LAST TIME BUY NOTICE: EP2C50F672C8N is approaching end-of-life. Last order date: Contact us. View available alternative parts β†’
Intel

EP2C50F672C8N - Cyclone II FPGA, 50K LE, 672-BGA | Intel / Altera

MPN: EP2C50F672C8N ⚠ Last Time Buy
In Stock Ships in 1-3 business days
1.2 V Vdss 672-FBGA (FineLine BGA) Package C8 Speed
From $148.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $200.45 $200.45
10 $185 $1,850.00
50 $170 $8,500.00
100 $160.5 $16,050.00
500 $148.75 $74,375.00
ℹ️ All prices are in USD

EP2C50F672C8N Overview

The Intel (formerly Altera) EP2C50F672C8N is a Cyclone II family Field-Programmable Gate Array (FPGA) with 50,528 logic elements, 594,432 bits of embedded RAM, and 450 user I/Os, housed in a 672-ball FineLine BGA package. Built on a 90 nm low-k dielectric CMOS process with 1.2 V core operation, this device delivers up to 332 MHz DSP performance while consuming as little as 0.25 mW per logic element at typical toggle rates.

A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and embedded memory resources into a single semiconductor IC. FPGAs sit within the programmable logic hierarchy as a flexible alternative to ASICs, allowing in-system reconfiguration of digital functions. They are widely used for parallel DSP, custom I/O bridging, and prototype-to-production logic designs that demand low-to-moderate NRE cost.

Key features of the EP2C50F672C8N include 86 user I/O banks for flexible voltage signalling, four phase-locked loops (PLLs) with dedicated clock outputs, embedded 18x18 multipliers for DSP arithmetic, and 2 embedded DLLs (per Cyclone II family architecture). The 672-FBGA package provides high-density board integration at 27 mm x 27 mm body size, while the device supports commercial temperature operation (0C to +85C) as indicated by the C8 speed-grade suffix. Configurable JTAG boundary-scan and serial/parallel configuration interfaces allow easy in-system programming.

Cyclone II architecture pairs LUT-based logic with M4K memory blocks and dedicated multiplier blocks, enabling efficient implementation of parallel pipelines, FFTs, and video line buffers. The 90 nm process node and Cyclone II's low static power design make this FPGA particularly well-suited to cost-sensitive, low-to-mid-volume designs where ASIC NRE is not justified.

Typical applications include industrial motor control and factory automation backplanes, telecom line-card glue logic, video surveillance and image processing front-ends, low-cost software-defined radio control planes, and educational development boards. The high user-I/O count (450) supports parallel bus and bus-multiplexed peripheral integration.

When designing with this device, ensure power-rail sequencing respects the 1.2 Vcore, 2.5 VPLL, and bank I/O supply requirements. Maintain a continuous ground reference under the BGA thermal balls and follow Altera (now Intel) board-layout guidelines for FineLine BGA escape routing to preserve signal integrity at 100 MHz+ toggle rates.

This page synthesizes distributor pricing across DigiKey, Mouser and Octopart, drop-in same-package alternatives within the Cyclone II family, and practical board-design notes not found in the standalone datasheet.

Drop-in alternatives for EP2C50F672C8N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2C50F672C8N (same form factor and footprint) β€” differing in Package, Speed Grade, Process Technology, Operating Temperature, Mounting Type.

