EP2AGZ300HF40I4N - Arria II GZ FPGA 298K LE | Altera
MPN: EP2AGZ300HF40I4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4285 | $4,285.00 |
| 10 | $3985 | $39,850.00 |
| 100 | $3595 | $359,500.00 |
| 500 | $3205 | $1,602,500.00 |
| 1,000 | $2995 | $2,995,000.00 |
EP2AGZ300HF40I4N Overview
An FPGA is a reconfigurable integrated circuit whose logic fabric can be electrically programmed after manufacturing to implement arbitrary digital logic functions. In the digital system hierarchy, FPGAs sit between application-specific standard products and full-custom ASICs, providing flexible parallel processing, high I/O counts, and rapid time-to-market. The Arria II GZ family is Altera's high-performance 40 nm FPGA series designed for bandwidth-intensive wire-speed applications, combining logic fabric with embedded memory blocks and high-pin-count packaging for system-on-chip integration.
Key differentiators of the EP2AGZ300HF40I4N include 11,920 LABs/CLBs, 298,000 logic elements, 18.85 Mbit embedded memory, and 734 user I/O terminals. The 1517-ball FCBGA package enables very wide parallel buses and fine-pitch board routing, while the industrial temperature grade supports deployment in factory, transportation, and outdoor edge equipment. The ordering code I4N denotes an industrial-grade temperature option with speed-grade 4 and lead-free/RoHS-compliant lead finish.
The device is supplied in a large square HBGA body, which DigiKey and Mouser describe as 1517-BBGA/FCBGA. This package provides excellent power distribution and signal escape capacity for dense designs. As with other Arria II GZ devices, full system performance depends on the companion Arria II Device Handbook and pin-out files, which list transceiver and memory interface resource limits for the specific speed grade.
Typical applications include high-end wired networking equipment, broadcast video processing, test-and-measurement instruments, military/aerospace signal processing, industrial vision and control, and protocol bridging. The combination of 734 I/O and 18.85 Mbit RAM makes it well suited to systems that move large data words between multiple interfaces while retaining algorithmic flexibility.
From a design standpoint, the I4N variant should be selected when your system needs a high-logic FPGA with an industrial temperature window and the moderate speed-grade 4 tuning. For prototyping, confirm printed circuit board BGA fan-out and decoupling against the Arria II GZ board design guidelines. Because pin compatibility is not guaranteed across the entire Arria II GZ density family, order the same HF40 package pin-out variant before layout is finalized.
This page combines verified distributor availability, drop-in same-family alternatives, compliance status, and practical design guidance so design engineers can evaluate the EP2AGZ300HF40I4N without repeatedly opening vendor datasheets.
Drop-in alternatives for EP2AGZ300HF40I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300HF40I4N (same form factor and footprint) — differing in Package, RoHS Status, Logic Elements (LE), Mounting Type, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGZ300HF40I4G
✅ Drop-In✓ In Stock
$2260 / Unit
View Datasheet →EP2AGZ300HF40I3N
✅ Drop-In✓ In Stock
$3820 / Unit
View Datasheet →EP2AGZ300HF40I3G
✅ Drop-In✓ In Stock
$1995 / Unit
View Datasheet →EP2AGZ300HF40C4N
✅ Drop-In✓ In Stock
$3950 / Unit
View Datasheet →EP2AGZ300HF40C3N
✅ Drop-In✓ In Stock
$3623.45 / Unit
View Datasheet →EP2AGZ300HF40I4N Maximum Ratings & Electrical Characteristics
| Series | Arria II GZ |
| Number of LABs/CLBs | 11920 |
| Number of Logic Elements/Cells | 298000 |
| Total RAM Bits | 18854912 |
| Number of User I/O | 734 |
| Package / Case | 1517-BBGA, FCBGA |
| Number of Terminals | 1517 |
| Terminal Form | BALL |
| Package Shape | SQUARE |
| Package Code | HBGA |
| Mounting Type | Surface Mount |
| RoHS Status | Lead free / RoHS Compliant |
EP2AGZ300HF40I4N hbga Pin Configuration Guide
Pin configuration for EP2AGZ300HF40I4N (hbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300HF40I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300HF40I4N is suitable for 6 applications: High-Performance Networking Equipment, Broadcast and Video Infrastructure, Military and Aerospace Signal Processing, Industrial Vision and Control, Test and Measurement Instruments, Protocol Bridging and Interface Conversion.
High-Performance Networking Equipment
The EP2AGZ300HF40I4N provides 298,000 logic elements, 18.85 Mbit RAM, and 734 user I/O in a 1517-ball FCBGA package, making it well suited for high-end routers, switches, and access-network line cards. Its large I/O count supports wide parallel interfaces, while the high logic density allows designers to implement L2/L3 forwarding, packet classification, and QoS scheduling logic in programmable fabric. The industrial temperature grade also enables deployment in outdoor or uncontrolled cabinets. Engineers should balance HSIO transceiver count and core supply requirements using the Arria II GZ handbook because these parameters determine board-level power design. When packet ordering is critical, keep high-speed state machines in dedicated DSP/ALM structures and use RAM blocks for queue buffering.
Recommended
Broadcast and Video Infrastructure
Broadcast video processing demands large frame buffers, multiple simultaneous video standards, and deterministic latency. The EP2AGZ300HF40I4N has 18,854,912 RAM bits and 734 I/O, enabling systems to handle 4K/8K video crosspoints, format conversion, scaling, and color processing. The high pin count is useful for parallel camera links and SDI/HDMI bridging. Because the part is an industrial temperature FPGA, it can survive hot machine rooms and remote production equipment. Designers should use the embedded hard memory controllers and carefully partition external DDR memory to avoid route congestion in the 1517-ball BGA. The FPGA reconfigurability lets video designers update codec or standard-specific logic without hardware redesign.
