EP2AGZ300FF35I4G - 300K LE Arria II GZ FPGA | Intel | 1152-FBGA
MPN: EP2AGZ300FF35I4G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3250 | $3,250.00 |
| 10 | $3060 | $30,600.00 |
| 25 | $2890 | $72,250.00 |
| 50 | $2745 | $137,250.00 |
| 100 | $2610 | $261,000.00 |
EP2AGZ300FF35I4G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs sit in the programmable-logic family of digital ICs, sitting alongside ASICs and CPLDs, and contain arrays of programmable logic blocks, interconnects, and I/O cells that designers can wire up to implement custom digital functions, glue logic, signal processing, or even soft processor cores. The Arria II GZ family is positioned as a mid-range transceiver-enabled FPGA, between the low-power Cyclone family and the high-end Stratix family.
Key features include 8.55 Gbps transceivers with PCS/PMA support, dedicated fractional PLLs, hardware DSP blocks for high-performance fixed- and floating-point math, variable-precision DSP, 12.92 Mbits MLAB, and hard PCIe Gen2 and Gen1 controllers. The device also integrates high-speed external memory interfaces supporting DDR3, DDR2, and QDRII+/QDRII SRAM at up to 800 MHz. The FBGA-1152 package provides high I/O density in a moderate footprint suitable for performance-critical line cards.
The architecture combines a fabric of adaptive logic modules (ALMs) with up to 21 transceiver channels, variable-precision DSP blocks, and embedded memory blocks. Hard PCIe Gen2 controllers ease protocol implementation, while the transceiver physical coding sublayer supports multiple protocols including PCIe, CEI-6G, CPRI, and OBSAI, making the EP2AGZ300 well-suited to telecom infrastructure.
Typical applications include 40G/100G optical line cards, wireless backhaul, military radar processing, video broadcast infrastructure, and high-performance DSP coprocessors. Compared to a Cyclone V SoC, the Arria II GZ delivers roughly 3x the logic and 5x the transceiver bandwidth; compared to a Stratix V, it consumes less power at the cost of lower logic density.
When designing with the EP2AGZ300FF35I4G, plan thermal dissipation carefully - 40nm transceivers at 8.5 Gbps require a properly designed multi-layer PCB stack-up with continuous GND planes, controlled-impedance transceiver traces, and adequate cooling (often forced air) for industrial temperature operation at -40C to +100C.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2AGZ300FF35I4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300FF35I4G (same form factor and footprint) β differing in Package, Transceivers, RoHS Status, Logic Elements, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ300FF35I4
β Drop-Inβ In Stock
$1015 / Unit
View Datasheet βEP2AGZ300FF35I3G
β Drop-Inβ In Stock
$1230 / Unit
View Datasheet βEP2AGZ300FF35I3N
β Drop-Inβ In Stock
$3500 / Unit
View Datasheet βEP2AGZ300FF35C4N
β Drop-Inβ In Stock
$1350 / Unit
View Datasheet βEP2AGZ300FF35C4G
β Drop-Inβ In Stock
$2240 / Unit
View Datasheet βEP2AGZ300FF35C3N
β Drop-Inβ In Stock
$1480 / Unit
View Datasheet βEP2AGZ300FF35C3G
β Drop-Inβ In Stock
$1395 / Unit
View Datasheet βEP2AGZ300FF35I4G Maximum Ratings & Electrical Characteristics
| Series | Arria II GZ |
| Family Name | Arria II GZ FPGA |
| Logic Elements (LE) | 300,000 |
| Embedded Memory (Bits) | 18.16 Mbit |
| Maximum User I/O | 554 |
| Transceivers | Up to 21 channels |
| Transceiver Data Rate | 8.55 Gbps |
| Hard PCIe Controllers | PCIe Gen1 and Gen2 |
| Memory Interfaces | DDR3, DDR2, QDRII+, QDRII SRAM up to 800 MHz |
| PLLs | Fractional PLLs on-chip |
| Package | 1152-FBGA (FF35) 35x35 mm |
| Operating Temperature | -40C to +100C (Industrial, I4 grade) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Process Node | 40 nm |
| Speed Grade | 4 |
EP2AGZ300FF35I4G 1152-fbga (ff35) 35x35 mm Pin Configuration Guide
Pin configuration for EP2AGZ300FF35I4G (1152-fbga (ff35) 35x35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300FF35I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300FF35I4G is suitable for 6 applications: 40G/100G Optical Line Card, Wireless Backhaul Modem, Military Radar Signal Processing, Video Broadcast Infrastructure, High-Performance DSP Coprocessor, Industrial Test and Measurement.
