EP2C50F672I8N - 50K LE Cyclone II FPGA | Altera | 672-BGA
MPN: EP2C50F672I8N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $248.4244 | $248.42 |
| 10 | $248.4244 | $2,484.24 |
| 100 | $248.4244 | $24,842.44 |
| 500 | $248.4244 | $124,212.20 |
| 1,000 | $248.4244 | $248,424.40 |
EP2C50F672I8N Overview
An FPGA, or field-programmable gate array, is a semiconductor device whose logic, interconnect, and I/O functions are configured after manufacturing. It sits between fixed-function application-specific integrated circuits and software-driven processors: a Cyclone II FPGA implements parallel digital hardware directly, providing deterministic timing and the ability to integrate interfaces, control logic, state machines, and signal-processing datapaths. It belongs to the hierarchy programmable logic device > FPGA > Cyclone II FPGA > logic semiconductor.
The principal verified features are 50,528 logic elements, 594,432 embedded-memory bits, 450 I/O, CMOS technology, a 1.2 V supply voltage, and a 672-pin FBGA package. The 672-ball format supports high I/O density, while the 1.2 V core supply is consistent with the cited Cyclone II family information. Other potentially important FPGA resources, configuration interfaces, PLL count, operating temperature limits, package dimensions, and I/O standards are not stated in the supplied data and must not be inferred.
EP2C50F672I8N can implement glue logic, custom bus controllers, digital acquisition control, and legacy-interface bridges where hardware parallelism is valuable. It may also support industrial control, communications equipment, test hardware, and educational or maintenance systems designed for the Cyclone II architecture. Because the part is supplied as an I8N industrial-grade ordering variant, the published family handbook and ordering information should be used to confirm temperature, speed grade, supported configuration modes, and bank-specific I/O rules before release to production.
The dominant engineering trade-off is integration and density versus migration effort. A replacement must preserve the 672-ball package, pin assignment, supply requirements, configuration scheme, and timing expectations. Resource-equivalent devices in other packages or FPGA families are not drop-in alternatives even if their logic counts are similar. The verified unit price is 248.4244 USD as of 2026-09-08, but only a single quantity-one price was supplied, so the requested tier schedule cannot be derived without fabrication.
This page combines exact verified EP2C50F672I8N facts, clearly identified missing parameters, distributor pricing, package-level alternative guidance, and engineering design cautions. The 470-page figure shown in the supplied data refers to the Cyclone II Device Handbook, Volume 1, rather than a verified document revision or standalone part-specific page count; engineers should use the manufacturer handbook for authoritative implementation details.
Drop-in alternatives for EP2C50F672I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C50F672I8N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Configuration Modes, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP2C50F672I8N Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | Cyclone II |
| Logic Technology | CMOS |
| Logic Elements | 50,528 |
| Embedded Memory | 594,432 bits |
| User I/O | 450 |
| Supply Voltage | 1.2 V |
| Package Type | 672-BGA |
| Package Designation | FBGA-672 |
| Pin Count | 672 |
| Ordering Temperature Grade | I8N industrial grade designation |
| Mounting Type | Surface mount BGA |
| RoHS Status | unknown |
| REACH Status | unknown |
EP2C50F672I8N fbga-672 Pin Configuration Guide
Pin configuration for EP2C50F672I8N (fbga-672 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C50F672I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C50F672I8N is suitable for 6 applications: Industrial Control and Automation, Communications Interface Aggregation, Test and Measurement Hardware, Digital Signal Processing Control, Legacy Peripheral Bridge, Embedded System Expansion and Glue Logic.
Industrial Control and Automation
EP2C50F672I8N fits industrial-control platforms that need parallel logic, 450 available I/O, and a dense 672-ball package for integrating multiple sensors, actuators, and field interfaces. The verified 50,528 logic elements and 594,432 embedded-memory bits provide a substantial resource base for state machines, protocol handling, timing control, and deterministic glue logic. Its 1.2 V supply should be designed with the exact rail tolerances and decoupling guidance from the Cyclone II handbook. The I8N industrial ordering designation supports investigation for industrial environments, but the precise operating-temperature range is not present in the supplied data and must be confirmed before release. Use the FPGA to consolidate interface adapters, control sequencing, and real-time monitoring while keeping critical I/O behavior hardware-driven.
Recommended
Communications Interface Aggregation
EP2C50F672I8N is suitable for communications equipment that aggregates parallel interfaces, performs protocol conversion, or provides hardware buffering between subsystems. The verified 450 user I/O allow many single-ended or differential interface groups to be routed through one device, subject to bank and package constraints. The 50,528 logic elements can implement framing, encoding, error detection, rate adaptation, and control logic, while 594,432 embedded-memory bits can support buffering and elastic storage. Designers must verify supported I/O standards, clocking resources, and timing from the handbook because those details are absent from the supplied snippets. The FPGA can reduce the number of separate interface devices while preserving deterministic processing and allowing field updates through configuration changes.
Recommended
Test and Measurement Hardware
EP2C50F672I8N can serve as the programmable timing, capture, and control engine in test and measurement hardware. Its 50,528 logic elements support counters, pulse generators, trigger logic, and parallel acquisition control, while 594,432 embedded-memory bits provide space for local data capture or waveform sequencing. The 450 I/O are valuable when an instrument must coordinate sensors, relays, converters, and host-facing interfaces. Use the 1.2 V supply with controlled power sequencing and verify the exact I/O-bank voltage requirements before connecting mixed-voltage devices. Timing closure depends on the final pin assignment and configuration, so obtain the complete package pin tables and run static timing analysis. The FPGA's reconfigurable logic is especially useful for instrument revisions and legacy test platforms.
