Intel

EP2C50F484C7 - Cyclone II FPGA, 50K LE, 484-FBGA | Intel

MPN: EP2C50F484C7 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 484-ball FBGA Package C7 Speed
From $165 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $254.2 $254.20
10 $228.78 $2,287.80
100 $203.36 $20,336.00
500 $178 $89,000.00
1,000 $165 $165,000.00
ℹ️ All prices are in USD

EP2C50F484C7 Overview

The Intel (Altera) EP2C50F484C7 is a Cyclone II family Field-Programmable Gate Array (FPGA) delivering 50,528 logic elements, 594,432 bits of embedded RAM, and 294 user I/O pins in a 484-ball FineLine BGA package. The device is fabricated on a 90 nm low-k dielectric process and operates from a 1.2 V core supply with hot-socketing and PCI Express-friendly I/O support, enabling both standalone and bus-resident designs.

A Cyclone II FPGA is a SRAM-based programmable logic device that combines lookup-table-based logic blocks with embedded memory, embedded multipliers (DSP blocks), and phase-locked loops on a single die. In the broader system hierarchy, an FPGA sits below application-specific standard products (ASSPs) and above discrete logic gates, offering hardware-level parallelism that microcontrollers and DSPs cannot match. Designers use Cyclone II devices when time-to-market, design flexibility, or parallel signal processing outweigh the per-unit cost advantage of a hard-wired ASIC.

Key features of the EP2C50F484C7 include 50,528 logic elements (LEs), 129 M4K RAM blocks (594 Kbit total), 86 embedded 18 x 18 multipliers, four PLLs, and 294 maximum user I/Os. The 484-FBGA package supports a wide range of single-ended I/O standards (LVTTL, LVCMOS, SSTL, HSTL) plus differential standards (LVDS, RSDS, mini-LVDS, LVPECL) on selected pins, giving designers flexibility to bridge legacy and modern ASIC/ASSP interfaces.

The Cyclone II architecture uses a four-input LUT as the basic logic element, with a dedicated carry chain for fast arithmetic and a dedicated register per LE. Embedded multipliers are arranged in columns along the device, allowing DSP functions such as FIR filters and FFT butterflies to run at the full 402 MHz internal clock rate. The four PLLs provide clock multiplication, division, phase shifting, and duty-cycle control, which simplifies multi-clock-domain designs and reduces external clock-tree complexity.

Typical applications include industrial motor control and factory-automation backplanes, video-processing and image-pipeline front-ends, telecom line cards, low-cost software-defined radio prototyping, and PCI Express endpoint bridging. The 484-FBGA package makes the part suitable for board designs that need the highest I/O count in the Cyclone II family without stepping up to the larger Cyclone III/IV generations.

Designers should pay close attention to power-plane decoupling (multiple 0.1 uF and 10 uF caps near each VCC/GAT pair), JTAG chain ordering when multiple Altera/Intel devices share a bus, and configuration-mode selection between AS, PS, and JTAG. The device also requires a configuration flash or download cable for SRAM-based bitstream loading on every power-up.

This page combines distributor pricing, drop-in compatible alternatives in the same 484-FBGA footprint, and practical design notes not found in the standalone manufacturer datasheet, helping engineers select and source the EP2C50F484C7 with confidence.

Drop-in alternatives for EP2C50F484C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2C50F484C7 (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Configuration Modes.

Intel
Package: 484-pin FBGA (FineLine BGA)
Operating Temperature: 0 C to 85 C (Commercial)
Process Technology: 90 nm CMOS, 1.2 V core
Compare with EP2C50F484C7 →
Intel
Package: 484-ball FBGA (FineLine BGA)
Operating Temperature: 0C to +85C (commercial, 'C7' suffix)
Process Technology: 90 nm CMOS, SRAM-based
Compare with EP2C50F484C7 →
Altera
Speed Grade: 8
Operating Temperature: 0C to +85C (Commercial)
Process Technology: 90 nm CMOS
Compare with EP2C50F484C7 →
Intel
Package: 484-ball FineLine BGA (F484), 1.0 mm pitch
Speed Grade: C6
Operating Temperature: 0C to +85C (commercial)
Compare with EP2C50F484C7 →
Intel
Package: 484-ball BGA
Speed Grade: C6 (commercial)
Operating Temperature: 0 C to +85 C (commercial)
Compare with EP2C50F484C7 →
Intel
Package: 484-ball FineLine BGA (1.0 mm pitch)
Speed Grade: C7 (commercial)
Operating Temperature: 0 °C to +85 °C (commercial)
Compare with EP2C50F484C7 →
Intel
Package: 484-ball FineLine BGA
Speed Grade: C8 (commercial)
Operating Temperature: 0C to +85C (commercial)
Compare with EP2C50F484C7 →
Intel
Package: 484-ball FineLine BGA (FBGA)
Speed Grade: -8 (commercial, fast)
Operating Temperature: 0C to +85C (commercial, 'C' suffix)
Compare with EP2C50F484C7 →
Intel
Package: 484-ball FineLine BGA
Speed Grade: -8
Operating Temperature: -40C to +85C (Industrial)
Compare with EP2C50F484C7 →
Intel
Package: 484-ball FineLine BGA (U484 / 484-FBGA)
Speed Grade: 7
Operating Temperature: Commercial (0C to +85C)
Compare with EP2C50F484C7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2C50F484C6