40G/100G Optical Line Card
The EP2AGZ300FF35I4G is ideally matched to 40G and 100G optical line cards because its 21 integrated 8.55 Gbps transceivers can be bonded into OTU3, OTU4, and 100GBASE-KR4 physical interfaces without external muxes. Its 300K logic elements comfortably absorb OTN framer and MAC functions, while 18.16 Mbits embedded memory holds packet descriptors. Per the Arria II GZ handbook, the hard PCS supports CEI-6G, CPRI, and OBSAI protocols. The industrial temperature grade and FF35 package enable deployment in thermally constrained PICs where forced air is unavailable.
Recommended
Wireless Backhaul Modem
In LTE and 5G wireless backhaul modems, the EP2AGZ300FF35I4G handles CPRI/OBSAI up to 6.144 Gbps on its transceiver channels plus Layer-1 baseband DSP in its dedicated DSP blocks. The 8.55 Gbps transceivers also support fiber and Ethernet backhaul aggregation. Industrial -40C to +100C rating allows outdoor small-cell deployment. The 1152-FBGA FF35 package and 554 user I/Os accommodate multi-connector faceplates and sync Ethernet timing without external bridges.
Recommended
Military Radar Signal Processing
The EP2AGZ300FF35I4G's variable-precision DSP blocks deliver the multiply-accumulate throughput required for phased-array radar pulse compression, MTI, and beamforming math. With ~300K logic elements, the FPGA can implement high-channel-count FFT pipelines and adaptive nulling algorithms. The -40C to +100C industrial temperature range and 40nm low-power process make it ideal for vehicular, airborne, and naval radar systems where reliability and thermal headroom are critical. Hard PCIe Gen2 controllers ease coupling to a host CPU for radar control and data recording.
Recommended
Video Broadcast Infrastructure
Broadcast studios and outside-broadcast trucks rely on the EP2AGZ300FF35I4G to perform SDI cross-point switching, video format conversion, and compression preprocessing. With 18.16 Mbits embedded memory and hundreds of user I/Os, the device aggregates multi-channel 3G-SDI/HD-SDI streams, while the transceiver channels handle SMPTE 2022/2050 video-over-IP. Industrial temperature grade supports unconditioned truck and equipment-room environments, and the FF35 BGA offers the routing density needed for parallel video bus aggregation.
Recommended
High-Performance DSP Coprocessor
The EP2AGZ300FF35I4G serves as an offload accelerator for compute hosts via its hard PCIe Gen2 controller, with the 300K LE fabric plus DSP blocks providing matrix math, FFT, convolution, and cryptography throughput. Its 800 MHz DDR3 controllers attach directly to external memory for streaming workloads, while 18.16 Mbits of embedded memory buffer intermediate tiles. Engineers choose this device over software DSPs when deterministic latency, parallel channels, or sustained multi-GFLOP throughput are required, common in medical imaging and scientific instrumentation.
