EP2AGX45DF29C3N - 45K LE Arria II GX FPGA, 6.375G Transceiver | Altera
MPN: EP2AGX45DF29C3N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $228.5 | $2,285.00 |
| 100 | $205.75 | $20,575.00 |
| 250 | $192.3 | $48,075.00 |
| 500 | $178 | $89,000.00 |
EP2AGX45DF29C3N Overview
Arria II GX FPGAs belong to the broader Arria II mid-range programmable logic family (hypernym: FPGA -> programmable logic device -> programmable logic -> semiconductor IC), targeting applications between the low-power Cyclone and high-performance Stratix families. The GX sub-family specifically adds 6.375 Gbps multi-gigabit transceivers and PCI Express hard IP blocks, eliminating the need for external PHY chips in serial interface designs.
Key features of the EP2AGX45DF29C3N include 8 full-duplex transceiver channels supporting CPRI, OBSAI, PCIe Gen1/Gen2, Serial RapidIO, XAUI, and CEI-6G protocols; integrated PCI Express hard IP (Gen1 x1/x2/x4 and Gen2 x1/x2/x4); up to 364 user I/Os (3.3V LVDS/LVCMOS/PCI/SSTL); 6 PLLs; 36 embedded 18x18 multipliers; and configuration via fast passive parallel (FPP) or active serial (AS) modes. The device is built on a 40nm process node.
The C3N suffix denotes the commercial speed grade (C3) and lead-free / Pb-free packaging. The DF29 package is a 29mm x 29mm 780-ball flip-chip BGA with 1.0mm pitch, optimized for high-speed signal integrity on multi-gigabit serial links. Operating junction temperature range for the commercial C3 grade is 0C to 85C, while I3 (industrial) versions extend to -40C to +100C.
Typical applications include wireless baseband processing with CPRI/OBSAI fronthaul, broadcast video transport (SDI/HD-SDI/3G-SDI), PCI Express endpoint and root complex cards, Serial RapidIO bridges for DSP clusters, and 10G Ethernet (XAUI) aggregation switches. The integrated hard IP significantly reduces logic and memory utilization that would otherwise be consumed by soft PHY implementations.
When designing with the EP2AGX45DF29C3N, attention must be paid to transceiver channel placement (GX channels have fixed pin assignments per package), reference clock routing, and power distribution. Altera (now Intel) recommends the Quartus II 12.0+ or Quartus Prime design suite for synthesis, place-and-route, and timing closure. The 1.0V core VCC, 1.5V/1.8V/2.5V/3.3V VCCIO rails, and analog transceiver supplies require careful decoupling.
This page synthesizes distributor pricing, drop-in Altera/Intel Arria II GX variants, and practical PCB/design notes not found in the standalone datasheet - a one-stop engineering reference for procurement and design-in decisions.
Drop-in alternatives for EP2AGX45DF29C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45DF29C3N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX45DF29C6N
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View Datasheet βEP2AGX45DF29C4N
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View Datasheet βEP2AGX45DF29C5N
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View Datasheet βEP2AGX45DF29I3N
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View Datasheet βEP2AGX45DF29I5N
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$318 / Unit
View Datasheet βEP2AGX45DF29C6G
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$121.75 / Unit
View Datasheet βEP2AGX45DF29C3N Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements (LEs) | approximately 45,000 |
| Embedded Memory (M9K blocks) | 1,678 Kbits total |
| Embedded 18x18 Multipliers | 36 |
| Transceiver Channels | 8 (up to 6.375 Gbps) |
| PCIe Hard IP | Yes (Gen1/Gen2, x1/x2/x4) |
| PLLs | 6 |
| User I/O Count | 364 (maximum) |
| Package | FBGA-780 (DF29), 29x29 mm, 1.0 mm pitch |
| Speed Grade | C3 (commercial) |
| Process Node | 40 nm |
| Operating Temperature | 0C to 85C (commercial C-grade) |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Modes | FPP, AS, PS, JTAG |
EP2AGX45DF29C3N fbga-780 (df29), 29x29 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2AGX45DF29C3N (fbga-780 (df29), 29x29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45DF29C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45DF29C3N is suitable for 7 applications: Wireless Baseband with CPRI/OBSAI Fronthaul, Broadcast Video Transport (3G-SDI / HD-SDI), PCI Express Endpoint / Root Complex Cards, Serial RapidIO Bridge / DSP Cluster, 10 Gigabit Ethernet Aggregation Switch, Software Defined Radio Front-End Processor, Industrial Camera Image Processing.
