EP2C50F672C7N - Cyclone II FPGA 50K LE 672-FBGA | Intel / Altera
MPN: EP2C50F672C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $250.17 | $250.17 |
| 10 | $232.5 | $2,325.00 |
| 100 | $198.4 | $19,840.00 |
| 500 | $175.25 | $87,625.00 |
| 1,000 | $162.8 | $162,800.00 |
EP2C50F672C7N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and dedicated I/O cells. FPGAs occupy a unique position in the digital design hierarchy: they sit between fixed-function ASICs (high NRE, low per-unit cost) and microcontrollers (low performance, sequential execution), offering hardware-level parallelism with reprogrammability. The Cyclone II family specifically targets cost-sensitive applications that previously required mask-programmed ASICs, making it suitable for volume production in industrial, automotive, communications, and consumer markets.
Key features include 450 dedicated user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards; embedded 18x18 multipliers for DSP arithmetic; up to 594 Kbits of embedded M4K memory blocks (configurable as RAM, ROM, or FIFO); and a flexible clock management infrastructure with PLLs. The 672-FBGA package exposes the full I/O count of the device, enabling high-density board designs where every signal pin must be brought out.
Architecturally, Cyclone II devices use a four-input LUT-based logic element backed by a programmable routing fabric. The 90 nm process provides a favorable performance-to-cost balance and supports embedded RAM blocks with true dual-port capability. The device is supported by the Quartus II design toolchain (including Quartus Prime), which provides synthesis, place-and-route, timing analysis, and configuration generation.
Typical applications include industrial motor control, video processing pipelines, software-defined radio baseband, prototyping ASIC designs, embedded control systems, and high-density glue logic. The combination of 50K LEs, 450 I/Os, and BGA packaging makes this part especially attractive for space-constrained boards that require maximum logic density and signal count.
When designing with this part, allocate at least four PCB layers for power, ground, and signal routing, and follow Altera's decoupling and BGA breakout guidelines to maintain signal integrity on high-speed LVDS pairs.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternative MPNs across Intel/Altera Cyclone families, and practical design notes not found in the standalone manufacturer datasheet PDF.
Drop-in alternatives for EP2C50F672C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C50F672C7N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C50F672C6N
✅ Drop-In✓ In Stock
$119 / Unit
View Datasheet →EP2C50F672C8N
✅ Drop-In✓ In Stock
$148.75 / Unit
View Datasheet →EP2C35F672C7N
✅ Drop-In✓ In Stock
$98 / Unit
View Datasheet →EP2C50F672C7
✅ Drop-In✓ In Stock
$184.59 / Unit
View Datasheet →EP2C35F672C8N
✅ Drop-In✓ In Stock
$77.14 / Unit
View Datasheet →EP2C35F672C6N
✅ Drop-In✓ In Stock
$122.5 / Unit
View Datasheet →EP2C50F672C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 50,528 |
| Total RAM Bits | 594,432 |
| Embedded Memory | 594 Kbit (M4K blocks) |
| Number of I/O Pins | 450 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Maximum Internal Frequency | 402.58 MHz |
| Package | 672-BGA (FBGA) |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 7 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Programming Toolchain | Quartus II / Quartus Prime |
EP2C50F672C7N 672-bga (fbga) Pin Configuration Guide
Pin configuration for EP2C50F672C7N (672-bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C50F672C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C50F672C7N is suitable for 6 applications: Industrial Motor Control, Video Processing Pipeline, ASIC Prototyping Platform, Software Defined Radio Baseband, Embedded Control Systems, High-Density Glue Logic Replacement.
Industrial Motor Control
The EP2C50F672C7N fits industrial motor control applications because its 50,528 logic elements can host multiple PID control loops, encoder feedback handlers, and PWM generation blocks simultaneously. The 450 user I/Os in the 672-FBGA package support direct connection to multi-axis drive stages, optocoupler-isolated gate drivers, and incremental encoder inputs, eliminating external multiplexer ICs. The M4K memory blocks provide deterministic capture buffers for high-speed current sensing at typical PWM frequencies of 10-20 kHz. Industrial-grade Cyclone II variants (EP2C50F672I7N) are also available for harsher environments, but the commercial C-grade part is suitable for enclosed cabinet installations.
Recommended
Video Processing Pipeline
The EP2C50F672C7N supports video processing pipelines with native LVDS I/O for direct camera or display interfacing, eliminating external serializer/deserializer ICs. The 50K logic elements accommodate real-time image processing functions like color space conversion, edge detection, and histogram equalization at common resolutions up to 720p at 60 fps. The 594,432 bits of M4K RAM provide line buffers and frame buffers sufficient for several scan lines of video at typical pixel widths. Designers pair this part with external DDR memory for full frame buffering using the FPGA's soft memory controller, leveraging the high I/O count for wide memory bus connections.
Recommended
ASIC Prototyping Platform
The EP2C50F672C7N serves as an ideal ASIC prototyping platform because the Quartus II toolchain provides direct migration paths from FPGA prototype to ASIC tape-out. With 50,528 logic elements, the EP2C50 can host medium-complexity ASIC designs including control logic, glue logic, and moderate DSP blocks at near-real-time operating speeds. The 450 user I/Os expose every ASIC pin through the 672-FBGA package, enabling prototype verification of pin-by-pin ASIC behavior. The mature 90 nm silicon provides well-characterized timing closure and predictable performance for ASIC customer demonstrations.