✅ Drop-In
Intel
📦 484-FBGA
Cyclone II · 50,528 · 3,158 · 594,432 bit · M4K blocks, 4 Kbit each · 8 Mbit · 18-bit x 18-bit hardware multipliers · 4

✓ In Stock

$110 / Unit

View Datasheet →

EP2C50F484C6N

✅ Drop-In
Intel
📦 484-FBGA
Cyclone II · EP2C50F484C6N · Intel (formerly Altera) · 50,528 · 594,432 bits · 129 · 294 · 484-ball BGA

✓ In Stock

$180.47 / Unit

View Datasheet →

EP2C50F484C8N

✅ Drop-In
Intel
📦 484-FBGA
Cyclone II · EP2C50 · 50,528 · 594,432 · 250 M4K blocks · 294 · 86 · 4

✓ In Stock

$68.2 / Unit

View Datasheet →

EP2C35F484C7

✅ Drop-In
Intel
📦 484-FBGA
Cyclone II · Intel (formerly Altera) · 33,216 LE · 483,840 bits · 35 · 322 · 4

✓ In Stock

$54.25 / Unit

View Datasheet →

EP2C35F484C8

✅ Drop-In
Altera
📦 484-FBGA
Cyclone II · 33,216 · 483,840 · 322 · 2,100 · 35 · 4

✓ In Stock

$28.9 / Unit

View Datasheet →

EP2C35F484C7N

✅ Drop-In
Intel
📦 484-FBGA
Cyclone II · 33,216 · 483,840 bits · 105 · 35 · 322 · 484-ball FBGA (FineLine BGA) · 90 nm CMOS, SRAM-based

✓ In Stock

$85.2 / Unit

View Datasheet →

EP2C50F484C7 Maximum Ratings & Electrical Characteristics

Series Cyclone II
Family Cyclone II FPGA
Logic Elements 50,528
Total RAM Bits 594,432
Embedded Multipliers 86 (18 x 18)
Number of PLLs 4
Maximum User I/O 294
Core Voltage 1.2 V
Process Technology 90 nm
Package 484-ball FBGA
Package Code BGA
Mounting Type Surface Mount
Operating Temperature Range Commercial (0C to +85C) - inferred from speed grade C7
Speed Grade C7
Configuration Modes AS, PS, JTAG

EP2C50F484C7 bga Pin Configuration Guide

Pin configuration for EP2C50F484C7 (bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

bga package pinout diagram for EP2C50F484C7

No detailed pinout data available for EP2C50F484C7.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2C50F484C7 is suitable for 6 applications: Industrial Motor Control & Factory Automation, Video Processing & Image Pipeline, Telecom Line Cards & Baseband Processing, Software-Defined Radio Prototyping, PCI Express Endpoint Bridging & I/O Expansion, Development Boards & Education Platforms.

🏭

Industrial Motor Control & Factory Automation

The EP2C50F484C7's 50,528 logic elements and 86 embedded 18x18 multipliers make it a strong fit for multi-axis industrial motor control and factory-automation backplanes. Each axis typically requires PID loops, space-vector PWM generators, encoder quadrature decoders, and fault-handling state machines - easily fitting within ~3,000 LEs per axis, so the EP2C50F484C7 can drive up to 12-15 axes from a single device. The 294 user I/Os connect directly to incremental encoder inputs, Hall sensors, gate drivers, and isolated fieldbus interfaces (EtherCAT, Profibus, RS-485) without external bus switches. Designers typically configure the 4 on-chip PLLs to generate independent PWM frequencies (4-32 kHz) per axis with deterministic phase relationships.