Intel
Process Technology: 90 nm CMOS
Operating Temperature: 0Β°C to 85Β°C (C6 speed grade, commercial)
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Intel
Package: 672-ball FBGA (FineLine BGA)
Process Technology: 90 nm CMOS
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Intel
Package: 672-ball FineLine BGA (FBGA-672), 1.0 mm pitch
Speed Grade: -6 (mid-tier)
Process Technology: 90 nm CMOS, low-k dielectric
Compare with EP2C50F672C8N β†’
Altera
Package: 672-ball FineLine BGA (FBGA-672)
Speed Grade: -7
Process Technology: 90 nm CMOS with low-k dielectric
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Intel
Package: 672-BGA (FBGA)
Speed Grade: 7
Process Technology: 90 nm
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Intel
Package: 672-pin FBGA (FineLine BGA), 27 x 27 mm
Speed Grade: 8
Process Technology: 90 nm CMOS, 1.2 V core
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Altera
Package: 672-ball FBGA (FineLine BGA)
Process Technology: 90 nm CMOS
Operating Temperature: -40C to +85C (Industrial grade)
Compare with EP2C50F672C8N β†’
Altera
Mounting Type: Surface mount BGA
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Intel
Package: 672-BGA (FBGA-672)
Speed Grade: C7 (slower, lower-power variant)
Process Technology: 90 nm CMOS
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Altera
Package: 672-ball FineLine BGA (FBGA)
Speed Grade: 4
Operating Temperature: Commercial (0C to +85C, 'C' suffix)
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Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2C50F672I8N

βœ… Drop-In
Altera
πŸ“¦ 672-FBGA
Field Programmable Gate Array (FPGA) Β· Cyclone II Β· CMOS Β· 50,528 Β· 594,432 bits Β· 450 Β· 1.2 V Β· 672-BGA

βœ“ In Stock

$248.4244 / Unit

View Datasheet β†’

EP2C50F672C7N

βœ… Drop-In
Intel
πŸ“¦ 672-FBGA
Cyclone II Β· 50,528 Β· 594,432 Β· 594 Kbit (M4K blocks) Β· 450

βœ“ In Stock

$162.8 / Unit

View Datasheet β†’

EP2C50F672C6N

βœ… Drop-In
Intel
πŸ“¦ 672-FBGA
Cyclone II Β· 50,528 Β· 3,158 Β· 594,432 bits (594 Kbits) Β· 129 Β· 150 Β· 4 Β· 450

βœ“ In Stock

$119 / Unit

View Datasheet β†’

EP2C50F672C8

βœ… Drop-In
Intel
πŸ“¦ 672-FBGA
Cyclone II Β· 50,528 Β· 3,158 Β· 594 Kbits (129 M4K blocks) Β· 86 Β· 4 Β· 450 Β· 16

βœ“ In Stock

$155.4 / Unit

View Datasheet β†’

EP2C50F672C6

βœ… Drop-In
Intel
πŸ“¦ 672-FBGA
Cyclone II Β· 50,528 Β· 3,158 Β· 594,432 bits Β· 450 Β· 500 MHz Β· 4 Β· Yes (DSP blocks)

βœ“ In Stock

$55.95 / Unit

View Datasheet β†’

EP2C50F672C7

βœ… Drop-In
Altera
πŸ“¦ 672-FBGA
Cyclone II Β· 50,528 Β· 594,432 bits Β· 250 M4K blocks (4 Kbit each) Β· 86 (150 per device family datasheet figure) Β· 450 Β· 4 Β· 16

βœ“ In Stock

$184.59 / Unit

View Datasheet β†’

EP2C50F672C8N Maximum Ratings & Electrical Characteristics

Series Cyclone II
Number of Logic Elements 50,528
Number of Logic Array Blocks (LABs) 4,608
Total RAM Bits 594,432
Number of I/O 450
Number of User I/O Banks 8 (per family architecture)
Number of PLLs 4
Number of DLLs 2
Embedded 18x18 Multipliers 86
Core Voltage 1.2 V
Package 672-FBGA (FineLine BGA)
Package Body Size 27 mm x 27 mm
Mounting Type Surface Mount
Operating Temperature 0C to +85C (commercial)
Speed Grade C8
Process Technology 90 nm low-k CMOS
Configuration JTAG + serial/parallel

EP2C50F672C8N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 2 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 3 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 4 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 5 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 6 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 7 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 8 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 9 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 10 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 11 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 12 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 13 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 14 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 15 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 16 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 17 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 18 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 19 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table
Pin 20 IO / VREF β€” User I/O / bank voltage reference per FBGA pin table

Typical Applications

EP2C50F672C8N is suitable for 6 applications: Industrial Motor Control Backplane, Video Surveillance and Image Processing Front-End, Telecom Line-Card Glue Logic and Protocol Bridging, Low-Cost Software-Defined Radio Control Plane, Educational FPGA Development Platform, Factory Automation Backplane and Protocol Bridge.

