Intel

EP2C50F484C6 - Cyclone II FPGA, 50K LEs, 484-FBGA | Intel

MPN: EP2C50F484C6 βœ— End of Life
In Stock Ships in 1-3 business days
1.2 V Vdss 484-ball FineLine BGA (F484), 1.0 mm pitch Package 500 MHz Speed M4K blocks, 4 Kbit each Memory
From $110 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $165 $165.00
10 $148.5 $1,485.00
100 $132 $13,200.00
500 $121 $60,500.00
1,000 $110 $110,000.00
ℹ️ All prices are in USD

EP2C50F484C6 Overview

The Intel EP2C50F484C6 is a Cyclone II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, delivering 50,528 logic elements and 294 user I/Os in a 484-ball FineLine BGA package. Operating from a 1.2 V core supply, the device supports up to 500 MHz internal operation and integrates 594 Kbit of embedded RAM across 3158 Configurable Logic Blocks (CLBs), giving designers ample headroom for glue-logic, bus-bridging, and DSP pre-processing tasks. The 'C6' speed grade targets commercial-temperature applications and pairs with Altera/Intel's Quartus II design suite for synthesis, place-and-route, and configuration generation.

A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic function is defined by a user-supplied configuration bitstream rather than at the factory. Positioned in the taxonomy as: FPGA -> programmable logic device (PLD) -> integrated circuit -> semiconductor, FPGAs sit alongside microcontrollers, ASICs, and ASSPs in the wider system-on-chip ecosystem but offer the unique advantage of post-silicon hardware re-programmability. The Cyclone II family specifically targets cost-sensitive, high-volume applications where a low unit cost masks the NRE of an ASIC.

Key features of the EP2C50F484C6 include 4 phase-locked loops (PLLs) for clock synthesis, dedicated 18-bit x 18-bit hardware multipliers for DSP, 8 Mb of total on-chip memory distributed in M4K blocks, and LVDS/LVTTL/LVCMOS I/O support. It supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. The 484-pin FineLine BGA uses a 1.0 mm ball pitch and is footprint-compatible with other Cyclone II F484 devices of differing logic densities (EP2C8, EP2C20, EP2C35, EP2C50, EP2C70).

From an architectural standpoint, the Cyclone II LAB (Logic Array Block) is built from 16 Logic Elements arranged in a column, with each LE containing a 4-input LUT, a programmable register, and carry chain logic. The M4K memory blocks (4 Kbit each) double as simple dual-port or single-port RAM, ROM, or shift registers, eliminating the need for external SRAM in many bus-interface designs.

Typical applications include industrial motor control and factory automation front-ends, video/image processing pipelines, software-defined radio (SDR) baseband, telecommunications line cards, low-cost digital signal processing, and educational/development platforms. The combination of 50K logic elements, 8 Mb on-chip RAM, and 18-bit hardware multipliers makes it a sweet spot for mid-density control-plane and signal-conditioning designs.

When designing with this part, plan your pin assignments against the four PLL-driven global clock networks early to avoid later place-and-route congestion. The C6' speed grade offers a balance of timing margin versus cost; if the timing closure is too tight, step up to the C7 or C8 grade in the same package without any PCB changes.

This page synthesizes distributor pricing, drop-in alternatives drawn from the same Cyclone II family, and practical design notes not found in the manufacturer datasheet itself.

Drop-in alternatives for EP2C50F484C6 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2C50F484C6 (same form factor and footprint) β€” differing in Speed Grade, Package, Process Technology, Operating Temperature, Total RAM Bits.

Intel
Speed Grade: -6
Package: 484-ball FineLine BGA (FBGA)
Process Technology: 90 nm low-k CMOS
Compare with EP2C50F484C6 β†’
Intel
Speed Grade: C6 (commercial)
Package: 484-ball BGA
Operating Temperature: 0 C to +85 C (commercial)
Compare with EP2C50F484C6 β†’
Intel
Speed Grade: C7
Package: 484-ball FBGA
Process Technology: 90 nm
Compare with EP2C50F484C6 β†’
Intel
Speed Grade: C7 (commercial)
Package: 484-ball FineLine BGA (1.0 mm pitch)
Process Technology: 90 nm low-power CMOS
Compare with EP2C50F484C6 β†’
Intel
Speed Grade: C8 (commercial)
Package: 484-ball FineLine BGA
Compare with EP2C50F484C6 β†’
Intel
Speed Grade: -8 (commercial, fast)
Package: 484-ball FineLine BGA (FBGA)
Operating Temperature: 0C to +85C (commercial, 'C' suffix)
Compare with EP2C50F484C6 β†’
Intel
Speed Grade: C6 (commercial, -6)
Package: 484-ball FineLine BGA (U484), 19x19 mm, 1.0 mm pitch
Process Technology: 90 nm CMOS SRAM
Compare with EP2C50F484C6 β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2C50F484C7N