Recommended
Software Defined Radio Baseband
The EP2C50F672C7N handles software defined radio baseband processing where its 18x18 hardware multipliers support real-time channel filtering, modulation, and demodulation algorithms. With a typical utilization of 30-50% of available LEs, designers can implement complete PHY-layer processing for narrowband protocols like LoRa, Sigfox, or proprietary ISM-band schemes operating below 500 MHz. The high I/O count enables direct connection to RF front-end ICs, ADCs, and DACs without external buffering. M4K memory blocks provide sample-rate buffering for symbol synchronization loops.
Recommended
Embedded Control Systems
The EP2C50F672C7N enables embedded control systems with custom soft-core CPUs (Nios II/e or Nios II/f) plus dedicated peripherals, all within a single FPGA. The 50K LEs can host a Nios II/f processor with cache, interrupt controller, timer blocks, and custom instruction accelerators - replacing discrete microcontroller plus glue logic in space-constrained designs. The 594 Kbit embedded RAM provides deterministic scratchpad memory for real-time control loops. With 450 user I/Os, the EP2C50 supports multi-bus architectures like SPI, I2C, UART, and CAN simultaneously without external bridging.
Recommended
High-Density Glue Logic Replacement
The EP2C50F672C7N replaces multiple discrete logic ICs (CPLDs, bus transceivers, AND/OR gates, FIFOs) by integrating all functions into a single programmable device. With 450 user I/Os, the EP2C50 can replace entire discrete logic sections containing 20-30 separate ICs, simplifying PCB layout, reducing BOM cost, and improving reliability by eliminating chip-to-chip interconnect. Designers often migrate existing discrete-logic designs to the Cyclone II family to handle end-of-life notifications on legacy logic families. The Quartus toolchain provides direct conversion paths from schematic-based designs to HDL.
Recommended
Recommended Products Summary
Engineering reference data for EP2C50F672C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C50F672C6N | EP2C50F672C8N | EP2C35F672C7N | EP2C50F672C7 | EP2C35F672C8N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,528 | 50,528 (same) | 50,528 (same) | 33,216 (-34%) | 50,528 (same) | 33,216 (-34%) |
| Total RAM Bits | 594,432 | 594,432 (same) | 594,432 (same) | 483,840 (-19%) | 594,432 (same) | 483,840 (-19%) |
| User I/Os | 450 | 450 (same) | 450 (same) | 450 (same) | 450 (same) | 450 (same) |
| Speed Grade | 7 | 6 (slower) | 8 (faster) | 7 (same) | 7 (same) | 8 (faster) |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
Key Differentiators
- Maximum logic density in Cyclone II family with 450 user I/Os (vs EP2C35F672C7N)
- Speed grade 7 offers balanced timing closure (vs EP2C50F672C8N)
- Same die as EP2C50 family variants - design portability (vs EP2C20F256C8N)
- Highest I/O count available for Cyclone II (vs EP2C50F484I8N)
Design Notes
The EP2C50F672C7N requires at least three power rails: VCCINT (1.2 V core), VCCIO (3.3 V, 2.5 V, 1.8 V, or 1.5 V per bank), and VCCA_PLL (2.5 V for PLL analog supply). Estimated: at typical utilization with VCCINT drawing 300 mA, the core power is approximately 0.36 W, plus VCCIO power which scales with toggle rate. Place 0.1 uF decoupling capacitors within 100 mils of every VCCINT/VCCIO pin pair and bulk capacitors (10-22 uF) at each supply plane transition. A ferrite bead isolating the PLL supply is recommended per the Cyclone II handbook pin connection guidelines.
The 672-FBGA package requires at minimum a 4-layer PCB with microvia or via-in-pad technology for clean signal breakout. Estimate: at 1.0 mm pitch, the BGA ball diameter is 0.5 mm requiring 0.6-0.8 mm via pads and 0.1 mm trace/spacing rules. Route all signals on outer layers with a continuous ground plane on layer 2 for return path integrity. Multiple GND balls in the center of the BGA should be stitched directly to the inner ground plane with thermal vias. The Cyclone II hardware reference designs from Intel provide exact stackup recommendations.
LVDS pairs on the EP2C50F672C7N require matched-length routing - the differential pair length mismatch should not exceed 150 mils according to the Cyclone II device handbook. Each LVDS pair must stay within the same I/O bank, with both signals on the same layer and no more than two vias per signal. Series termination resistors (100 ohm differential) are required near the transmitter for proper LVDS swing. For high-speed LVDS at 840 Mbps, use 50 ohm controlled-impedance stripline or microstrip routing with reference planes intact beneath the trace path.
Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating - they require external 10 kohm pull-up resistors on TMS and TDI per the Cyclone II handbook. Configuration mode pins MSEL[2:0] must be tied to specific logic levels for the desired configuration mode (AS, PS, JTAG) - floating MSEL pins cause configuration failure. Do not confuse VCCIO bank voltages - each I/O bank can support a different VCCIO voltage, but mixing 3.3 V and 1.5 V signaling in the same bank without proper level shifting damages the I/O cells.
Estimated: the 672-FBGA package thermal resistance (theta JA) is approximately 12 C/W with proper PCB layout. At a typical mid-utilization design consuming 2 W total power, junction temperature rise is 24 C above ambient. The commercial C-grade part is rated to 0 to +85 C junction temperature, leaving significant thermal margin. For full-utilization designs approaching 5 W, forced airflow at 200 LFM is recommended. The center GND balls act as the primary thermal path - sufficient ground-plane stitching prevents thermal runaway.
Compliance Information
RoHS compliant per distributor listing. Not AEC-Q100 qualified - this is a commercial-grade FPGA. Industrial temperature grade variant EP2C50F672I7N is available for harsh-environment applications but is not AEC-Q100 qualified either.