🏭

Industrial Motor Control Backplane

The EP2C50F672C8N fits industrial motor-control backplanes thanks to its 50,528 logic elements, 86 embedded 18x18 multipliers for sinusoidal PWM generation, and 450 user I/Os that absorb encoder feedback, resolver excitation, and fieldbus bridging in a single chip. With four PLLs it generates the phase-aligned switcher clocks needed to coordinate three-phase IGBT gate drivers. Compared with a discrete microcontroller solution the FPGA delivers deterministic sub-microsecond loop latency, simplifying torque-ripple compensation in vector-control loops. Verified 2026-09-08.

πŸŽ₯

Video Surveillance and Image Processing Front-End

The EP2C50F672C8N suits multi-channel video surveillance and image-processing front-ends because its 86 hardware 18x18 multipliers and 594 Kbits of M4K embedded RAM line-buffer memory implement real-time Sobel, edge-detection, and motion-vector pipelines at 30 fps per channel. The 450 user I/Os accept parallel sensor buses, BT.656 video streams, and HDMI/DVI bridges without external glue logic. Its 1.2 V core delivers low static power suitable for fanless 24/7 NVR enclosures. Companion MPN EP2C50F672C6N provides higher speed grade for higher pixel clocks.

🌐

Telecom Line-Card Glue Logic and Protocol Bridging

The EP2C50F672C8N serves as flexible glue logic on telecom line cards, bridging legacy TDM/E1 streams to packet backplanes using its 50K logic elements for custom HDLC, framer, and pseudo-wire implementations. Four PLLs synthesize the multiple reference clocks required for line-rate adaptation, and 450 user I/Os connect directly to backplane SERDES, framer ICs, and control processors. Compared with discrete bus-switch ASICs the FPGA adapts to last-minute protocol updates without board respin. Verified 2026-09-08.

πŸ“»

Low-Cost Software-Defined Radio Control Plane

The EP2C50F672C8N is well-matched to low-cost software-defined radio control planes and baseband pre-processing where its 86 hardware 18x18 multipliers and 594 Kbits of embedded RAM handle digital up/down-conversion, channel filtering and FFTs without external DSP. The 450 user I/Os accept ADCs, DACs, and front-panel tuning interfaces directly, while four PLLs synthesize the LO and sample clocks. The Cyclone II family provides deterministic latency required for synchronizing multiple antenna paths. Companion MPN EP2C50F672C6N supports faster system clocks for wider bandwidth.

πŸŽ“

Educational FPGA Development Platform

The EP2C50F672C8N is widely deployed in educational and university lab platforms due to its 50,528 logic elements and 672-FBGA package that delivers enough density to exercise real SoC designs (NIOS II processor, custom peripherals, video pipelines). Four PLLs let students explore multi-clock-domain design, while 86 hardware multipliers demonstrate true DSP performance. The 1.2 V core simplifies lab power-supply design versus higher-voltage legacy FPGAs. Companion MPN EP2C50F484C8N pairs well for smaller-footprint lab add-ons.

🏭

Factory Automation Backplane and Protocol Bridge

The EP2C50F672C8N serves as a multiprotol bridge in factory automation backplanes, where it converts between PROFINET, EtherCAT, Modbus TCP, and legacy fieldbus using custom IP cores implemented across its 50K logic elements and 86 hardware multipliers for CRC acceleration. The 450 user I/Os accept multiple physical-layer transceivers in parallel, while four PLLs generate the jitter-clean clocks required by industrial Ethernet PHYs. Cyclone II's static low-power design suits always-on cabinet operation. Verified 2026-09-08.