Wireless Baseband with CPRI/OBSAI Fronthaul
The EP2AGX45DF29C3N's 8 transceivers at 6.375 Gbps are ideal for CPRI and OBSAI fronthaul links in 4G LTE and small-cell base stations. With 45K LEs and 36 18x18 multipliers, the device handles baseband IQ processing, FFT/iFFT, and channel filtering while the hard IP offloads CPRI/OBSAI framing, reducing soft logic utilization by ~30%. The integrated PCIe Gen2 x4 hard IP connects to a host baseband controller. The commercial C3 grade suits indoor BTS and small-cell deployments where ambient temperature stays below 85C. Compared to discrete PHY-plus-FPGA solutions, the integrated transceivers cut PCB area by ~40% and BOM cost by ~25%.
Recommended
Broadcast Video Transport (3G-SDI / HD-SDI)
The EP2AGX45DF29C3N is widely deployed in broadcast video routers, format converters, and SDI embedder/de-embedder cards. The 6.375 Gbps transceivers directly drive 3G-SDI (SMPTE 424M) at 2.97 Gbps with margin for 6G-SDI uprates. 45K LEs accommodate multi-channel SDI processing including ANC packet handling, audio embedding, and genlocking. The 1,678 Kbits of M9K memory buffers 10-bit 4:2:2 video lines without external SDRAM in many designs. The 780-ball DF29 FBGA package supports controlled-impedance routing for SDI outputs at 75 ohms. Compared to ASSP video cross-points, the FPGA enables in-field protocol upgrades and custom ancillary data processing.
Recommended
PCI Express Endpoint / Root Complex Cards
The EP2AGX45DF29C3N's integrated PCIe Gen1/Gen2 hard IP supports x1, x2, and x4 lane configurations with compliance to the PCI Express 2.0 specification. The hard IP block saves ~15K LEs and 8 transceivers compared to soft PCIe implementations, freeing logic for application-level functions. Combined with the 8x6.375 Gbps transceivers, the device can simultaneously run a PCIe x4 link to a host CPU plus auxiliary serial links (XAUI to a network processor, CPRI to a remote radio head). 1,678 Kbits of embedded memory buffer PCIe Transaction Layer packets. C3 speed grade is sufficient for Gen2 x4 at 5 Gbps in most designs; C6 is recommended for Gen2 x4 with full payload at maximum payload size.
Recommended
Serial RapidIO Bridge / DSP Cluster
The EP2AGX45DF29C3N serves as a Serial RapidIO (SRIO) bridge between DSP clusters in wireless base stations, radar processing, and high-performance embedded computing. The hard SRIO IP at 1.25/2.5/3.125 Gbps per lane with 8 transceivers provides up to 25 Gbps aggregate bandwidth. The 36 embedded 18x18 multipliers and ~45K LEs enable moderate-complexity DSP such as FIR filtering, FFT, and beamforming preprocessing. The 780-ball DF29 FBGA supports matched-length SRIO routing. Compared to pure software SRIO stacks on ASSPs, the FPGA-based bridge achieves 10-100x lower latency, critical for real-time DSP pipelines.
Recommended
10 Gigabit Ethernet Aggregation Switch
The EP2AGX45DF29C3N supports XAUI (4x3.125 Gbps) and 10GBASE-R via soft IP across its 8 transceivers, enabling compact 10G aggregation switches, network interface cards, and protocol converters. The integrated transceivers drive SFP+ optical modules directly via the 6.375 Gbps serial interface with appropriate AC-coupling. 1,678 Kbits of M9K memory buffers Ethernet frames while the hard PCIe IP provides host connectivity for control plane or DMA. The 780-ball DF29 FBGA package enables dense PCB layouts with controlled 100-ohm differential routing. Compared to multi-chip ASSP+PHY solutions, the integrated approach reduces component count by ~50%.
Recommended
Software Defined Radio Front-End Processor
The EP2AGX45DF29C3N is a strong fit for software-defined radio (SDR) front-end processing in defense, test-and-measurement, and public-safety radio applications. The 8 transceivers interface directly with wideband ADC/DAC pairs at JESD204B or LVDS, while 45K LEs and 36 multipliers implement DDC/DUC, channelizers, and modulation/demodulation. The integrated PCIe hard IP streams digitized IF/baseband to a host processor for higher-layer processing. Commercial C3 grade suits laboratory and fixed installations; choose the I5 industrial variant for vehicular or airborne SDR platforms. Compared to ASSP SDR chipsets, the FPGA enables proprietary waveform development and field upgrades without silicon respin.