Recommended
Military and Aerospace Signal Processing
The EP2AGZ300HF40I4N is suitable for military radar, electronic warfare, communications, and avionics signal processing because it combines an industrial temperature grade with high FPGA logic density. Its 298,000 logic elements enable DSP-intensive beamforming, channelization, and FFT processing in programmable logic, while 18.85 Mbit RAM provides local data storage. The 1517-ball FCBGA package gives robust pinout for wide data converters and system interconnects. Aerospace designers must verify the exact operating temperature range and screening level against their program requirement because the verified snippet only states industrial grade. For safety-critical programs, add configuration memory protection and consider a radiation-tolerance evaluation before deployment.
Recommended
Industrial Vision and Control
Industrial machine-vision systems require high-bandwidth pixel capture, flexible image processing, and deterministic real-time control. The EP2AGZ300HF40I4N, with 734 user I/O, can capture multiple camera streams, run filtering and feature detection logic, and send control signals to actuators in parallel. Its industrial temperature rating is directly valuable for factory floors where ambient temperatures exceed basic commercial limits. The device density allows a single FPGA to replace several controllers or ASSPs, lowering BOM count. When using high-speed LVDS image buses, place I/O banks close to connectors and follow the Arria II GZ pin-out and signal-integrity recommendations. Debug interfaces such as JTAG and an embedded logic analyzer should be planned from the start.
Recommended
Test and Measurement Instruments
Oscilloscopes, logic analyzers, protocol analyzers, and signal generators need real-time acquisition and processing. The EP2AGZ300HF40I4N provides the logic capacity to implement custom triggering, deep memory management, and waveform analysis at high bandwidth. Its 1517-ball package allows many analog-to-digital converter, DAC, and front-end control connections on a single board. The embedded RAM can buffer large acquisitions before sending results to a host processor. Industrial temperature grade operation is beneficial for bench instruments that must perform over wide environmental ranges, as well as for field-portable testers. Use the FPGA's on-chip RAM and external memory controllers to create circular buffers and pre-trigger logic without taxing the host CPU.
Recommended
Protocol Bridging and Interface Conversion
The EP2AGZ300HF40I4N is often used to bridge emerging or proprietary protocols to standard interfaces. Its large logic array can implement LVDS, parallel buses, legacy TTL, and custom data planes, while the 734 I/O provide enough pins to handle multiple unidirectional and bidirectional streams. Embedded RAM supports rate-matching FIFOs, input FIFOs, and buffering between clock domains. The 1517 FCBGA package is especially useful when the bridge connects wide processor buses to high-speed serial interfaces; however, system designers should confirm the available high-speed transceivers in the chosen Arria II GZ variant. In bridge designs, ensure you use dedicated clock buffers and careful clock-domain crossing protection to avoid intermittent data loss.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300HF40I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ300HF40I4G | EP2AGZ300HF40I3N | EP2AGZ300HF40C4N | EP2AGZ300HF40C3N |
|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Brand | Altera | Altera | Altera | Altera | Altera |
| FPGA Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Number of Logic Elements/Cells | 298000 | 298000 | 298000 | 298000 | 298000 |
| Total RAM Bits | 18854912 | 18854912 | 18854912 | 18854912 | 18854912 |
| Number of User I/O | 734 | 734 | 734 | 734 | 734 |
| Temperature Grade | Industrial (I4N) | Industrial (I4G) | Industrial (I3N) | Commercial (C4N) | Commercial (C3N) |
| Speed Grade | 4 | 4 | 3 | 4 | 3 |
| RoHS Status | Lead free / RoHS Compliant | Lead free / RoHS Compliant (distributor-reported) | Lead free / RoHS Compliant (distributor-reported) | Lead free / RoHS Compliant (distributor-reported) | Lead free / RoHS Compliant (distributor-reported) |
Key Differentiators
- Large 298K logic-element density with industrial temperature grade (vs EP2AGZ300HF40C4N)
- Industrial speed grade 4 option balances cost and performance (vs EP2AGZ300HF40I3N)
- Wide supply of same-package alternatives from the same density family (vs EP2AGZ300HF40I3G)
Design Notes
The EP2AGZ300HF40I4N is a 1517-ball BGA FPGA, but not every Arria II GZ part in the site MPN list shares the same package. The HF40 package variants listed as drop-in alternatives are intended to share the same footprint and pinout family; do not substitute F35 or FH29 variants without checking the Arria II GZ pin-out files. Since the package is not in the standard 1517-pin SVG library, use the official device pin files and package drawing as the design authority.
Estimated: a high-density 298K-logic-element Arria II GZ FPGA can dissipate more than 15 W under typical full-rate networking workloads, although exact power depends on logic utilization, toggle rates, I/O standards, and transceiver usage. Use the Altera/Intel power estimator for this exact device and speed grade. At high power, provide core and I/O power planes with sufficient copper thickness and place ceramic decoupling capacitors in the quarter-package areas beneath the BGA.
For the 1517-ball FCBGA package, allocate enough routing layers for BGA fan-out, especially if all 734 user I/O are used. Use blind/buried vias or microvias when necessary to keep layer count manageable, and maintain controlled impedance for high-speed signals. Follow the Intel/Altera pin-connection guidelines and keep SERDES and transceiver supplies separate from general I/O banks. Route differential pairs symmetrically and by using ground vias around connectors to reduce return-current discontinuities.
Compliance Information
Lead free / RoHS Compliant status was reported by distributor snippets, including Besenchips and DigiKey. REACH, halogen-free, and conflict-mineral declarations were not found in the verified data.