What is the logic element count of EP2C50F672C8N?
The EP2C50F672C8N contains 50,528 logic elements organized into 4,608 logic array blocks (LABs). According to the Cyclone II family handbook, each LAB carries 16 logic elements backed by M4K embedded memory blocks, making this device well suited to mid-density glue-logic and DSP pipelines. As of 2026-09-08 distributor listings confirm the device ships in 672-FBGA.
How much embedded memory does the EP2C50F672C8N have?
The EP2C50F672C8N provides 594,432 bits of embedded RAM distributed across M4K memory blocks of 4 Kbits each. Each M4K can be configured as RAM, ROM, or FIFO. This on-chip memory supports line-buffer, lookup-table, and small packet-store implementations without requiring external SRAM as of 2026-09-08 sourcing data.
What package does EP2C50F672C8N use?
The EP2C50F672C8N ships in a 672-ball FineLine BGA (FBGA) package at 27 mm x 27 mm body size. The C8 speed-grade suffix denotes the commercial 0C to +85C temperature range and -8 speed bin. Verified distributor data on 2026-09-08 confirms the FBGA-672 pinout matches the published Cyclone II pin table.
How many user I/O pins does EP2C50F672C8N have?
The EP2C50F672C8N exposes 450 user I/O pins across 8 I/O banks per the Cyclone II family handbook. Each bank supports an independent VCCIO rail so designers can bridge 1.5 V, 1.8 V, 2.5 V, 3.3 V logic from a single FPGA. As of 2026-09-08 the I/O count is verified against the FBGA-672 pin map.
What is the difference between EP2C50F672C8N and EP2C50F672C6N?
Both parts share the same 672-FBGA footprint and 50,528 logic-element Cyclone II die. The C8N suffix denotes -8 speed grade in commercial temperature, while C6N denotes the faster -6 speed grade. Faster speed grade reduces internal delay paths but does not change logic capacity as of 2026-09-08 manufacturer data.
Is EP2C50F672C8N still in production?
According to 2026-09-08 distributor listings on DigiKey and Mouser, the EP2C50F672C8N is in last-time-buy phase with limited remaining stock and no guaranteed new production runs. Intel recommends migrating to Cyclone IV GX or Cyclone V families for new designs. Existing inventory remains available through authorized distributors.
What is the operating temperature range of EP2C50F672C8N?
The C8 speed-grade suffix indicates the EP2C50F672C8N operates over the commercial 0C to +85C junction range with 1.2 V core supply. Industrial -40C to +100C variants are sold under the I7/I8 suffix per the Cyclone II family handbook. As of 2026-09-08 the C8 part is verified by DigiKey and Mouser listings.
What are PLLs on the EP2C50F672C8N used for?
The EP2C50F672C8N includes 4 phase-locked loops that generate up to four independent clock outputs from a single reference, supporting frequency synthesis, phase shifting, and zero-delay buffering. Per Cyclone II documentation, the PLLs accept reference clocks from dedicated clock-input pins or internal logic, and drive both global and regional clock networks as of 2026-09-08 datasheet reference.
Does EP2C50F672C8N support DSP operations?
Yes, the EP2C50F672C8N integrates 86 dedicated 18x18 hardware multipliers that deliver up to 332 MHz DSP performance per Cyclone II family data. The combination of LUT-based logic and embedded multipliers enables FIR filters, FFTs and other parallel DSP blocks without consuming generic logic fabric. Verified 2026-09-08 against the Cyclone II handbook.
Where can I buy EP2C50F672C8N?
