EP2AGZ225FF35C4G - 554-I/O FPGA | Intel | Embedded Systems
MPN: EP2AGZ225FF35C4G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2AGZ225FF35C4G Overview
An FPGA is a semiconductor device containing programmable logic blocks, interconnect resources, and configurable I/O. Engineers use an FPGA when a design needs parallel processing, custom timing, rapid interface adaptation, or deterministic hardware execution. In the system hierarchy, an FPGA is a programmable logic device, while an FPGA is categorized as a programmable semiconductor integrated circuit alongside application-specific integrated circuits and digital signal processors.
The verified product listings identify the device as a field-programmable gate array and specifically report 554 I/O. The package description identifies 1152FBGA, while the order code and distributor listings identify the device as an Intel/Altera FPGA. These details make the part suitable for designs that need many external connections or several buses and peripheral interfaces. The verified web data does not expose logic-element count, memory resources, transceiver count, operating temperature, speed grade, or voltage ratings, so those parameters remain unavailable rather than being inferred.
The device can implement custom control, interface, and datapath functions after configuration. Its programmable architecture allows a board design to connect multiple digital domains while applying timing constraints and implementing protocol-specific logic. For hardware teams, the main engineering task is to validate the complete device configuration against the target board, power system, clocking scheme, pin assignment, and supported configuration method before release to production.
Typical applications include industrial automation controllers, communications equipment, test and measurement systems, embedded computing platforms, and high-density digital interface designs. The 554-I/O resource is particularly relevant where the FPGA must bridge processors, memory devices, sensors, converters, or communications peripherals. The 1152FBGA package is suitable for high-density PCBs but requires controlled assembly and careful signal-integrity review.
Designers should confirm all electrical limits, supported I/O standards, configuration requirements, thermal characteristics, and package land-pattern details from the manufacturer documentation. This page preserves the verified MPN, package, I/O, pricing, availability, and sourcing information while clearly marking unsupported specifications as data needed.
Drop-in alternatives for EP2AGZ225FF35C4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ225FF35C4G (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Transceivers, Package Type.
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EP2AGZ225FF35C4G Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Manufacturer | Intel |
| Product Family | FPGA |
| User I/O | 554 I/O |
| Package | 1152FBGA |
| Package Type | Fine-pitch ball grid array |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
EP2AGZ225FF35C4G fine-pitch ball grid array Pin Configuration Guide
Pin configuration for EP2AGZ225FF35C4G (fine-pitch ball grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ225FF35C4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ225FF35C4G is suitable for 6 applications: Industrial Automation Controllers, Communications Equipment, Test and Measurement Systems, High-Density Embedded Computing, Digital Signal Interface Aggregation, Embedded Protocol Bridge.
Industrial Automation Controllers
EP2AGZ225FF35C4G can serve as a programmable logic platform for industrial automation controllers requiring parallel processing and many digital connections. The verified product data identifies 554 I/O, which is useful for connecting sensors, actuators, encoders, motor-control peripherals, safety interfaces, and communication bridges. An FPGA can implement deterministic state machines, protocol conversion, timing control, and signal conditioning without relying entirely on a processor. The 1152FBGA package supports a high-density board implementation, but industrial qualification requires confirmation of temperature grade, supply limits, I/O standards, and long-term reliability before design approval.
Recommended
Communications Equipment
EP2AGZ225FF35C4G is potentially suitable for communications equipment that needs custom packet processing, protocol adaptation, clock distribution, or parallel data handling. The verified 554-I/O count provides a substantial interface envelope, while FPGA programmability allows the hardware to support changing protocol requirements. The device could bridge processors, network interfaces, converters, and management devices in a line card or embedded system. The supplied data does not confirm transceiver count, supported protocols, maximum clock rate, or signal-integrity limits. Those parameters must be verified in the official datasheet and validated against the selected PCB stack-up and power distribution network.
Recommended
Test and Measurement Systems
EP2AGZ225FF35C4G can be considered for test and measurement systems that require configurable acquisition sequencing, waveform control, timing generation, and interface aggregation. Its FPGA structure supports hardware-timed operations and parallel datapaths, while the verified 554-I/O resource can connect multiple instruments, converters, and control channels. The 1152FBGA package permits a compact high-density implementation, but designers must still verify signal integrity, power integrity, thermal behavior, and supported I/O standards. The supplied sources do not provide logic-element count, embedded memory, DSP resources, or performance limits, so suitability depends on obtaining the manufacturer specification and confirming timing closure in the target design.
