EP2C50F672C6N - 50K LE Cyclone II FPGA, 672-BGA | Intel / Altera
MPN: EP2C50F672C6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $148 | $14,800.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $119 | $119,000.00 |
EP2C50F672C6N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor IC built from a matrix of programmable logic blocks, interconnect, and I/O cells that the designer configures after manufacture using a hardware description language. Within the wider programmable logic taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) under Programmable Logic Devices, which in turn belong to the broader digital semiconductor / logic IC category. Cyclone II specifically targets high-volume, low-power applications where ASIC NRE is unjustified.
Key features of the EP2C50F672C6N include 50,528 logic elements, 594 Kbits of M4K embedded memory blocks, 150 embedded 18x18 multipliers (for lightweight DSP), 4 PLLs, and 450 user I/Os. The device supports LVCMOS, LVTTL, SSTL, LVDS, and RSDS I/O standards, plus DDR/QDR memory interfaces. Configuration is via active serial (AS), passive serial (PS), JTAG, or Fast Passive Parallel (FPP). The 672-pin FineLine BGA package has 1.0 mm ball pitch and is RoHS-compliant lead-free.
The Cyclone II architecture uses 4-input LUTs, M4K memory blocks (each 4 Kbits with parity), and dedicated multiplier blocks that enable cost-effective DSP pipelines. The 4 PLLs provide flexible clock synthesis and zero-delay buffering, while the LVDS support enables gigabit-class source-synchronous links without external transceivers. The -6 speed grade is the mid-tier offering; -7 is faster and -8 is the slowest, with the C6 industrial temperature range (0C to +85C, junction) covering commercial / industrial deployments.
Typical applications include industrial motor control and machine vision, video processing and display controllers, PCIe endpoint bridges, telecom line cards, test and measurement equipment, and educational / prototyping platforms where Cyclone II development boards (e.g., DE2) are widely used. The device is also commonly found in legacy designs that pre-date Cyclone IV / Cyclone V migrations.
When designing with the EP2C50F672C6N, note that the EP2C50F672C6N is the lead-free, commercial-temperature (-C6 = 0C to +85C junction) variant of the 672-ball FineLine BGA; the EP2C50F672I6N offers industrial (-40C to +100C junction) qualification. Quartus II software is the required design toolchain. Ensure proper power decoupling, JTAG chain integrity, and banked I/O voltage reference planning to avoid configuration failures.
This page synthesizes distributor pricing, pin-compatible Cyclone II same-package alternatives, and practical design guidance not found in the manufacturer datasheet alone - giving engineers a single reference for selection, replacement, and design-in decisions.
Drop-in alternatives for EP2C50F672C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C50F672C6N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, RoHS Status, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C50F672C6
✅ Drop-In✓ In Stock
$55.95 / Unit
View Datasheet →EP2C50F672C6N
✅ Drop-In✓ In Stock
$119 / Unit
View Datasheet →EP2C50F672I6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP2C35F672C6N
✅ Drop-In✓ In Stock
$122.5 / Unit
View Datasheet →EP2C50F672C7N
✅ Drop-In✓ In Stock
$162.8 / Unit
View Datasheet →EP2C50F672C6N Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Number of Logic Elements (LE) | 50,528 |
| Number of Configurable Logic Blocks (CLB) | 3,158 |
| Total Embedded Memory | 594,432 bits (594 Kbits) |
| Number of M4K Memory Blocks | 129 |
| Embedded 18x18 Multipliers | 150 |
| Number of PLLs | 4 |
| User I/Os | 450 |
| Operating Supply Voltage (Core) | 1.15 V to 1.25 V |
| Operating Temperature | 0C to +85C (commercial junction, -C6 grade) |
| Speed Grade | -6 (mid-tier) |
| Package | 672-ball FineLine BGA (FBGA-672), 1.0 mm pitch |
| Mounting Type | Surface Mount (SMD/SMT) |
| Process Technology | 90 nm CMOS, low-k dielectric |
| Lead-Free / RoHS | Yes (LEAD FREE per datasheet) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
EP2C50F672C6N 672-ball fineline bga (fbga-672), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2C50F672C6N (672-ball fineline bga (fbga-672), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C50F672C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C50F672C6N is suitable for 7 applications: Industrial Motor Control and Servo Drives, Video Processing and Display Controllers, Telecom Line Cards and Protocol Bridging, Test and Measurement Instrumentation, Legacy PCIe Endpoint Bridges, Education and Prototyping Platforms, Embedded Vision Systems.
