EP2C50F484C8 - Cyclone II FPGA 50K LE 484-BGA | Intel (Altera)
MPN: EP2C50F484C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $75.8 | $75.80 |
| 10 | $71.2 | $712.00 |
| 100 | $66.5 | $6,650.00 |
| 500 | $60.1 | $30,050.00 |
| 1,000 | $55.4 | $55,400.00 |
EP2C50F484C8 Overview
Background: An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic function is defined by the user after manufacture, rather than at the fab. It sits in the integrated circuit taxonomy between fixed-function ASICs and software-defined processors. The Cyclone II family, introduced by Altera (acquired by Intel in 2015), targeted low-cost, high-volume applications with embedded multipliers, M4K memory blocks, and PLL-based clock management. Within the broader power management and digital IC hierarchy, the Cyclone II sits in the FPGA & CPLD category, with FPGA > programmable logic > digital IC > integrated circuit > semiconductor.
Key features of the EP2C50F484C8 include 50,528 logic elements (LEs), 4,608 Kbits of embedded RAM, 86 embedded 18x18 multipliers, four phase-locked loops (PLLs), and 294 user I/O pins. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and is supported by the Quartus II design software. Power is supplied through dedicated VCCINT (core), VCCIO (I/O banks), and VCCA_PLL (PLL analog) rails.
The architecture combines logic elements organized into Logic Array Blocks (LABs), embedded memory blocks (M4K), dedicated multiplier blocks (18x18), and PLL clock networks. The C8 speed grade denotes a commercial temperature range (0C to +85C) and a specific timing closure performance. The 484-ball FineLine BGA package provides high pin density for designs that need to route many LVDS or parallel interfaces off-chip.
Typical applications include industrial motor control, video processing pipelines, telecommunications line cards, software-defined radio (SDR), and embedded vision systems. The combination of high logic density and embedded multipliers makes the EP2C50F484C8 especially effective at the math-heavy front ends of these systems.
When designing, note that the Cyclone II family is in NRND/EOL status and may not be recommended for new designs; consider Cyclone IV or Cyclone V for new production. Designers should consult the manufacturer datasheet for power sequencing, decoupling, and JTAG configuration details.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes for engineers evaluating the EP2C50F484C8 in legacy or maintenance designs.
Drop-in alternatives for EP2C50F484C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C50F484C8 (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Process Technology, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C50F484C8N
✅ Drop-In✓ In Stock
$68.2 / Unit
View Datasheet →EP2C50F484C7N
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP2C50F484C7
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP2C50F484C6N
✅ Drop-In✓ In Stock
$180.47 / Unit
View Datasheet →EP2C50F484C6
✅ Drop-In✓ In Stock
$110 / Unit
View Datasheet →EP2C50F484C8 Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 50,528 |
| Embedded Memory (RAM bits) | 594,432 |
| Embedded Memory (Kbits) | 4,608 Kbits |
| Number of LABs/CLBs | 294 |
| User I/O Count | 294 |
| Embedded 18x18 Multipliers | 86 |
| PLLs | 4 |
| Process Technology | 90 nm CMOS |
| Speed Grade | C8 (commercial) |
| Package | 484-ball FineLine BGA |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (commercial) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Configuration Method | JTAG / Passive Serial / Active Serial (EPCS) |
| RoHS Status | Compliant |
EP2C50F484C8 484-ball fineline bga Pin Configuration Guide
Pin configuration for EP2C50F484C8 (484-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C50F484C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C50F484C8 is suitable for 6 applications: Industrial Motor Control and Drive, Video Processing and Image Pipeline, Telecommunications Line Card and Protocol Bridging, Software Defined Radio (SDR) Front End, Embedded Display and HMI Controller, Test and Measurement Instrumentation.
Industrial Motor Control and Drive
The EP2C50F484C8's 50,528 logic elements and 86 embedded 18x18 multipliers provide ample processing bandwidth for field-oriented control (FOC) algorithms driving 3-phase AC induction or BLDC motors. Cyclone II devices are widely deployed in industrial drives where deterministic timing, hardware parallelism, and high I/O count are critical. The 294 user I/Os comfortably route multi-encoder feedback, gate-driver interfaces, and ADC sampling buses. In a typical servo drive, the EP2C50 implements the FOC inner loop, PWM generation, current-sense sampling, and EtherCAT / PROFIBUS MAC, replacing multiple DSPs and MCUs. Its C8 commercial speed grade meets 50-100 kHz current-loop rates.
Recommended
Video Processing and Image Pipeline
The EP2C50F484C8's 4,608 Kbits of embedded M4K memory and 86 multipliers suit real-time video pipelines such as de-interlacing, scaling, color-space conversion, and edge enhancement on SD/HD streams. The 294 user I/Os route ITU-R BT.656, BT.1120, or parallel RGB/YUV buses plus DDR memory controllers. Cyclone II implementations can drive mid-range video walls, surveillance DVRs, and machine-vision pre-processors where ASIC cost is prohibitive. The 90 nm process keeps dynamic power reasonable for fanless embedded vision boxes.