Recommended
Industrial Camera Image Processing
The EP2AGX45DF29C3N is used in high-speed industrial camera and machine vision systems where 6.375 Gbps transceivers carry CoaXPress, Camera Link, or proprietary serial sensor data at multi-megapixel rates. 45K LEs handle Bayer demosaicing, color correction, and basic compression pipelines for line-scan and area-scan cameras. The PCIe Gen2 hard IP streams processed frames to a host PC at >1 GB/s. The commercial C3 grade is appropriate for factory-floor cameras with controlled ambient temperatures. Compared to DSP+FPGA split architectures, the integrated Arria II GX reduces board space, power, and BOM cost for sub-200W camera designs.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45DF29C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45DF29C6N | EP2AGX45DF29C4N | EP2AGX45DF29C5N | EP2AGX45DF29I3N | EP2AGX45DF29I5N | EP2AGX45DF29C6G |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-780 (DF29) | FBGA-780 (DF29) - same | FBGA-780 (DF29) - same | FBGA-780 (DF29) - same | FBGA-780 (DF29) - same | FBGA-780 (DF29) - same | FBGA-780 (DF29) - same |
| Speed Grade | C3 (commercial) | C6 (faster) | C4 | C5 | I3 (industrial) | I5 (industrial, fast) | C6 |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial |
| Logic Elements | ~45K LEs | ~45K LEs | ~45K LEs | ~45K LEs | ~45K LEs | ~45K LEs | ~45K LEs |
| Transceiver Channels | 8 (6.375 Gbps) | 8 (6.375 Gbps) | 8 (6.375 Gbps) | 8 (6.375 Gbps) | 8 (6.375 Gbps) | 8 (6.375 Gbps) | 8 (6.375 Gbps) |
| PCIe Hard IP | Yes (Gen1/Gen2) | Yes | Yes | Yes | Yes | Yes | Yes |
| RoHS / Lead-Free | Yes (N suffix) | Yes | Yes | Yes | Yes | Yes | Yes |
| Pin-to-Pin Compatible | Yes (reference) | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in |
Key Differentiators
- Drop-in speed grade upgrade path within same FBGA-780 DF29 package (vs EP2AGX45DF29C6N)
- Industrial temperature variant available in same package (vs EP2AGX45DF29I3N)
- Integrated PCIe Gen2 hard IP saves ~15K LEs (vs Soft PCIe IP on competing FPGAs)
Design Notes
Estimated: The EP2AGX45DF29C3N requires multiple power rails - core VCC (~1.0V), VCCPD (~2.5V/3.3V for configuration banks), VCCIO (1.5V/1.8V/2.5V/3.3V per I/O bank), and analog transceiver supplies VCCA (~2.5V) and VCCP (~1.0V). At typical utilization (~70% LEs, all 8 transceivers active at 5 Gbps), total power consumption is estimated at 6-10W. Decoupling requires 0.1uF X7R ceramics within 100 mils of every power pin plus bulk 100-470uF polymer tantalum or aluminum polymer caps on each rail. Power sequencing: VCC must precede VCCIO and VCCA within 100ms per Altera handbook. Use a dedicated PMIC with power-good sequencing rather than discrete LDOs.
The DF29 780-ball FBGA at 1.0mm pitch requires 0.5mm laser-drilled microvias on a high-density-interconnect (HDI) PCB stack-up - typically 8-12 layers with 1oz copper outer / 0.5oz inner. BGA escape routing should use dog-bone fan-out or via-in-pad for inner rows. Transceiver channels require 100-ohm differential routing with intra-pair skew < 1 ps/mm and length matching to within 5 mils across lanes. Reference clocks need 50-ohm single-ended routing with isolated ground guard traces. Altera's AN 522 and AN 530 reference designs provide exact stack-up and routing guidelines.
Transceiver signal integrity at 6.375 Gbps requires a continuous reference plane under all transceiver lanes, AC-coupling capacitors (0.01uF X7R) at the transmitter output, and pre-emphasis / de-emphasis settings tuned via the Transceiver Toolkit in Quartus. Loss budget for FR-4 is ~0.3 dB/inch at 3 GHz - keep traces < 6 inches total from FPGA to connector. Use IBIS-AMI models for channel simulation with the Quartus Signal Tap logic analyzer for in-system verification.
Estimated: The DF29 package has a theta_JA of approximately 12 C/W with sufficient PCB copper (4-layer, 1oz outer, with thermal via array under the BGA). At 8W total power, junction-to-ambient rise is ~96C above ambient. For commercial C3 grade (max 85C junction), ambient must stay below -11C, which mandates active cooling (heatsink + 100 LFM airflow or larger copper area). For designs approaching thermal limits, derate to I3 grade or add a small 20mm heatsink with thermal interface material.
Three common pitfalls: (1) Do not leave unused transceiver channels floating - they must be powered down via the Quartus assignment or left connected to a powered-down reference clock. (2) Configuration mode pins MSEL[2:0] must be set correctly for the chosen configuration scheme (AS, FPP, PS, JTAG); wrong settings prevent bitstream loading. (3) The PCIe hard IP requires a 100 MHz reference clock within +/-300 ppm; if the reference is shared with transceivers, careful isolation is needed.
Compliance Information
RoHS compliant per N suffix; lead-free FBGA packaging. Not AEC-Q100 qualified (commercial/industrial temperature only). Halogen-free status not explicitly stated in available data.
