EP2AGZ300HF40I4G - Arria II GZ 289K LE FPGA FCBGA-1517 | Intel
MPN: EP2AGZ300HF40I4G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2720 | $27,200.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2410 | $1,205,000.00 |
| 1,000 | $2260 | $2,260,000.00 |
EP2AGZ300HF40I4G Overview
A field-programmable gate array (FPGA) is a class of programmable logic device (PLD) belonging to the larger semiconductor family of integrated circuits. Within the system hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as reconfigurable digital signal processing engines. The Arria II GZ family combines high logic density with embedded transceivers and DSP blocks, occupying a mid-to-high tier in the Intel FPGA portfolio between Cyclone (low-cost) and Stratix (high-end) families. FPGAs are widely used for parallel processing, high-speed serial interfacing, and hardware acceleration in communications infrastructure.
Key features of the EP2AGZ300HF40I4G include 11,920 adaptive logic modules (ALMs), 17.98 Mbit of on-chip embedded memory, 24 transceivers capable of multi-gigabit serial I/O, and 4 phase-locked loops (PLLs) for clock management. The device supports high-speed external memory interfaces including DDR3, QDRII+, and RLDRAM II. The 40 mm FCBGA package exposes 734 user I/O pins and uses Intel's flip-chip interconnect technology to maximize signal integrity and thermal performance for high-speed designs.
Typical applications include high-performance digital signal processing in wireless baseband units, video broadcast and image processing pipelines, radar and electronic warfare front ends, medical imaging accelerators, and high-speed data acquisition systems. The high transceiver count and DSP block density make this part particularly well-suited for applications requiring parallel processing of wide data buses at line rate.
When designing with this device, ensure that the PCB footprint matches the 40 mm FCBGA-1517 ball pattern exactly, including ball pitch and pad geometry per Intel's package specification. Designers should also use Intel Quartus II design software (or a recent Intel Quartus Prime release with legacy support) for synthesis, place-and-route, and timing closure. Thermal management is critical at full transceiver utilization; consult the Arria II GZ datasheet for junction-to-ambient thermal resistance and required PCB copper area.
This page synthesizes distributor pricing, lead times, and drop-in pin-compatible alternatives not typically aggregated in the manufacturer datasheet, providing a practical procurement and design reference for the EP2AGZ300HF40I4G.
Drop-in alternatives for EP2AGZ300HF40I4G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300HF40I4G (same form factor and footprint) — differing in Package, RoHS Status, Operating Temperature, Embedded Memory, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGZ300HF40I4
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$1925 / Unit
View Datasheet →EP2AGZ300HF40I3G
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View Datasheet →EP2AGZ300HF40C4G
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View Datasheet →EP2AGZ300HF40C3G
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View Datasheet →EP2AGZ300FF35I4G
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View Datasheet →EP2AGZ300HF40I4G Maximum Ratings & Electrical Characteristics
| Series | Arria II GZ (EP2AGZ300) |
| Logic Elements (LE) | 289,000 |
| Adaptive Logic Modules (ALM) | 11,920 |
| Embedded Memory | 17.98 Mbit |
| User I/O Pins | 734 |
| Number of Logic Array Blocks (LAB) | 11,920 |
| Package | 1517-BBGA, FCBGA (HF40, 40 mm) |
| Speed Grade | I4 |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| Transceivers | 24 multi-gigabit transceivers |
| PLL Count | 4 |
| RoHS Status | Compliant (Pb-free, G suffix) |
| Process Technology | 40 nm TSMC |
EP2AGZ300HF40I4G 1517-bbga, fcbga (hf40, 40 mm) Pin Configuration Guide
Pin configuration for EP2AGZ300HF40I4G (1517-bbga, fcbga (hf40, 40 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300HF40I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300HF40I4G is suitable for 6 applications: Wireless Baseband Signal Processing, Video Broadcast and Image Processing Pipelines, Radar and Electronic Warfare Front Ends, Medical Imaging Accelerators, High-Speed Data Acquisition Systems, Industrial Automation and Machine Vision.
Wireless Baseband Signal Processing
The EP2AGZ300HF40I4G is well-suited for wireless baseband signal processing because it combines 289,000 logic elements and 17.98 Mbit of embedded memory, which is sufficient to implement multiple parallel LTE or 5G NR physical-layer channels. Its 24 multi-gigabit transceivers handle CPRI or OBSAI fronthaul links to remote radio units at line rate. The industrial -40C to +100C junction rating allows deployment in outdoor base stations and small cells. Power consumption is moderate for the logic density tier, making it a cost-effective alternative to high-end Stratix V parts for sub-6 GHz baseband designs.
Recommended
Video Broadcast and Image Processing Pipelines
The 17.98 Mbit of embedded block RAM in the EP2AGZ300HF40I4G provides line buffers and frame stores for HD and 4K video processing, while the 11,920 ALMs implement motion estimation, deinterlacing, and color-space conversion in real time. The 734 user I/O pins connect directly to multiple high-speed parallel video ADCs and DACs. The industrial temperature rating supports broadcast equipment in uncooled equipment racks. The I4 speed grade targets 200 MHz DDR3 interfaces, which is sufficient for 4K@60 video data rates.
Recommended
Radar and Electronic Warfare Front Ends
Defense radar systems use the EP2AGZ300HF40I4G for pulse compression, digital beamforming, and moving target indication (MTI) processing. The 24 transceivers aggregate multiple phased-array antenna channels at 3.125 Gbps or higher. The industrial temperature rating supports ground-mobile and naval platforms. The high ALM-to-memory ratio is well-matched to FFT-based signal processing and adaptive beamforming algorithms. Designers can implement the entire radar signal-processing chain on a single FPGA, simplifying system architecture and reducing latency.