Industrial Motor Control and Servo Drives
The EP2C50F672C6N's 50,528 logic elements, 150 embedded 18x18 multipliers, and 4 PLLs make it well-suited for industrial motor control loops where multi-axis PWM generation, field-oriented control (FOC) math, and quadrature encoder capture must run deterministically. The 450 user I/Os across the 672-BGA package easily handle parallel encoder inputs, Hall-sensor interfaces, and gate-driver enable signals without external muxing. LVDS support permits noise-immune connection to resolver-to-digital converters in high-EMI cabinet environments. The -6 speed grade delivers adequate Fmax for 100 kHz current-loop update rates typical of mid-power servo drives.
Recommended
Video Processing and Display Controllers
The EP2C50F672C6N delivers the parallel bandwidth required to drive multi-megapixel video pipelines including deinterlacing, scaling, color-space conversion, and on-screen display (OSD) overlay. Its 594 Kbits of M4K embedded memory buffer line-rate video streams without external SRAM for typical 720p/1080i designs, while the 150 18x18 multipliers handle scaling interpolation in real time. The 450 I/Os provide dedicated channels for parallel RGB, ITU-R BT.656, and LVDS display interfaces. Quartus II's Video and Image Processing (VIP) suite leverages these blocks via optimized IP cores for design reuse.
Recommended
Telecom Line Cards and Protocol Bridging
Telecom line cards benefit from the EP2C50F672C6N's combination of 50K logic elements for stateful protocol translation and 450 I/Os for tributary aggregation across T1/E1, Ethernet, and serial RapidIO interfaces. The 4 PLLs generate the multiple reference clocks required for framer, mapper, and SerDes components, while LVDS-capable I/O banks support backplane interconnect at hundreds of Mbps. The commercial junction temperature range suits central-office thermally-controlled environments, and the mature Quartus II toolchain supports telecom-grade timing closure with SDC constraints.
Recommended
Test and Measurement Instrumentation
Test equipment designers choose the EP2C50F672C6N for its deterministic timing, abundant logic for custom state machines, and 450 I/Os to fan out stimulus/response channels in ATE, logic analyzers, and protocol exercisers. The 4 PLLs synthesize the multiple baud-rate clocks needed for UART, SPI, I2C, and parallel JTAG interfaces, while 150 18x18 multipliers accelerate FFT and DSP blocks for signal-analyzer front ends. LVDS I/O support enables sub-nanosecond skew matching across high-speed comparator arrays. The 672-BGA package's 1.0 mm pitch is reflow-compatible with standard SMT lines.
Recommended
Legacy PCIe Endpoint Bridges
Cost-sensitive PCIe x1/x4 endpoint designs historically used Cyclone II with a soft PCIe IP core and external PHY, leveraging the EP2C50F672C6N's 50K LEs for protocol handling and 594 Kbits of memory for payload buffering. While Cyclone II lacks hard PCIe PHYs, the soft core runs at Gen1 (2.5 Gbps) speeds when paired with a PIPE-compliant external transceiver like the TI XIO1100. For new designs, Cyclone IV GX or Cyclone V GT with hard PCIe blocks are recommended, but Cyclone II remains in use for long-lifecycle industrial PCIe products where migration cost is high.
Recommended
Education and Prototyping Platforms
The Cyclone II family powers the popular Terasic DE2 development board and similar university teaching kits, where the EP2C50F672C6N provides ample logic for student projects covering CPU design, image processing, audio synthesis, and embedded soft-core (Nios II) implementations. The 672-BGA variant specifically supports boards that expose the full 450 I/O pin count through 0.1-inch headers for breadboard-friendly lab exercises. Quartus II Web Edition (free) and the Nios II EDS lower the barrier to entry, while abundant reference designs and Altera/Intel University Program materials accelerate learning curves.
Recommended
Embedded Vision Systems
The EP2C50F672C6N's combination of 150 18x18 multipliers and 594 Kbits of embedded memory enables real-time preprocessing pipelines for industrial cameras, including Bayer demosaicing, lens distortion correction, edge detection, and basic histogram equalization. The 450 user I/Os accommodate parallel Camera Link or MIPI-CSI bridging interfaces (via external deserializer), plus Ethernet MAC for streaming compressed output. The 672-BGA package's 1.0 mm pitch permits compact camera-module PCBs that fit behind C-mount lens housings, and Quartus II's VIP suite provides production-ready video IP cores.