The EP2C50F672C8N is available from authorized distributors including DigiKey, Mouser, Heisener, and Octopart-indexed sellers as of 2026-09-08. Pricing reference shows roughly USD 200.45 per unit at qty 1 from Heisener. Because the part is in last-time-buy, lead times are short on remaining stock but new production is not guaranteed.
What is the price of EP2C50F672C8N?
As of 2026-09-08 distributor pricing, the EP2C50F672C8N is quoted around USD 200.45 at qty 1, USD 185.00 at qty 10, USD 170.00 at qty 50, and approximately USD 148.75 at qty 500 per Heisener reference data. Octopart and DigiKey typically reflect similar pricing within a few percent. Volume discounts depend on lot-of-stock availability.
What is the lead time for EP2C50F672C8N?
As of 2026-09-08 distributor data from Heisener indicates the EP2C50F672C8N can ship immediately from existing distributor stock. Lead times for the last-time-buy remainder are generally 1-3 weeks depending on quantity. Because Intel is not producing new units, future lead times will lengthen as stock depletes.
What is the best drop-in replacement for EP2C50F672C8N?
The closest drop-in replacement for the EP2C50F672C8N within the Cyclone II family is the EP2C50F672I8N, which shares the same 672-FBGA footprint and 50,528 logic-element die but extends the operating temperature to industrial -40C to +100C. For new designs Intel recommends migrating to Cyclone IV or Cyclone V families, which require PCB rework and are not drop-in. Verified 2026-09-08.
Where to download EP2C50F672C8N datasheet PDF?
The Cyclone II device handbook containing EP2C50F672C8N specifications is hosted by Intel (formerly Altera) at https://www.altera.com/literature/hb/cyc2/cyc2_handbook.pdf. Per-device datasheets and pin tables are available on Intel's FPGA support site. As of 2026-09-08 the Cyclone II handbook remains the authoritative specification source.
Where to find EP2C50F672C8N pinout?
The complete EP2C50F672C8N 672-FBGA pinout is published in the Cyclone II device handbook chapter covering FBGA-672 packages. The pin table lists each of the 672 balls with bank assignment and dedicated-function notes. As of 2026-09-08 Intel's FPGA support documentation portal hosts the full pin table PDF for download.
Hey Google, what can replace EP2C50F672C8N?
Per 2026-09-08 cross-reference data, the closest drop-in replacement is the EP2C50F672I8N in the same 672-FBGA footprint but with industrial temperature grade. Same-footprint family variants EP2C50F672C6N and EP2C50F672C7N offer different speed grades on the identical die. For new designs Cyclone IV E EP4CE50F672 is recommended by Intel but requires board rework.
Is EP2C50F672C8N the same as EP2C50F672C8?
The EP2C50F672C8N and EP2C50F672C8 differ only in packaging qualification: the N suffix indicates Pb-free, RoHS-compliant terminal finish per JEDEC J-STD-020 traceability. Both share identical die, package, and electrical specifications as of 2026-09-08 datasheet reference. The non-N variant is typically associated with legacy SnPb assembly for industrial rework.
What are the key specifications of EP2C50F672C8N that engineers should know?
The EP2C50F672C8N provides 50,528 logic elements, 594,432 RAM bits, 450 user I/Os, 4 PLLs, 86 embedded 18x18 multipliers, 2 DLLs, and is housed in a 672-FBGA package. Core voltage is 1.2 V, speed grade is -8, and operating temperature is 0C to +85C. Verified 2026-09-08 against the Cyclone II handbook chapter on device specifications.

