EP2AGZ300HF40I3G - Arria II GZ FPGA 300K LE | Intel | FBGA-1517
MPN: EP2AGZ300HF40I3G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2450 | $245,000.00 |
| 500 | $2210 | $1,105,000.00 |
| 1,000 | $1995 | $1,995,000.00 |
EP2AGZ300HF40I3G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing fabric, and dedicated hard IP blocks such as transceivers, DSP slices, and embedded memory. Modern FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), positioned between simple complex PLDs (CPLDs) and fixed-function application-specific integrated circuits (ASICs). FPGAs are reprogrammable in the field, allowing rapid prototyping, hardware acceleration, and post-deployment design updates without silicon respin.
The Arria II GZ family targets mid-range applications requiring a balance of logic density, transceiver performance, and DSP throughput without the power and cost overhead of the high-end Stratix family. Key specifications of the EP2AGZ300HF40I3G include 734 user I/O pins, 1.2 V core voltage with PLL support for multiple clock domains, and partial reconfiguration capability. The transceiver hard IP supports common serial protocols such as PCI Express Gen1/Gen2, XAUI, and Serial RapidIO, eliminating the need for external PHY chips.
Architecturally, the EP2AGZ300HF40I3G combines programmable logic fabric with hard IP for transceivers, PCIe, and memory controllers. The embedded memory supports up to 700 MHz operation and can be configured as true dual-port RAM, ROM, or FIFO. The device also includes dedicated circuitry for dynamic phase alignment and dynamic reconfiguration, useful for adaptive signal processing and protocol switching.
Typical applications include high-speed serial interface bridging, telecommunications line cards, wireless baseband processing, radar and digital signal processing (DSP) front ends, military and aerospace signal intelligence, and test and measurement instrumentation. The wide transceiver bandwidth makes it suitable for video broadcasting (e.g., SDI/HDSDI aggregation), medical imaging pipelines, and defense-oriented signal processing.
When designing with this device, allocate sufficient PCB area for the 1517-ball FBGA (45 mm body, 1 mm pitch) and route at least 12 transceiver channels with controlled impedance. Power estimation should account for transceiver switching current at full data rate; use the Intel Early Power Estimator (EPE) tool before board layout to size decoupling and voltage rails.
This page consolidates distributor pricing for 2026-09-08, drop-in same-family Arria II GZ alternatives, and design notes (pinout summary, transceiver routing, JTAG configuration) that go beyond the manufacturer datasheet.
Drop-in alternatives for EP2AGZ300HF40I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300HF40I3G (same form factor and footprint) — differing in Package, RoHS Status, Embedded Memory, Logic Elements (LE), Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGZ300HF40I3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3820 / Unit
View Datasheet →EP2AGZ300HF40I4G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2260 / Unit
View Datasheet →EP2AGZ300HF40C4G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$945 / Unit
View Datasheet →EP2AGZ300HF40C3G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5950 / Unit
View Datasheet →EP2AGZ225HF40I3G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP2AGZ300HF40I3G Maximum Ratings & Electrical Characteristics
| Series | Arria II GZ |
| Logic Elements | 300,000 (approx.) |
| Embedded Memory | 20.475 Mbits |
| Embedded Multipliers | 28 (18x18) |
| User I/O Pins | 734 |
| Transceiver Count | 24 |
| Transceiver Data Rate | up to 6.375 Gbps |
| Core Voltage | 1.2 V (typical) |
| Process Technology | 40 nm TSMC |
| Package | FBGA-1517 (HF40), 45 mm body, 1 mm pitch |
| Operating Temperature | -40C to +100C (industrial) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
| RoHS Status | Compliant |
EP2AGZ300HF40I3G fbga-1517 (hf40), 45 mm body, 1 mm pitch Pin Configuration Guide
Pin configuration for EP2AGZ300HF40I3G (fbga-1517 (hf40), 45 mm body, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300HF40I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300HF40I3G is suitable for 6 applications: High-Speed Serial Interface Bridging, Telecommunications Line Cards, Wireless Baseband Processing, Radar and Defense Signal Processing, Test and Measurement Instrumentation, Medical Imaging Pipelines.
High-Speed Serial Interface Bridging
The EP2AGZ300HF40I3G's 24 transceivers operating up to 6.375 Gbps make it a strong fit for protocol-bridging designs between PCIe Gen2, XAUI, Serial RapidIO, and custom backplane links. Engineers typically instantiate one transceiver per lane and route signals on the FBGA-1517 perimeter, where dedicated GXB_RX/TX pin pairs exist. The 300K logic elements support link-layer state machines, CRC engines, and buffer management; the 28 embedded 18x18 multipliers handle lane alignment and scrambling. Compared with discrete PHY + ASSP solutions, the integrated transceiver hard IP cuts PCB area and BOM cost. Total transceiver power is roughly 130 mW per channel at 6.375 Gbps, so adequate thermal relief on the FBGA is essential.
Recommended
Telecommunications Line Cards
In telecom line-card applications the EP2AGZ300HF40I3G serves as a packet-processing and traffic-shaping engine between the network processor and the framer. Its 20.475 Mbits of embedded memory is partitioned into queue descriptors and statistics counters, while 300K logic elements implement classification, policing, and congestion-control algorithms. The industrial temperature grade -40C to +100C allows deployment in CO environments without additional thermal screening. The device supports soft CPU cores (Nios II) for control-plane tasks. Power estimation with Intel's Early Power Estimator (EPE) is recommended before committing to the 45 mm FBGA footprint to verify thermal headroom at full traffic load.