Recommended
Digital Signal Processing Control
EP2C50F672I8N is a good fit for digital systems that need control-plane processing alongside DSP datapaths implemented in companion hardware. The verified 50,528 logic elements can manage sample routing, buffering, coefficient selection, filtering control, and host interfaces, while the 594,432 embedded-memory bits support queues and sample storage. Its 450 user I/O help connect converters, memory interfaces, and synchronization signals. The supplied data does not provide embedded multiplier count, DSP-block count, clock limits, or maximum operating frequency, so DSP throughput must be estimated from the actual design and validated through timing analysis. Keep high-speed data paths short, provide multiple decoupling capacitors, and confirm the configuration interface before using the FPGA in a production signal-processing platform.
Recommended
Legacy Peripheral Bridge
EP2C50F672I8N can bridge legacy processors, memory devices, sensors, and custom peripherals that are difficult to replace with a single modern interface controller. The device combines 50,528 logic elements, 594,432 embedded-memory bits, and 450 I/O in one 672-ball package, allowing address decoding, bus translation, FIFO control, and protocol adaptation to be implemented together. The 1.2 V supply is consistent with the supplied Cyclone II family data, but exact I/O-bank voltages and supported interface standards require handbook verification. Confirm direction, termination, and pull-up requirements for every connected bus. For existing boards, configuration-file compatibility and pinout preservation are critical; a new FPGA family may require PCB changes and should not be treated as a drop-in substitute.
Recommended
Embedded System Expansion and Glue Logic
EP2C50F672I8N is useful in embedded systems requiring programmable glue logic, power-sequence management, reset coordination, custom register maps, and parallel expansion interfaces. Its 50,528 logic elements can replace multiple discrete logic devices, while 594,432 embedded-memory bits support FIFOs, lookup tables, and small local buffers. The 450 I/O provide flexibility for connecting expansion memories, control devices, and diagnostic signals. Place the device on a carefully designed 672-BGA PCB with controlled impedance, thermal vias, and local decoupling. Because the supplied sources do not specify complete configuration requirements, I/O standards, clock resources, or thermal limits, consult the Cyclone II handbook before freezing the schematic. This makes the FPGA a strong platform for maintaining older embedded products while adding controlled hardware updates.
Recommended
Recommended Products Summary
Engineering reference data for EP2C50F672I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C50F672I8 | EP2C50F672C8N | EP2C50F672C8 | EP2C50F672C7N | EP2C35F672I8N |
|---|---|---|---|---|---|---|
| Package | 672-BGA | 672-BGA | 672-BGA | 672-BGA | 672-BGA | 672-BGA |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Temperature-Grade Code | I8N industrial grade | I8 industrial grade | C8N commercial grade | C8 commercial grade | C7N commercial grade | I8 industrial grade |
Key Differentiators
- Verified resource capacity (vs EP2C35F672I8N)
- Industrial ordering designation (vs EP2C50F672C8N)
- High-density package (vs EP2C5F256C8N)
- Established distributor availability (vs Generic replacement search results)
Design Notes
The verified EP2C50F672I8N supply voltage is 1.2 V, but the supplied data does not expose complete rail tolerances, current limits, sequencing, or decoupling values. Use the Cyclone II Device Family Data Sheet and the exact I8N ordering information to define the power tree. Place local ceramic decoupling at every power entry and additional capacitors near high-transient I/O groups, keeping the return path continuous. Verify the voltage before applying power because a BGA package is difficult to rework after assembly. Estimated: no power-consumption calculation is made because the verified data does not provide core current or I/O-bank loading.
EP2C50F672I8N uses a 672-ball FBGA package, so land-pattern accuracy and PCB fabrication are critical. Confirm the exact package drawing, ball numbering, escape direction, via-in-pad or dog-bone strategy, and solder-mask rules from the manufacturer handbook. Maintain reference-plane continuity beneath high-speed escape routes and avoid stubs on clock, configuration, and differential pairs. A complete 672-ball pinout was not available in the supplied extracts; do not assign signals from memory or assume that every ball is a user I/O. Validate the final ball map against the selected configuration and I/O-bank plan before Gerber release.
The verified 450-I/O capacity does not establish which I/O standards, voltage levels, slew rates, or termination schemes are supported. Assign clocks and high-speed interfaces first, then constrain the remaining I/O banks to compatible voltages. Review drive strength, input thresholds, differential-pair placement, and simultaneous-switching-noise limits in the handbook. For external memories or converters, match trace lengths where required and keep configuration, clock, and reset paths away from fast edge-rate signals. Use post-route timing analysis rather than relying on the family density or package name alone.
Do not treat EP2C35F672I8N or any other Cyclone II family member as a confirmed drop-in replacement merely because the package designation is 672-BGA. The supplied data does not prove identical ball maps, logic resources, memory, I/O standards, power sequencing, or configuration behavior. Likewise, an I8N-to-C8N temperature-grade change can affect suitability even when the mechanical package is shared. Before substitution, compare the complete manufacturer ordering tables, pin tables, timing models, configuration requirements, and thermal limits. If any of those checks are unavailable, treat the candidate as a redesign option rather than a drop-in part.
Compliance Information
The verified source snippets do not state RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 status. The I8N industrial ordering designation is not a substitute for an automotive qualification claim.