βœ… Drop-In
Intel
πŸ“¦ 484-ball FineLine BGA (F484)
Cyclone II Β· 50,528 Β· 594,432 bit Β· M4K (4 Kbit each) Β· 294 Β· 4 Β· 16 Β· Yes (embedded multiplier blocks)

βœ“ In Stock

$155 / Unit

View Datasheet β†’

EP2C50F484C8N

βœ… Drop-In
Intel
πŸ“¦ 484-ball FineLine BGA (F484)
Cyclone II Β· EP2C50 Β· 50,528 Β· 594,432 Β· 250 M4K blocks Β· 294 Β· 86 Β· 4

βœ“ In Stock

$68.2 / Unit

View Datasheet β†’

EP2C50F484I7N

βœ… Drop-In
πŸ“¦ 484-ball FineLine BGA (F484)
same die/package, industrial temperature -40C to +100C instead of commercial 0C to +85C

πŸ“‹ Reference alternative (not in catalog)

EP2C50F484C6N

βœ… Drop-In
Intel
πŸ“¦ 484-ball FineLine BGA (F484)
Cyclone II Β· EP2C50F484C6N Β· Intel (formerly Altera) Β· 50,528 Β· 594,432 bits Β· 129 Β· 294 Β· 484-ball BGA

βœ“ In Stock

$180.47 / Unit

View Datasheet β†’

EP2C70F484C6N

βœ… Drop-In
πŸ“¦ 484-ball FineLine BGA (F484)
higher density (68,416 LEs vs 50,528 LEs, +35%), same F484 footprint

πŸ“‹ Reference alternative (not in catalog)

EP2C35F484C6

βœ… Drop-In
Intel
πŸ“¦ 484-ball FineLine BGA (F484)
Cyclone II Β· 33,216 Β· 483,840 bits (105 M4K blocks x 4 Kbit) Β· 35 Β· 322 Β· 90 nm low-k CMOS Β· 1.2 V Β· 2.5 V

βœ“ In Stock

$57.2 / Unit

View Datasheet β†’

EP2C50F484C6 Maximum Ratings & Electrical Characteristics

Family Cyclone II
Logic Elements (LEs) 50,528
Configurable Logic Blocks (CLBs) 3,158
Total RAM Bits 594,432 bit
Embedded Memory Blocks M4K blocks, 4 Kbit each
Total On-Chip Memory 8 Mbit
DSP / Multiplier Blocks 18-bit x 18-bit hardware multipliers
PLLs 4
Maximum User I/Os 294
Process Technology 90 nm CMOS
Core Voltage 1.2 V
Maximum Internal Frequency 500 MHz
Speed Grade C6
Operating Temperature 0C to +85C (commercial)
Package 484-ball FineLine BGA (F484), 1.0 mm pitch
Mounting Type Surface Mount
Configuration Modes JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS)
RoHS Status Compliant

EP2C50F484C6 484-ball fineline bga (f484), 1.0 mm pitch Pin Configuration Guide

Pin configuration for EP2C50F484C6 (484-ball fineline bga (f484), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball fineline bga (f484), 1.0 mm pitch package pinout diagram for EP2C50F484C6

No detailed pinout data available for EP2C50F484C6.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2C50F484C6 is suitable for 6 applications: Industrial Motor Control, Video and Image Processing Pipelines, Telecommunications Line Cards, Software-Defined Radio (SDR) Baseband, Test and Measurement Instrumentation, Educational and Development Platforms.

🏭

Industrial Motor Control

The EP2C50F484C6 fits industrial motor-control front-ends because its 50,528 logic elements can host field-oriented-control (FOC) state machines, encoder-decoder logic, and protection loops simultaneously. The four on-chip PLLs derive the PWM carrier (typically 10-20 kHz), the encoder sampling clock (40 MHz), and the communication clock from a single 50 MHz crystal. With 294 user I/Os, the FPGA can interface directly to multi-axis power stages with current-sense ADCs and gate drivers. Designers typically map one LAB per PWM channel for cycle-by-cycle current limiting and place the trapezoidal/FOC algorithm in DSP-style 18-bit multipliers to compute Park/Clarke transforms in <2 us per loop tick.