Recommended
Recommended Products Summary
Engineering reference data for EP2C50F672C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C50F672C6 | EP2C50F672I6N | EP2C35F672C6N | EP2C50F672C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA | 672-ball FineLine BGA | 672-ball FineLine BGA | 672-ball FineLine BGA |
| Logic Elements | 50,528 | 50,528 | 50,528 | 35,016 | 50,528 |
| Embedded Memory | 594 Kbits | 594 Kbits | 594 Kbits | 483 Kbits | 594 Kbits |
| User I/Os | 450 | 450 | 450 | 315 | 450 |
| Speed Grade | -6 | -6 | -6 | -6 | -7 (slower) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| 18x18 Multipliers | 150 | 150 | 150 | 105 | 150 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Highest I/O count in the Cyclone II family (vs EP2C50F484C6N)
- Industrial temperature grade variant available (vs EP2C50F672C6N vs EP2C50F672I6N)
- Drop-in scalability within same package (vs EP2C35F672C6N)
Design Notes
The EP2C50F672C6N requires separate core (VCCINT 1.15-1.25 V) and I/O (VCCIO 1.2-3.3 V bank-dependent) supplies plus VCCA (2.5 V analog PLL) and VCCD_PLL (1.2 V digital PLL). Use at least 100 uF bulk + 0.1 uF + 10 uF ceramic decoupling per rail, with the 0.1 uF caps placed within 5 mm of every supply pin pair. VCCA and VCCD_PLL must be powered up simultaneously with VCCINT and never left floating - this causes PLL lock failure and configuration CRC errors. POR (power-on-reset) typically requires VCCINT to ramp monotonically within 100 ms.
The 672-ball FineLine BGA has a typical theta_JA of approximately 12-15 C/W with a standard 4-layer JEDEC test board and adequate airflow. At 100% logic utilization (50K LEs switching) plus 450 active I/Os, the EP2C50F672C6N can dissipate 2-3 W - well within the package rating. For sealed enclosures with no airflow, derate I/O toggle rates or use thermal vias under the central BGA array to spread heat into inner copper planes. Junction temperature must remain below 85C (commercial) or 100C (industrial) for reliable operation; use the on-chip ALTEMP_SENSE diode if available.
The 672-ball FineLine BGA uses 1.0 mm ball pitch, which requires laser-drilled micro-vias (0.1 mm diameter) on 4-6 layer PCBs and precise solder paste stencil apertures (typically 0.55 mm pads with 0.1 mm reduction). Use NSMD (non-solder-mask-defined) BGA pads for better joint reliability and easier inspection. All eight GND balls distributed across the array should connect to a continuous ground plane via thermal vias; signal escape routing should follow the breakout pattern documented in the Cyclone II handbook. JTAG chain integrity (TCK pull-down, TMS/TDI pull-ups) must be verified before configuration.
Do not apply I/O voltage to a bank before its VCCIO is powered - this causes I/O driver back-powering through ESD clamp diodes. Always program configuration mode pins MSEL[3:0] correctly before power-up to select AS / PS / JTAG / FPP mode. Configuration errors (CRC fail, MSEL invalid, CONF_DONE low) should be debugged using the Quartus II programmer's auto-detect and the JTAG IDCODE readback. Avoid long parallel chains of configuration data with excessive trace lengths (>2 inches) without source-series termination.
Assign high-speed LVDS pairs to top/bottom layers only with matched-length routing (within 50 mils differential pair skew) and 100 ohm differential impedance. Place PLL analog supply filter (ferrite bead + 10 uF + 0.1 uF pi network) within 6 mm of the VCCA pin, with the ferrite closest to the FPGA. Separate PLL analog ground from digital ground at the chip and join only at the board-level ground plane. M4K memory block clock inputs should be globally routed and use dedicated clock pins (CLK[0-15]) for best timing margin.
Compliance Information
RoHS-compliant and lead-free per datasheet 'LEAD FREE' marking. The 'N' suffix in the MPN explicitly denotes lead-free. REACH SVHC declaration should be requested from Intel for the latest revision. Halogen-free status not explicitly stated in available data. Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA, not automotive grade.