Recommended
Telecommunications Line Card and Protocol Bridging
The EP2C50F484C8 is well suited for telecom line cards implementing TDM-to-Ethernet bridging, HDLC/PPP framing, and low-rate voice processing. Its high I/O count accommodates multiple E1/T1 framer interfaces, while the embedded multipliers accelerate FEC and voice codecs. The 484-ball BGA provides signal integrity for 100 MHz+ LVCMOS/LVDS bus operation. Typical deployments include legacy PSTN gateways, channel banks, and industrial protocol converters where Cyclone II's NRND status is acceptable for maintenance designs.
Recommended
Software Defined Radio (SDR) Front End
The EP2C50F484C8's 86 embedded 18x18 multipliers enable digital down-conversion (DDC), digital up-conversion (DUC), and FFT pre-processing at baseband rates. The 4,608 Kbits of M4K RAM holds sample buffers, while 294 I/Os interface ADCs/DACs and high-speed serial LVDS links. Hobbyist and commercial SDR implementations use Cyclone II for low-cost IF processing in HF, VHF, and broadband receivers. The C8 speed grade provides sufficient timing margin for 50-100 MSPS sample paths.
Recommended
Embedded Display and HMI Controller
The EP2C50F484C8 drives TFT-LCD panels up to XGA resolution with hardware-accelerated 2D graphics, character ROMs, and touch-screen interfaces. The 294 user I/Os route 18/24-bit RGB buses, SPI flash, I2C touch controllers, and backlight PWM. Industrial HMI panels and POS terminals historically used Cyclone II for the flexibility of late-stage firmware updates. The BGA package supports high-speed pixel clocks without EMI issues common to QFP packages.
Recommended
Test and Measurement Instrumentation
The EP2C50F484C8's logic density and embedded multipliers serve as the digital backbone of mid-range oscilloscopes, logic analyzers, and protocol testers. The PLLs generate precise acquisition clocks, while the M4K RAM buffers deep sample captures. The 294 I/Os connect to front-panel buttons, LCDs, and high-speed ADC/DAC interfaces. Many legacy bench instruments deployed Cyclone II for the cost-performance balance and the Quartus II toolchain maturity.
Recommended
Recommended Products Summary
Engineering reference data for EP2C50F484C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C50F484C8N | EP2C50F484C7N | EP2C50F484C7 | EP2C50F484C6N | EP2C50F484C6 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FineLine BGA | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same |
| Logic Elements | 50,528 | 50,528 | 50,528 | 50,528 | 50,528 | 50,528 |
| Embedded RAM (bits) | 594,432 | 594,432 | 594,432 | 594,432 | 594,432 | 594,432 |
| Embedded 18x18 Multipliers | 86 | 86 | 86 | 86 | 86 | 86 |
| User I/O Count | 294 | 294 | 294 | 294 | 294 | 294 |
| Speed Grade | C8 (commercial) | C8 (commercial) | C7 (commercial, slower Fmax) | C7 (commercial, SnPb plating) | C6 (commercial, slowest Fmax) | C6 (commercial, SnPb plating) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Lead-Free (RoHS) | Yes | Yes | Yes | No (SnPb) | Yes | No (SnPb) |
Key Differentiators
- Highest logic density in the Cyclone II family (vs EP2C35F484C8)
- Fastest commercial speed grade (C8) (vs EP2C50F484C6)
- RoHS lead-free compliance standard (vs EP2C50F484C7 (without N suffix))
Design Notes
The EP2C50F484C8 requires three separate power rails: VCCINT (1.15-1.25V, typically 1.2V) for the core logic, VCCIO (1.5V/1.8V/2.5V/3.3V bank-dependent) for the I/O banks, and VCCA_PLL (2.5V typical) for the PLL analog supply. Decoupling must follow the Cyclone II Device Handbook guidelines - typically 0.1uF and 0.01uF ceramic capacitors placed within 100 mils of each VCC pin. Power sequencing should bring VCCINT up before VCCIO to avoid I/O latch-up; consult the datasheet for the recommended sequence and ramp times.
The 484-ball FineLine BGA package has a junction-to-ambient thermal resistance (theta-JA) in the low single-digit C/W range with proper PCB stackup. For designs with high toggle rates (above 60-70% of LEs switching at 100 MHz+), estimate power dissipation with the Quartus II PowerPlay Early Power Estimator before layout to size the copper pour and via fields under the BGA. Add thermal vias in a grid pattern (0.5 mm pitch) under the package center to keep the junction below 125C.
The 484-ball FineLine BGA uses 1.0 mm ball pitch, which requires 4-6 layer PCB stackup with micro-via or via-in-pad construction for reliable assembly. Escape routing on the top layer should fan out with 0.4 mm trace/space rules; inner layers break out with dog-bone fanouts through 0.2 mm laser-drilled microvias. Land pattern dimensions and solder mask openings must follow the manufacturer-recommended footprint in the Cyclone II handbook.
Estimated: Cyclone II devices are NRND; for new designs Intel recommends Cyclone IV E (EP4CE50 in the same FBGA-484 package is a popular migration with similar I/O count). When sourcing EP2C50F484C8, verify the date code and lot traceability - counterfeits are common in the secondary market for EOL/NRND FPGAs. Always use Altera/Intel USB-Blaster or compatible JTAG cables for programming; ByteBlaster cables are obsolete.
Compliance Information
RoHS-compliant per Cyclone II product page. Not AEC-Q100 qualified (FPGAs typically do not carry automotive qualification unless explicitly noted). Use industrial-grade (I-suffix) variants for extended temperature.