πŸ“Ί

Video and Image Processing Pipelines

The 594 Kbit on-chip M4K memory block farm makes the EP2C50F484C6 well suited to line-buffer and frame-buffer staging in video pipelines up to 720p60. Designers commonly instantiate dual-port M4K blocks as FIFO queues between camera-sensor LVDS deserialization, color-space conversion (YUV422 to RGB888), and HDMI/DVI output. The 294 I/Os accept 18-24-bit parallel video buses plus embedded control channels, while the four PLLs generate pixel clocks at 27/54/74.25/148.5 MHz from a 27 MHz reference. Cyclone II 18-bit hardware multipliers accelerate 5x5 convolution kernels for basic edge-detection pre-processing at >100 MHz.

🌐

Telecommunications Line Cards

Telecommunications line cards use the EP2C50F484C6 for glue-logic, TDM bus aggregation, and low-rate channel processing where the 50K LE envelope comfortably absorbs HDLC framers, BERT engines, and ATM/AAL2 segmentation. The four PLLs synthesize E1/T1 bit clocks (2.048/1.544 MHz) and the 8 kHz frame-sync reference. LVDS I/O capability allows direct connection to backplane SERDES at sub-gigabit rates. The 484-ball BGA package exposes sufficient I/Os to drive 32+ TDM timeslots on the front-panel side while maintaining backplane bus access on the rear side. Engineers typically allocate ~25K LEs to TDM logic and ~10K LEs to protocol-conversion glue.

✈️

Software-Defined Radio (SDR) Baseband

The EP2C50F484C6 is a popular SDR baseband platform because its 50K logic elements, 18-bit hardware multipliers, and 8 Mbit on-chip RAM can implement digital down-conversion (DDC), FIR filtering, and demodulation for narrowband waveforms below 50 MHz of bandwidth. The 50K-LE envelope supports two parallel DDC chains for diversity reception, each with 256-tap FIR filters realized in 18-bit M9K-equivalent M4K blocks. Designers pair the FPGA with an external ADC (typically 12-14 bit, 100 MSPS) and use one of the four PLLs to derive the ADC sampling clock from a low-jitter reference. Compared with a fixed-function DSP, the FPGA allows post-deployment modulation-switch upgrades without hardware changes.

πŸ”§

Test and Measurement Instrumentation

The EP2C50F484C6 is well matched to bench-instrument designs such as logic-analyzer probe heads, protocol exercisers, and arbitrary waveform generator pre-processors. Its 500 MHz maximum internal frequency and 594 Kbit RAM buffer enable real-time pattern generation at >200 MHz, while 294 user I/Os handle multi-channel digital stimulus. The four PLLs produce independent sample clocks for transmit and receive paths. Designers often implement custom trigger logic in the FPGA's LAB fabric and use the M4K blocks as deep FIFO storage for pre-trigger capture. The BGA package's high pin count allows dense parallel LVDS interconnect to analog front-end boards.

πŸ–₯️

Educational and Development Platforms

The EP2C50F484C6 features in many university FPGA teaching labs because its 50K-LE capacity accommodates realistic student projects (RISC-V cores, VGA games, custom CPUs) without timing-closure pain. The Quartus II Web Edition toolchain is free for Cyclone II and supports schematic, VHDL, and Verilog entry. The 484-ball BGA is offered on low-cost Cyclone II starter boards (e.g. Terasic DE2-115 successors) with on-board SDRAM, audio CODEC, video DAC, and GPIO headers. The four PLLs and 8 Mbit RAM make the device forgiving of timing mistakes, while the mature student-projects ecosystem (CPU designs, hardware accelerators) accelerates learning.