📺

Video Processing & Image Pipeline

The EP2C50F484C7 is well-suited for mid-resolution video pipeline front-ends such as SD/HD video scaling, de-interlacing, color-space conversion, and on-screen-display overlay. With 594 Kbit of embedded RAM, the device can buffer multiple full video lines and implement line-store based algorithms like 3:2 pulldown and noise reduction. The 86 dedicated 18x18 multipliers enable real-time 2D convolution and edge-detection filters at pixel-clock rates up to 148 MHz, sufficient for 720p60 video. The 484-FBGA package exposes enough I/O for parallel RGB/YCbCr buses plus HSYNC/VSYNC and I2C control to typical LCD controller ASICs.

🌐

Telecom Line Cards & Baseband Processing

The EP2C50F484C7 can be deployed in telecom line cards for low-density baseband signal processing, packet classification, and protocol bridging. Its 594 Kbit embedded RAM is sufficient to buffer ATM/Ethernet cells or implement small lookup tables for routing, while the 86 multipliers support chip-rate processing and convolutional FEC decoding in software-defined access equipment. The 484-FBGA package supplies 294 user I/Os to bond out parallel LVDS links to network processors, framer ASICs, and SERDES devices without an external bus expander. PCI-compatible I/O banks enable direct connection to PowerPC or MIPS-based control processors.

✈️

Software-Defined Radio Prototyping

The EP2C50F484C7 is widely used as a prototyping platform for software-defined radio (SDR) baseband processing. With 86 embedded 18x18 multipliers and ~50K LEs, the device can implement multi-tap FIR filters, FFT/iFFT engines, digital up/down-converters, and symbol-mapper/demapper blocks for narrow-band waveforms (GSM, DVB, LTE uplink). The 4 PLLs provide independent sample-rate clocks for ADC/DAC interfaces, while the differential I/O pins support LVDS connections to high-speed converters. Quartus II reference designs and university SDR curricula use this exact part as a teaching and verification vehicle.

🖥️

PCI Express Endpoint Bridging & I/O Expansion

The EP2C50F484C7 supports PCI Express endpoint operation via external PHY plus an Altera-provided soft IP core, making it a cost-effective bridge between PCIe and legacy parallel buses such as PCI, ISA, or proprietary local buses. The 50K LEs comfortably host the PIPE interface, transaction layer, and data-path FIFOs, while 294 I/Os connect to the legacy bus and side-band signals (interrupts, GPIOs, I2C). 484-FBGA gives PCB designers the I/O headroom needed for x1 or x4 PCIe plus a full 32-bit/66 MHz parallel bus on the same device.

🧩

Development Boards & Education Platforms

The EP2C50F484C7 is a common heart of university FPGA curriculum boards and Altera/Intel Cyclone II starter kits (such as the Cyclone II EP2C35/EP2C50 dev board family). Its 484-FBGA package exposes enough LEDs, switches, seven-segment displays, and expansion headers to support teaching labs covering state machines, CPU cores, VGA controllers, and audio processing. The Quartus II Web Edition toolchain has been free for this device for years, and a rich ecosystem of example projects (Nios II soft CPU, RISC-V soft cores, SoC labs) is publicly available, making the part a pedagogical workhorse.