Recommended
High-Density Embedded Computing
EP2AGZ225FF35C4G can function as a configurable processing and interface component in high-density embedded computing platforms. The verified 554-I/O count is relevant to systems that must connect processors, memories, converters, sensors, and communications peripherals while maintaining deterministic hardware execution. FPGA logic can implement memory controllers, protocol bridges, custom accelerators, and system-monitoring functions. However, the available data does not confirm the deviceβs logic resources, embedded memory, transceiver capability, operating temperature, or supported configuration method. These missing values are critical for system partitioning and should be resolved through official documentation before schematic capture, PCB layout, or production release.
Recommended
Digital Signal Interface Aggregation
EP2AGZ225FF35C4G may be used to aggregate and process multiple digital signal interfaces in embedded or industrial systems. The verified FPGA classification and 554-I/O count support designs that require many channel-oriented connections, custom formatting, buffering, and real-time routing. The device can be programmed to perform interface adaptation and fixed-latency processing while a host processor handles higher-level functions. The package is identified as 1152FBGA, so board implementation must address fine-pitch BGA escape routing and controlled assembly. The supplied data does not establish maximum data rates or supported I/O standards, so electrical and timing validation remains mandatory.
Recommended
Embedded Protocol Bridge
EP2AGZ225FF35C4G can be evaluated as the programmable bridge between processors, converters, memories, sensors, and custom peripherals. Its FPGA architecture allows protocol conversion, traffic shaping, error handling, and fixed-latency control to be implemented in hardware. The verified 554-I/O count is valuable when a system must expose many independent channels, while the 1152FBGA package supports high connection density. Before adoption, confirm the exact ball assignments, configuration interface, supported I/O standards, clocking resources, power rails, and thermal limits. Because the supplied web data omits those details, this application should proceed only after official device documentation and board-level qualification.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ225FF35C4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ225FF35C3G | EP2AGX95EF35C4G | EP2AGX95EF35C5G | EP2AGX65EF29C4G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Device Type | FPGA | FPGA | FPGA | FPGA | FPGA |
Key Differentiators
- Verified high-density I/O count (vs EP2AGX95EF35C4G)
- Verified 1152FBGA package identity (vs EP2AGX95EF35C4G)
- Exact-ordering-code research baseline (vs EP2AGZ225FF35C3G)
Design Notes
Use the official 1152FBGA land pattern and verify every ball assignment before routing. The verified data establishes the package identity but does not provide dimensions, pitch, ball material, or escape recommendations. Confirm the exact orderable MPN, package code, and package revision with Intel documentation. Control the PCB stack-up, via-in-pad policy, solder-mask definition, and BGA escape strategy as an integrated design. Do not create a footprint from the MPN alone, and validate the final land pattern with the assembly house and the manufacturer package drawing.
The supplied data does not specify core, I/O, auxiliary, or transceiver supply voltages for EP2AGZ225FF35C4G, so the power tree must not be estimated. Obtain the official recommended operating conditions, power sequencing requirements, allowed tolerances, current limits, and decoupling guidance before schematic capture. Use a controlled ramp strategy and local low-impedance decoupling at the relevant supply balls. Estimate only after the manufacturerβs power-consumption data is available. Validate rail voltage, ripple, transient response, and inrush behavior on prototypes, especially when many of the 554 I/O are active simultaneously.
High-density BGA routing requires early planning for signal integrity and power integrity. Maintain continuous reference planes, controlled impedance for high-speed interfaces, short return paths, and appropriate spacing between sensitive clocks and fast I/O. The supplied sources do not state supported I/O standards or maximum clock rates, so those values are data needed. After official limits are obtained, assign pin locations with constraints, minimize simultaneous switching noise, and simulate the relevant channels. Review differential-pair geometry, via transitions, connector escapes, and termination choices before fabrication.
The FPGAβs 554-I/O count makes signal-integrity management important even when individual channels are moderate speed. Identify the fastest clocks, differential pairs, memory interfaces, and external connectors, then place the FPGA and associated components using the official pinout. Confirm whether the selected order code supports the required I/O voltage and standard. Use controlled-impedance routing, proper termination, and crosstalk-aware spacing where required. The available data does not permit an exact timing or signal-rate calculation, so do not quote a maximum frequency until the official device specifications and board implementation are validated.
Compliance Information
The supplied verified data does not provide compliance declarations for this exact MPN. AEC-Q100 applicability is not established by the provided sources.
