29C4G enables wide-bandwidth software-defined radio platforms where the FPGA performs real-time digital downconversion, filtering, and modulation. Its 3,517,440 bits of embedded memory buffer IQ samples, while the transceiver channels interface to ADC/DAC companion parts such as the AD9122 or AD9680. Configured with the F29 FCBGA footprint, the design achieves deterministic latency needed for multi-antenna MIMO. AES 256-bit configuration encryption protects waveform IP, and Quartus II DSP Builder accelerates model-based design.
Recommended
High-Speed Data Acquisition Systems
For multi-channel data acquisition, the EP2AGX45DF29C4G interfaces to high-speed ADCs over LVDS or JESD204-style serial links, with up to 8 transceivers at 3.75 Gbps for aggregation. The 364 user I/O can be split between ADC/DAC data buses, external memory interfaces (DDR2/DDR3 controllers), and host PCIe Gen1 links. Designers place the FPGA between the analog front-end and a host CPU, performing real-time decimation and triggering. The 780-ball FCBGA package provides ample signal density for fan-out to multiple ADC channels.
Recommended
Broadcast Video Processing
Broadcast video routers, multiviewers, and format converters benefit from the EP2AGX45DF29C4G's high I/O count and transceiver bandwidth. The device handles SDI (SMPTE 259M/292M/424M) streams at 270 Mbps to 2.97 Gbps directly through its transceivers, supporting up to 8 simultaneous HD-SDI or 3G-SDI channels. Embedded memory buffers active picture data, and the FPGA performs scaling, color-space conversion, and genlocking. Industrial temperature variants extend deployment to production studio environments.
Recommended
Industrial Machine Vision
Factory automation line-scan and area-scan cameras use the EP2AGX45DF29C4G to aggregate image data from multiple sensors and run real-time preprocessing. The 364 I/O interface to Camera Link, CoaXPress, or GigE Vision sources, while 8 transceivers at 3.75 Gbps support CoaXPress 1.x aggregation. The 40 nm process keeps power low for fanless industrial PCs, and the commercial temperature grade (0-85 C) suits most factory floor installations. The hard PCIe Gen1 IP block simplifies host interface integration.
Recommended
Serial Connectivity Aggregation
The EP2AGX45DF29C4G aggregates multiple serial protocols - Gigabit Ethernet, SATA, USB 2.0, and PCI Express Gen1 - into a unified backplane interface. Up to 8 transceivers at 3.75 Gbps handle several protocols simultaneously, with the FPGA implementing MAC/PHY bridging and traffic shaping. Placed between line cards and a switch fabric, the device provides protocol-agnostic aggregation in storage, telecom, and aerospace systems. The F29 footprint supports dense backplane designs with controlled-impedance routing.
Recommended
Medical Imaging Systems
Ultrasound and endoscopy imaging platforms use the EP2AGX45DF29C4G for beamforming, Doppler processing, and image reconstruction. The DSP blocks handle 18x18 multiplication for FIR and Hilbert transform operations, while embedded memory buffers beamformed data. The 0.9 V core voltage keeps thermal dissipation manageable in cart-based portable systems. Designers pair the FPGA with multi-channel ADC front-ends and DDR2/DDR3 frame buffers. The commercial temperature grade suits indoor clinical environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45DF29C4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45DF29C3N | EP2AGX45DF29C5N | EP2AGX45DF29C6N | EP2AGX45DF29I5N | EP2AGX65DF29C4G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FCBGA (F29) | 780-FCBGA (F29) - same | 780-FCBGA (F29) - same | 780-FCBGA (F29) - same | 780-FCBGA (F29) - same | 780-FCBGA (F29) - same |
| Logic Elements | 42959 | 42959 | 42959 | 42959 | 42959 | 66000 |
| Speed Grade | 4 | 3 (slower) | 5 (faster) | 6 (fastest) | 5 (industrial) | 4 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Total Memory Bits | 3517440 | 3517440 | 3517440 | 3517440 | 3517440 | 5248000 |
| User I/O Count | 364 | 364 | 364 | 364 | 364 | 364 |
| Transceiver Count (max) | 8 (3.75 Gbps) | 8 (3.75 Gbps) | 8 (3.75 Gbps) | 8 (3.75 Gbps) | 8 (3.75 Gbps) | 8 (3.75 Gbps) |
Key Differentiators
- Faster speed grade available in same package (vs EP2AGX45DF29C6N)
- Industrial temperature range option in same package (vs EP2AGX45DF29I5N)
- Higher logic density in same footprint (vs EP2AGX65DF29C4G)
- Hard PCIe Gen1 controller (vs Xilinx Kintex-7 FPGA family)
Design Notes
The 780-ball FCBGA package relies on PCB thermal vias and bottom-side airflow for heat dissipation. Designers should allocate at least 6x6 thermal via arrays under the central die region with 0.3 mm drill, 1.0 mm pitch, plugged on the bottom for BGA assembly. Estimated: at typical SDR use (0.9 V core, 60 percent toggle rate), the device dissipates 4-6 W, requiring 200 LFM minimum airflow to stay below the 100 C junction limit.
Power sequencing must follow Intel's Arria II GX handbook: VCCINT (0.9 V core) ramps before or simultaneously with VCCPD (3.0 V), and VCCAUX (2.5 V) must be present before configuration. A power-on reset supervisor such as the LTC3025 or TPS3808 enforces sequencing. Use a dedicated LDO for each rail to avoid current spikes during configuration; a shared buck converter between VCCINT and VCCAUX risks latch-up at startup.
The F29 780-ball FCBGA requires a high-density interconnect stack-up with 0.4 mm ball pitch. Use a 6 or 8-layer PCB with 50 ohm controlled-impedance traces for the transceiver channels, and route differential pairs with 100 ohm differential impedance. Escape routing should be on inner layers with microvia-in-pad technology for breakout; surface-layer escape consumes 4-5 routing channels per row. Refer to the Arria II GX PCB Design Guidelines for via pattern recommendations.
Transceiver channels require AC-coupling capacitors (0.01 uF) at both ends of the serial link, with placement within 4 mm of the FPGA balls. Match trace lengths within 5 mils for differential pairs and use length-tuning serpents before the connector. Reference the Arria II GX Transceiver User Guide for TX pre-emphasis and RX equalisation settings; these typically require per-channel tuning to compensate for backplane loss.
Do not power up the FPGA without a valid configuration file, or the I/O pins stay in high-Z and may cause contention. Ensure the configuration flash (EPCS device) is sized correctly - the 45K Arria II GX typically requires 16 Mbit minimum. Also avoid mixing 3.0 V and 3.3 V I/O standards on the same bank, as VCCIO must be uniform per bank. Finally, reserve JTAG pins for boundary-scan access even when not using JTAG configuration.
Compliance Information
RoHS compliant per distributor listings and Intel product page. The 'G' suffix in C4G confirms lead-free assembly. AEC-Q100 not applicable - this is a commercial-grade FPGA; use the I5N variant for industrial temperature or consider automotive-qualified Cyclone V devices for vehicle applications.