What is the EP2C50F484C7?
The EP2C50F484C7 is an Intel (formerly Altera) Cyclone II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA package. It contains 50,528 logic elements, 594 Kbit of embedded RAM, 86 embedded 18x18 multipliers, four PLLs, and 294 maximum user I/Os, running from a 1.2 V core supply on a 90 nm process.
How many logic elements does the EP2C50F484C7 have?
According to the Intel Cyclone II datasheet, the EP2C50F484C7 contains 50,528 logic elements (LEs) organized into LABs of 16 LEs each, plus 129 M4K RAM blocks totaling 594,432 bits. This places it in the upper-mid density range of the Cyclone II family, second only to the EP2C70 variant.
What package does the EP2C50F484C7 use?
The EP2C50F484C7 is packaged in a 484-ball FineLine BGA (FBGA) measuring 23 mm x 23 mm with a 1.0 mm ball pitch. The 'F484' in the part number encodes this package; 'C7' denotes the commercial temperature grade and -7 speed grade.
Where can I buy the EP2C50F484C7 online?
The EP2C50F484C7 is available from authorized distributors including DigiKey (P/N 1468659), Mouser, Octopart-listed brokers, and Heisener (which currently lists ~5,920 pieces in stock as of 2026-09-08). Pricing begins around $254.20 at qty-1 and decreases for higher volume breaks; lead time is typically 3-5 days from stocking distributors.
What is the price of the EP2C50F484C7?
As of 2026-09-08, distributor pricing for the EP2C50F484C7 starts at approximately $254.20 at qty-1 from Heisener, dropping to roughly $228.78 at qty-10 and $165 at qty-1,000. DigiKey and Mouser list similar pricing with real-time inventory; broker stock on Octopart can be lower but carries supply-chain risk.
What is the lead time for the EP2C50F484C7?
Distributor-stocked units of the EP2C50F484C7 typically ship within 3-5 business days from DigiKey or Mouser, while Heisener lists an estimated delivery window of Mar 27 - Apr 1 for in-stock pieces as of 2026-09-08. Factory-direct lead times for production orders are longer and should be confirmed with Intel/Altera franchised distributors.
Is the EP2C50F484C7 in stock?
Yes, the EP2C50F484C7 is in stock at multiple authorized distributors as of 2026-09-08. Heisener reports approximately 5,920 pieces immediately available; DigiKey and Mouser list real-time inventory through their websites. Given the part's active lifecycle, multi-thousand-piece volumes can typically be sourced within standard lead-time windows.
What is the difference between EP2C50F484C7 and EP2C50F484C6?
The EP2C50F484C7 and EP2C50F484C6 share the same Cyclone II die, 484-FBGA package, and 50,528 logic elements; the only difference is the speed grade (-7 is slower than -6). A -6 part is faster and may also command a price premium, while the -7 is the more commonly stocked variant - both are pin-to-pin compatible drop-in replacements.
EP2C50F484C7 vs EP2C5F256C8N - which is better for industrial control?
The EP2C50F484C7 has roughly 10x the logic capacity (50,528 LEs vs ~5,000 LEs) and twice the embedded RAM of the EP2C5F256C8N, but ships in a larger 484-FBGA vs 256-FBGA. For industrial control with significant logic or DSP processing, the EP2C50F484C7 is the clear choice; for low-density glue logic, the EP2C5F256C8N saves PCB area and cost.
When should I choose the EP2C50F484C7 over the EP2C50F484I8N?
Choose the EP2C50F484C7 (commercial 0C to +85C, speed grade -7) for cost-sensitive commercial products such as consumer video, factory-floor controllers in climate-controlled cabinets, or development boards. Choose the EP2C50F484I8N (industrial -40C to +100C, speed grade -8) for outdoor, automotive, or harsh-environment applications that exceed commercial temperature limits.
What is the best drop-in replacement for the EP2C50F484C7?
The best drop-in replacement for the EP2C50F484C7 in the same 484-FBGA footprint is the EP2C50F484C6N, which shares the identical die and pinout but offers a faster -6 speed grade. For new designs that do not require Cyclone II compatibility, the Cyclone IV EP4CE50F484 is a logical migration path with similar LE count and the same 484-FBGA footprint.
Can EP2C50F484C8N replace EP2C50F484C7?
Yes, the EP2C50F484C8N is a direct drop-in replacement for the EP2C50F484C7 in the same 484-FBGA package. It uses a faster -8 speed grade and is industrial-grade; both parts share identical pinout, JTAG chain, configuration interface, and Quartus II bitstream compatibility, allowing PCB-level substitution without layout changes.
Where to download the EP2C50F484C7 datasheet PDF?
The official Cyclone II family datasheet (which covers the EP2C50F484C7) can be downloaded as a PDF from the Intel/Altera literature site at https://www.altera.com/literature/hb/cyc2/cyc2_handbook.pdf. Mirror copies are also available from distributors such as AiPCBA, ABC-Semi, and Datasheets.com; always cross-reference with the latest Quartus II device support files.
Where can I find the EP2C50F484C7 pinout?
The complete 484-ball pinout for the EP2C50F484C7 is published in chapter 5 of the Cyclone II Device Handbook (file cyc2_handbook.pdf). It includes dedicated JTAG, configuration, power, and ground balls, with all 294 user I/O balls supporting both single-ended and selected differential I/O standards - consult the handbook for ball-map coordinates.
What is the best Lattice equivalent for the EP2C50F484C7?
There is no true pin-compatible Lattice drop-in replacement for the EP2C50F484C7 in the 484-FBGA footprint, because Lattice ECP2-series FPGAs use different BGA pinouts. The closest functional equivalents in capacity are the Lattice ECP2-50 (50K LUTs) or Lattice ECP3-70, both of which require PCB redesign - they are not drop-in compatible.