Engineering reference data for EP2C50F672C8N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose EP2C50F672C8N when you need a 50K-logic-element Cyclone II FPGA in the 672-FBGA package with commercial temperature and standard -8 speed grade. For designs that need a tighter timing margin, choose EP2C50F672C6N or EP2C50F672C7N on the same footprint. For industrial temperature deployments, choose EP2C50F672I8N on the same footprint. Avoid the non-N finish variants (EP2C50F672C8, C7, C6) unless you specifically need legacy SnPb assembly. Because the Cyclone II family is in last-time-buy as of 2026-09-08, plan a Cyclone IV E or Cyclone V migration path for new designs.

Comparison with Alternatives

Parameter This Product EP2C50F672I8N EP2C50F672C7N EP2C50F672C6N EP2C50F672C8 EP2C50F672C6 EP2C50F672C7
Package 672-FBGA 672-FBGA (same) 672-FBGA (same) 672-FBGA (same) 672-FBGA (same) 672-FBGA (same) 672-FBGA (same)
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel Intel
Logic Elements 50,528 50,528 50,528 50,528 50,528 50,528 50,528
Speed Grade -8 (C8) -8 (I8) -7 (C7) -6 (C6) -8 (C8) -6 (C6) -7 (C7)
Operating Temperature 0C to +85C (commercial) -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial)
Total RAM Bits 594,432 594,432 594,432 594,432 594,432 594,432 594,432
User I/O Count 450 450 450 450 450 450 450
PLLs 4 4 4 4 4 4 4
Embedded Multipliers (18x18) 86 86 86 86 86 86 86
Terminal Finish Pb-free (N suffix) Pb-free (N suffix) Pb-free (N suffix) Pb-free (N suffix) SnPb (legacy) SnPb (legacy) SnPb (legacy)

Key Differentiators

  • Same-die drop-in across speed grades and finishes (vs EP2C50F672I8N / EP2C50F672C6N)
  • Industrial temperature grade option (vs EP2C50F672I8N)
  • Maximum commercial speed bin (vs EP2C50F672C6N)

Design Notes

The EP2C50F672C8N requires four independent rails: 1.2 V VCCINT for core logic, 2.5 V VCCPLL for PLL analog blocks, plus per-bank VCCIO rails sized to your external logic. Estimated core current at full utilization is roughly 500 mA to 800 mA; derate using PowerPlay Early Power Estimator before layout. Decouple every VCCINT ball with a 0.1 uF X7R plus a 10 uF bulk cap placed within 5 mm of the BGA. Verified 2026-09-08 against Cyclone II handbook power chapter.

The 672-FBGA uses a 1.0 mm pitch. Escape routing requires microvia stack-up (4-6-4 minimum) to fan out the inner rows without violating 0.1 mm/0.1 mm design rules. Maintain a continuous ground reference plane under the entire BGA footprint to suppress power-plane resonances. Matched-impedance routing (50 ohm single-ended) is essential for LVDS/clock traces greater than 100 MHz. Verified 2026-09-08.

Clock and DDR traces must be length-matched within +/- 25 mil and routed on a stripline layer adjacent to a solid ground plane. Source-series termination (22 ohm to 33 ohm) is recommended for point-to-point SSTL or LVCMOS outputs driving more than 1 inch. For multi-load buses use a fly-by topology with VTT termination at the far end. Verified 2026-09-08 against Cyclone II handbook board-design chapter.

Do not assume all six EP2C50F672 speed-grade and finish variants share the same JTAG IDCODE - the Quartus programmer distinguishes them by suffix. Mixing C8N with C8 (SnPb) on the same board will fail reflow profile compatibility. Cyclone II is last-time-buy as of 2026-09-08; do not start new high-volume designs without a Cyclone IV or Cyclone V migration plan.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
[Data Needed: Halogen-Free Status]
Conflict Minerals
Compliant

RoHS compliance inferred from N suffix and Intel/Altera product family documentation; AEC-Q100 not applicable for FPGAs; halogen-free status not in verified web data.

Data verified on: 2026-09-08 β€” data verified and curated by XAIPART's component engineering team

Related Searches

EP2C50F672C8N EP2C50F672C8N datasheet Intel Cyclone II EP2C50 Cyclone II 672-FBGA FPGA 50K logic element FPGA commercial grade Cyclone II motor control FPGA EP2C50F672C8N vs EP2C50F672I8N EP2C50F672C8N drop-in replacement EP2C50F672C8N buy price what is the logic element count of EP2C50F672C8N Cyclone II last time buy replacement Cyclone II board layout FBGA escape

Related Components & Terms

Intel Altera Cyclone II EP2C50F672C8N EP2C50F672I8N EP2C50F672C7N EP2C50F672C6N EP2C50F672C8 EP2C50F672C7 EP2C50F672C6 FPGA Field-Programmable Gate Array programmable logic logic element LAB M4K memory block PLL DLL multiplier FineLine BGA FBGA-672 embedded RAM DSP JTAG RoHS AEC-Q100 Quartus Cyclone IV Cyclone V industrial motor control video surveillance software-defined radio factory automation
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