Recommended
Industrial Test and Measurement
Automatic Test Equipment (ATE) leverages the EP2AGZ300FF35I4G to implement deep pattern generation, high-speed protocol-aware sampling, and parallel digital-channel test logic. The 8.55 Gbps transceivers support protocols such as PCIe, SATA, USB 3.0, and 10 GbE, while 554 user I/Os accommodate parallel multi-pin test heads. The industrial -40C to +100C temperature range ensures operation in unconditioned factory floors, and the FF35 BGA exposes sufficient I/O for high-channel-count production testers.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300FF35I4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ300FF35I4 | EP2AGZ300FF35I3G | EP2AGZ300FF35I3N | EP2AGZ300FF35C4G | EP2AGZ300FF35C4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (FF35) 35x35 mm | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same |
| Logic Elements | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 |
| Speed Grade | 4 | 4 | 3 (faster) | 3 (faster) | 4 (commercial temp) | 4 (commercial temp) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Transceiver Channels | Up to 21 channels | Up to 21 | Up to 21 | Up to 21 | Up to 21 | Up to 21 |
| Transceiver Data Rate | 8.55 Gbps | 8.55 Gbps | 8.55 Gbps | 8.55 Gbps | 8.55 Gbps | 8.55 Gbps |
| Embedded Memory | 18.16 Mbit | 18.16 Mbit | 18.16 Mbit | 18.16 Mbit | 18.16 Mbit | 18.16 Mbit |
| Hard PCIe Controllers | PCIe Gen1 / Gen2 | PCIe Gen1 / Gen2 | PCIe Gen1 / Gen2 | PCIe Gen1 / Gen2 | PCIe Gen1 / Gen2 | PCIe Gen1 / Gen2 |
Key Differentiators
- Industrial temperature grade with full silicon content at I4 speed grade (vs EP2AGZ300FF35C4G (commercial temp))
- Highest-density Arria II GZ drop-in with 21 transceivers in 1152-FBGA (vs EP2AGZ225FF35I4G (225K LE))
- RoHS-compliant finish with full industrial coverage (vs EP2AGZ300FF35I3N (non-RoHS finish))
Design Notes
Estimated: at typical 8.5 Gbps transceiver utilization with 21 channels active, the EP2AGZ300FF35I4G dissipates roughly 8-12 W. The 1152-FBGA FF35 package exposes a center thermal pad; thermal resistance theta_JA is approximately 4-6 C/W with a properly designed 12-layer PCB stack-up with continuous GND/power planes and thermal vias. For industrial -40C to +100C ambient operation, plan for forced-air cooling or attach a heatsink with thermal interface material to maintain junction temperature below 125C. Always follow Intel's FPGA thermal-management application note AN-358.
The FF35 1152-FBGA ball pitch requires high-density PCB routing with microvia HDI stack-ups. Per the Arria II GZ handbook, dedicate a continuous GND plane immediately below the BGA layer for return-path integrity. Transceiver channels demand 100 ohm differential controlled impedance with skew below 1 ps per mm; pair-length matching is critical. Use Intel's pinout file and IBIS models for accurate channel simulation prior to PCB layout.
For 8.55 Gbps serial channels, AC-coupling capacitors must be placed within 50 mm of the device's transmitter pads. Receiver CTLE and DFE settings in the Arria II GZ transceiver toolkit must be tuned per channel; use the Transceiver Toolkit GUI during board bring-up. Avoid routing parallel high-speed lanes across any plane split, including power islands. Reference Intel AN-584 (Signal Integrity for Transceiver Interfaces) for layout checklists.
Estimated: the EP2AGZ300FF35I4G requires multiple voltage rails: VCCINT (core ~0.9 V), VCCD_PLL, VCCPT (programmable technology), VCCA_PLL, VCCAUX, VCCA_FPLL, and VCCIO banks at 1.2/1.5/1.8/2.5/3.3 V per I/O standard. Use Intel's PowerPlay Early Power Estimator (EPE) to calculate per-rail current; total worst-case current can exceed 15 A on VCCINT for full utilization. Power-on sequencing must follow AN-358 (PowerSeq) requirements; reverse-current damage can occur if rails are not ramped in the recommended order.
Do not substitute EP2AGZ300FF35C4G or C4N into industrial -40C to +100C designs; commercial temperature parts fail in cold-start or outdoor-telecom deployments. Also, the FF35 pinout is specific to the 300K LE die - it is NOT compatible with the lower-density EP2AGZ225FF35 even though both use 1152-FBGA, because the GZ225 and GZ300 pinmaps differ. Always confirm pinout compatibility against Intel's published pin-out files before reuse, especially after a die-shrink rev change.
Compliance Information
RoHS compliant per Altera/Intel product page (G suffix indicates RoHS finish). Industrial temperature grade. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC.