Engineering reference data for EP2C50F484C7 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2C50F484C7 when you need 50K LEs of Cyclone II logic in the 484-FBGA package at commercial temperature with the standard -7 speed grade, such as for industrial controllers, video pipelines, or SDR prototypes. For designs that need faster timing closure, switch to the EP2C50F484C6 (-6 speed grade) - drop-in compatible in the same footprint. For harsh environments, choose the EP2C50F484C8N (industrial temperature, lead-free). If you only need ~33K LEs and want cost savings, the EP2C35F484C7 in the same 484-FBGA is a true drop-in alternative at ~70% of the die density. For new designs, consider the Cyclone IV EP4CE50 family as a migration path, noting that the pinout is not drop-in.

Comparison with Alternatives

Parameter This Product EP2C50F484C6 EP2C50F484C6N EP2C50F484C8N EP2C35F484C7
Package 484-FBGA (F484) 484-FBGA - same 484-FBGA - same 484-FBGA - same 484-FBGA - same
Brand Intel (formerly Altera) Intel - same Intel - same Intel - same Intel - same
Logic Elements 50,528 50,528 50,528 50,528 33,216 (~34% less)
Total RAM Bits 594,432 594,432 594,432 594,432 483,840
Embedded Multipliers (18x18) 86 86 86 86 70 (~19% fewer)
PLLs 4 4 4 4 4
Max User I/O 294 294 294 294 322 (larger I/O count)
Speed Grade -7 -6 (faster) -6 (faster) -8 (faster) -7 (same)
Temperature Grade Commercial (0C to +85C) Commercial Commercial, lead-free Industrial (-40C to +100C), lead-free Commercial

Key Differentiators

  • Highest logic density in the Cyclone II family below the EP2C70 (vs EP2C35F484C7)
  • Same die across C6/C7/C8 speed grades simplifies inventory (vs EP2C50F484C6)
  • 294 user I/Os enables dense parallel-bus bridging (vs EP2C50F484C6N)

Design Notes

Cyclone II EP2C50 devices draw up to ~1.5 W quiescent and substantially more under high toggle rates. Decouple each VCCINT (1.2 V) and VCCIO (per-bank) ball group with a 0.1 uF X7R ceramic plus a bulk 10 uF tantalum or polymer capacitor placed within 5 mm of the BGA. Use at least four-layer PCB with continuous power and ground planes; a six-layer stack-up is recommended for designs switching >100 MHz clocks to suppress SSN.

The 484-FBGA has a 1.0 mm ball pitch, requiring laser-drilled or 0.4 mm-pitch vias on the top layer with microvia stack-up if available. Route differential pairs (LVDS, RSDS) with 100 ohm differential impedance and length-matching to within 150 mil. Keep all configuration pins (MSEL, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK) routed short and isolated from switching I/O to avoid bitstream-loading glitches during AS or PS configuration.

Do not assume Cyclone II EP2C50 is hot-swappable at the I/O level unless all I/O banks are powered and IOH/IOH clamp diodes are accounted for. Cyclone II supports hot-socketing on most I/O, but VCCIO must sequence within datasheet limits or latch-up may occur. Also verify Quartus II version compatibility - bitstreams generated for newer Cyclone families will not load on Cyclone II silicon even if pin-compatible at the package level.

The EP2C50F484C7 484-FBGA has theta_JA of approximately 15 C/W with a properly designed 4-layer PCB. Under worst-case commercial operating conditions (85C ambient, high toggle rate, 1.2 V VCCINT), designers should budget <1.0 W continuous dissipation or apply forced-air cooling to keep junction temperature below 100C. The exposed thermal pad is not present on this package - thermal relief relies entirely on via-in-pad to internal planes.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS/REACH/lead-free status not provided in verified web data; check manufacturer product page for latest compliance certificates. The EP2C50F484C7 is commercial-grade (not AEC-Q100).

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP2C50F484C7 Cyclone II FPGA Field-Programmable Gate Array SRAM-based logic logic element LE LAB M4K RAM block embedded multiplier DSP block PLL phase-locked loop 484-FBGA FineLine BGA BGA surface mount 1.2 V core 90 nm process LVDS SSTL HSTL JTAG Quartus II PCI Express Nios II AS configuration PS configuration RoHS AEC-Q100 industrial motor control factory automation video processing software-defined radio telecom line card PCI Express endpoint
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