Recommended
Wireless Baseband Processing
The EP2AGZ300HF40I3G's DSP-oriented fabric is well-matched to wireless baseband signal processing such as LTE PHY-layer functions, channel coding, and FFT/iFFT operations. The 28 embedded 18x18 multipliers accelerate per-symbol computations, and additional soft multipliers extend DSP throughput. Transceivers connect to RF front-end ADCs/DACs at 3-6 Gbps JESD204B-equivalent rates or to CPRI links to a baseband hub. Industrial temperature grade enables outdoor small-cell deployments. Compared to ASIC implementations, the Arria II GZ cuts development time from years to months and allows late-stage specification changes. Designers should reserve at least 20 percent logic headroom for protocol updates.
Recommended
Radar and Defense Signal Processing
Radar, SIGINT, and electronic-warfare applications use the EP2AGZ300HF40I3G for pulse compression, beamforming, and adaptive filtering of high-bandwidth digitized RF data. The 6.375 Gbps transceivers ingest multi-GHz ADC sample streams, and 20.475 Mbits of embedded memory serves as ping-pong buffers between ADC samples and DSP pipelines. The industrial temperature range supports ruggedized enclosures, and partial reconfiguration enables mode-switching on the fly between surveillance and tracking modes. For SWaP-constrained platforms the FF35 package variant is preferred; HF40 is selected when maximum I/O and transceiver count are mandatory. Designers should verify signal-integrity simulations for the 1 mm pitch BGA escape.
Recommended
Test and Measurement Instrumentation
Test equipment such as protocol analyzers, logic-timing generators, and high-speed digitizers leverage the EP2AGZ300HF40I3G's transceiver count to aggregate multiple DUT links simultaneously. The 300K logic elements implement stimulus generation, response capture, and protocol-aware trigger logic. Embedded memory buffers raw samples before compression to host PCIe. The HF40 package's 734 user I/O expose trigger signals, status LEDs, and front-panel interfaces without requiring an external I/O expander. Compared with a bank of CPLDs plus a microcontroller, the Arria II GZ achieves deterministic timing with one device, simplifying firmware and BOM.
Recommended
Medical Imaging Pipelines
In medical imaging modalities such as ultrasound, CT, and MRI receivers, the EP2AGZ300HF40I3G processes parallel ADC data streams from transducer arrays or detector banks. The 24 transceivers connect to JESD204B-compatible ADCs, and the embedded multipliers execute beamforming and image-reconstruction kernels. The industrial temperature grade and 40 nm process technology provide predictable performance for medical certification cycles. Compared with GPU-based pipelines, the FPGA delivers deterministic latency required for real-time imaging. Engineers should plan thermal management on the FBGA-1517 footprint, especially in fan-less cart-mounted ultrasound systems.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300HF40I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ300HF40I3N | EP2AGZ300HF40I4G | EP2AGZ300HF40C4G | EP2AGZ300HF40C3G | EP2AGZ225HF40I3G |
|---|---|---|---|---|---|---|
| Package | FBGA-1517 (HF40), 45 mm body, 1 mm pitch | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 300K (approx.) | 300K - same | 300K - same | 300K - same | 300K - same | 225K (-25%) |
| Transceiver Count | 24 | 24 - same | 24 - same | 24 - same | 24 - same | 24 - same |
| Max Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps - same | 6.375 Gbps - same | 6.375 Gbps - same | 6.375 Gbps - same | 6.375 Gbps - same |
| User I/O Pins | 734 | 734 - same | 734 - same | 734 - same | 734 - same | 734 - same |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same | Industrial - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial - same |
| Speed Grade | I3 (mid-fast) | I3 - same | I4 (faster) | C4 (faster) | C3 (slower) | I3 - same |
Key Differentiators
- Highest-density Arria II GZ part in the HF40 FBGA-1517 package (vs EP2AGZ225HF40I3G)
- Industrial temperature grade with mid-fast I3 speed grade (vs EP2AGZ300HF40C4G)
- Maximum transceiver count in the Arria II GZ family (vs EP2AGZ300FF35I3G)
Design Notes
Estimated: at 300 MHz core clock with all 24 transceivers active at 6.375 Gbps and 50% logic utilization, the EP2AGZ300HF40I3G draws roughly 7-9 W core plus 3 W transceiver power (about 130 mW per channel). Designers should run Intel's Early Power Estimator (EPE) before PCB layout and provision 12V/3.3V/1.2V rails with at least 20% margin. Place bulk decoupling on each supply pin within 5 mm of the FBGA balls.
The FBGA-1517 (HF40) package uses 1 mm ball pitch on a 45 mm body. Route transceiver differential pairs on the top microstrip layer with 100 ohm differential impedance and reference to a solid ground plane. Use Intel's pin-out files and the Quartus Pin Planner to confirm pad assignments; never reuse the same pin across LVDS and 1.5V GPIO banks without verifying VCCIO compatibility.
Estimated: at 6.375 Gbps the transceiver channel loss budget through PCB traces and vias should stay below 10 dB at 3.125 GHz Nyquist. Use short via stubs (<0.2 mm) for transceiver signals, place AC-coupling capacitors within 1 cm of the receiver pins, and maintain continuous reference planes across all transceiver routes. Pre-emphasis and equalization settings must be tuned per channel using the Arria II GZ Transceiver Toolkit.
Do not assume the EP2AGZ300HF40I3G and the EP2AGZ300HF40C4G are interchangeable - the I3 is industrial temperature grade (-40C to +100C) while the C4 is commercial (0C to +85C). Likewise the I3 and I4 speed grades are not bitstream-compatible for timing-critical designs; re-run timing analysis after substitution. Always verify JTAG chain order before configuring multiple FPGAs in cascade.
Compliance Information
RoHS and REACH compliance per Intel product page. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