Recommended
Medical Imaging Accelerators
The EP2AGZ300HF40I4G accelerates CT, MRI, and ultrasound image reconstruction pipelines by mapping the back-projection or iterative reconstruction algorithm directly to FPGA hardware. Its 17.98 Mbit embedded memory holds projection data, while the 289K logic elements implement the parallel arithmetic units. The industrial temperature rating supports imaging carts and OR equipment that may experience thermal variation. Single-FPGA image reconstruction reduces system cost and power compared to GPU or DSP farms for mid-range imaging modalities.
Recommended
High-Speed Data Acquisition Systems
Test and measurement data acquisition systems use the EP2AGZ300HF40I4G to capture, buffer, and pre-process multiple Gsps ADC channels in parallel. The 734 user I/O pins connect to LVDS or DDR LVDS ADC data buses at hundreds of MHz, while the 17.98 Mbit of embedded memory holds deep pre-trigger capture buffers. The 24 transceivers stream the captured data to host processors or storage arrays via 10 Gigabit Ethernet or PCIe over dedicated links. The I4 speed grade supports the timing closure required at 200 MHz fabric clock rates with complex state machines.
Recommended
Industrial Automation and Machine Vision
Factory automation systems use the EP2AGZ300HF40I4G to run multi-camera machine vision pipelines in real time, with each camera stream processed by a parallel hardware engine. The 289K logic elements implement image preprocessing, edge detection, and pattern matching without offloading to a host CPU. The 734 user I/O pins drive GigE Vision, CoaXPress, or Camera Link interfaces directly. The -40C to +100C industrial temperature rating supports deployment in uncooled factory floors. The mature 40 nm TSMC process provides long-term availability for industrial lifecycle programs.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300HF40I4G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ300HF40I4 | EP2AGZ300HF40I3G | EP2AGZ300HF40C4G | EP2AGZ300HF40C3G | EP2AGZ300FF35I4G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-BBGA, FCBGA (HF40, 40 mm) | 1517-BBGA, FCBGA (HF40, 40 mm) - same | 1517-BBGA, FCBGA (HF40, 40 mm) - same | 1517-BBGA, FCBGA (HF40, 40 mm) - same | 1517-BBGA, FCBGA (HF40, 40 mm) - same | 1517-BBGA, FCBGA (FF35, 35 mm) |
| Logic Elements | 289,000 LE | 289,000 LE | 289,000 LE | 289,000 LE | 289,000 LE | 289,000 LE |
| Embedded Memory | 17.98 Mbit | 17.98 Mbit | 17.98 Mbit | 17.98 Mbit | 17.98 Mbit | 17.98 Mbit |
| User I/O Pins | 734 | 734 | 734 | 734 | 734 | 734 |
| Speed Grade | I4 | I4 | I3 (faster) | C4 | C3 (faster, commercial) | I4 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C |
| Lead-Free (G suffix) | Yes (Pb-free) | No (tin-lead) | Yes | Yes | Yes | Yes |
Key Differentiators
- Higher logic density than the EP2AGZ225 variant in the same package (vs EP2AGZ225HF40I4G)
- Industrial temperature rating for harsh-environment deployment (vs EP2AGZ300HF40C4G)
- Lead-free / RoHS-compliant terminal finish for global manufacturing (vs EP2AGZ300HF40I4)
Design Notes
At full transceiver utilization (24 channels at 3.125 Gbps) and 200 MHz core logic, the EP2AGZ300HF40I4G can dissipate 10 W to 15 W. The 40 mm FCBGA package requires substantial PCB copper area to keep the junction below 100C in industrial environments. Designers should follow the Intel Arria II GZ thermal management application note and use at least 16 thermal vias under the BGA die area connected to internal copper planes. Estimated: assuming 12 W dissipation and a typical theta_JA of 8 C/W for a properly designed 16-layer PCB, the junction-to-ambient rise is about 96C above ambient, so additional heatsinking or airflow is required for high-ambient-temperature operation.
The 1517-ball FCBGA HF40 package has a 1 mm ball pitch per the Intel package specification. Use a PCB with NSMD (non-solder-mask defined) pads and microvia-in-pad construction to ensure reliable BGA attachment. Keep all high-speed transceiver traces on the top layers with matched length tuning for 100 ohm differential impedance. Decoupling follows the Intel pin connection guidelines: 0.1 uF and 0.01 uF capacitors placed within 100 mil of every VCC pin, with bulk capacitors on the back side near the BGA.
The 24 transceivers in the EP2AGZ300HF40I4G operate up to 3.75 Gbps in the C4/I4 speed grades. Use a 4-layer stack-up with continuous ground planes immediately below the top signal layer. Avoid routing transceiver signals across plane splits; reference each high-speed differential pair to a solid ground plane within 8 mil. AC-coupling capacitors of 0.1 uF must be placed at the transmitter output. For PCIe Gen1/Gen2 implementations, the reference clock jitter must be below 100 fs RMS.
Do not assume the EP2AGZ300HF40I4G configuration memory is pre-loaded; the device requires external configuration via JTAG, AS, PS, or FPP mode at power-up. Use the Intel Quartus II / Quartus Prime programmer to generate the .pof or .sof file. A common error is failing to set the MSEL pins for the correct configuration mode; the Arria II GZ datasheet specifies the exact MSEL pull-up/pull-down resistor values for each mode. Also note that the I4 speed grade reduces maximum transceiver baud rate by approximately 15% compared to I3, so verify timing margins in your design.
Compliance Information
G suffix indicates lead-free / RoHS-compliant terminal finish per Intel/Altera datasheet. AEC-Q100 not applicable for FPGA. Halogen-free status and conflict minerals reporting: contact Intel FPGA product compliance team for current declarations.