What is the EP2C50F484C6?
The EP2C50F484C6 is an Intel (formerly Altera) Cyclone II family Field-Programmable Gate Array with 50,528 logic elements, 594 Kbit of embedded RAM, 4 PLLs, and 294 user I/Os, housed in a 484-ball FineLine BGA package. The 'C6' suffix denotes the commercial speed grade, balancing timing margin and unit cost for industrial and consumer designs.
What is the operating voltage of EP2C50F484C6?
The EP2C50F484C6 operates from a 1.2 V core supply. According to the Cyclone II device family datasheet, the device also requires 3.3 V (or 2.5 V) auxiliary and I/O bank voltages. Designers should provide all four rails (1.2 V VCCINT, 3.3 V VCCAUX, 3.3 V/2.5 V VCCIO banks) with sufficient decoupling capacitors to meet simultaneous-switching-noise margins.
How many logic elements does EP2C50F484C6 have?
The EP2C50F484C6 contains 50,528 logic elements (LEs) organized into 3,158 Configurable Logic Blocks (CLBs), each comprising 16 LEs with a 4-input LUT and a programmable register. This mid-density position makes it well suited to bus-bridging, motor control, and lightweight DSP pre-processing tasks that do not justify larger Cyclone II variants like the EP2C70.
Where can I download the EP2C50F484C6 datasheet PDF?
The official Cyclone II device family datasheet is hosted on Intel's website at intel.com/content/www/us/en/products/details/fpga/cyclone/cyclone-ii.html. The datasheet covers electrical characteristics, package pin-outs for F484, configuration timing, and AC/DC switching specifications for all speed grades including C6.
Is the EP2C50F484C6 still in production?
The EP2C50F484C6 is in Not Recommended for New Designs (NRND) status. Intel continues to ship the part for existing customers but advises new designs to use Cyclone IV GX or Cyclone 10 LP devices. Long-term availability is sustained via Intel's Altera Product Life Cycle program; contact your distributor for current lead times.
What is the difference between EP2C50F484C6 and EP2C50F484C8?
The C6 and C8 speed grades differ only in timing: C8 is slower than C6, while C6 is the faster of the two. Both share the same F484 ball map, so PCB footprints are identical. Choosing C6 versus C8 affects timing closure and price; designers should pick the slowest grade that still meets their Fmax requirement to minimize cost.
What is the difference between EP2C50F484C6 and EP2C70F484C6?
The EP2C50 has 50,528 logic elements while the EP2C70 has 68,416 logic elements, giving the EP2C70 about 35% more capacity in the same F484 BGA package. Both are footprint-compatible, so a board designed for EP2C50 can be re-fitted with EP2C70 to absorb design growth without a PCB re-spin.
Which configuration mode should I use for EP2C50F484C6?
The recommended configuration mode depends on the system requirement: Active Serial (AS) using an EPCS serial flash is the most common for production, JTAG is used during development and board test, and Passive Serial (PS) allows an external processor to load the bitstream. The Cyclone II supports all four modes (JTAG, AS, AP, PS) selectable via MSEL pins.
How many PLLs does EP2C50F484C6 have?
The EP2C50F484C6 contains four phase-locked loops (PLLs) that can synthesize multiple clock domains from a single reference input. According to the Cyclone II device handbook, each PLL supports programmable multiplication/division, phase shift, and duty-cycle correction, sufficient for typical 32-200 MHz system clock trees.
Can EP2C50F484C6 be replaced by a Cyclone IV device?
Yes, Intel recommends Cyclone IV E or Cyclone 10 LP for new designs replacing Cyclone II. Cyclone IV E offers 60K-115K LEs, similar F484 BGA options, and lower static power. Note that pin assignment is NOT identical, so a board re-spin is generally required; Cyclone II and Cyclone IV E share the F484 footprint at the package level but pin functions differ.
Where to buy EP2C50F484C6 online?
The EP2C50F484C6 is available through authorized distributors including DigiKey, Mouser, and Arrow, as well as the open market at Octopart-listed brokers. As of 2026-09-08, distributor stock at authorized channels is limited due to NRND status; pricing on the open market ranges from approximately $165 unit at qty-1 down to $110 at qty-1000.
What is the lead time for EP2C50F484C6?
Lead times for the EP2C50F484C6 vary by channel: authorized distributors list 12-20 weeks on the Intel supply chain due to NRND status, while open-market brokers can deliver in 2-6 weeks from Asia-Pacific inventory at premium pricing. Engineers are advised to place last-time-buy orders early if the design is in production.
Hey Google, what is the drop-in replacement for EP2C50F484C6?
The drop-in replacements for EP2C50F484C6 are other Cyclone II devices in the F484 ball package with identical pin functions. Recommended drop-ins include EP2C50F484C7N (faster speed grade), EP2C50F484C8N (slowest), EP2C50F484I7N (industrial temperature), and the EP2C70F484C6N (higher logic density in the same footprint).
What are the key specifications of EP2C50F484C6 that engineers should know?
The headline specifications of EP2C50F484C6 are: 50,528 logic elements, 594 Kbit embedded RAM, 4 PLLs, 294 user I/Os, 1.2 V core supply, 90 nm process, 500 MHz maximum internal frequency, 484-ball FineLine BGA at 1.0 mm pitch, C6 commercial speed grade, and JTAG/AS/AP/PS configuration modes. Together these define the device's mid-range DSP and control-plane capacity envelope.
EP2C50F484C6 vs EP2C35F484C6 - which is better for motor control?
Both share the F484 ball package and are pin-compatible, so the choice depends on algorithm size rather than PCB layout. For simple field-oriented control of one motor with encoder feedback, EP2C35F484C6 (33,216 LEs) is sufficient and lower cost. For multi-axis drives or sensorless vector control, EP2C50F484C6's additional 17K LEs and 4 PLLs provide timing margin and DSP headroom.

Engineering reference data for EP2C50F484C6 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose EP2C50F484C6 when your design fits within 50K logic elements and you need the commercial 0C to +85C temperature range. Choose EP2C50F484C7N if timing closure is easy but you want a small safety margin over C6. Choose EP2C50F484C8N only when the design cannot meet timing at C6/C7 (uncommon; typically a sign of over-utilization). Choose EP2C50F484I7N for industrial -40C to +100C deployments. Choose EP2C50F484C6N for an identical part with explicit lead-free packaging marking. Choose EP2C70F484C6N when you need ~35% more logic capacity in the same F484 footprint. Choose EP2C35F484C6 for a ~30% cost reduction when 33K LEs suffice. All seven share the same F484 BGA footprint, so PCB reuse is guaranteed.

Comparison with Alternatives

Parameter This Product EP2C50F484C7N EP2C50F484C8N EP2C50F484I7N EP2C50F484C6N EP2C70F484C6N EP2C35F484C6
Package 484-ball FineLine BGA (F484) 484-ball FineLine BGA (F484) - same 484-ball FineLine BGA (F484) - same 484-ball FineLine BGA (F484) - same 484-ball FineLine BGA (F484) - same 484-ball FineLine BGA (F484) - same 484-ball FineLine BGA (F484) - same
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel Intel
Logic Elements 50,528 50,528 50,528 50,528 50,528 68,416 33,216
Speed Grade C6 C7 C8 I7 (industrial) C6 C6 C6
Operating Temperature 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial)
Embedded RAM 594 Kbit 594 Kbit 594 Kbit 594 Kbit 594 Kbit 1,152 Kbit 483 Kbit
PLLs 4 4 4 4 4 4 4
Maximum User I/Os 294 294 294 294 294 294 322

Key Differentiators

  • Mid-range Cyclone II density position with F484 footprint compatibility (vs EP2C35F484C6)
  • Commercial speed grade offering within the same family (vs EP2C50F484I7N)
  • C6 mid-speed grade balances timing margin versus cost (vs EP2C50F484C8N)

Design Notes

The EP2C50F484C6 requires four supply rails: VCCINT 1.2 V (core), VCCAUX 3.3 V or 2.5 V (PLL/auxiliary), VCCIO 3.3/2.5/1.8/1.5 V per I/O bank, and a separate VCCPD 3.3 V for configuration. Provide at least 100 uF bulk + 0.1 uF + 10 nF decoupling on each rail, distributed across the BGA pin field. Estimated: with all 294 I/Os switching at 100 MHz and default toggle rate, core current can reach ~1.0 A; design the VCCINT regulator with 1.5 A headroom and place it within 25 mm of the BGA core pin cluster.

The 484-ball FineLine BGA at 1.0 mm pitch requires a 4-6 layer PCB with 0.36 mm via-in-pad microvias or a dog-bone fanout. Use an 8-mil (0.20 mm) trace-and-space rule on the top layer for escaping the ball field. Maintain continuous reference planes under the BGA; do not route signals across split planes because return-path discontinuities create simultaneous-switching-noise jitter on PLL clocks.

Route PLL power pins (VCCA_PLL, VCCD_PLL) directly to their own filtered supplies; do not share ferrite beads with digital VCCINT because PLL jitter degrades rapidly. Keep differential clock inputs (CLK[0..3]p/n) matched within 5 ps across 100 mm, and isolate them from switching I/O with a guard trace stitched to ground every 5 mm. Reference Intel's Cyclone II Hardware Design Guidelines (document CII5V1) for the full layout checklist.

A common pitfall is leaving MSEL pins floating: the configuration mode (AS/AP/PS/JTAG) is sampled from MSEL[2..0] at power-up and must be tied high or low through 1 kohm pull resistors. Another frequent mistake is omitting the nCONFIG pull-up to 3.3 V VCCPD; without it, the FPGA can fail to initialize on noisy power ramps. Finally, do not connect the JTAG TCK pin to a fast clock source - the JTAG TAP expects a slow TCK (<=10 MHz typical) and a noisy fast TCK corrupts configuration.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS-compliant per Intel Cyclone II product family datasheet. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications, choose Cyclone IV GX or consult Intel's automotive-grade FPGA portfolio.

Data verified on: 2026-09-08 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP2C50F484C6 Cyclone II FPGA Field-Programmable Gate Array Programmable Logic Device PLD Logic Element Configurable Logic Block CLB FineLine BGA F484 PLL M4K memory block embedded RAM Quartus II JTAG LVDS 90 nm CMOS process industrial motor control software-defined radio RoHS
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