EP2S180F1020C3N - Stratix II FPGA, 179400 LEs, 1020-FBGA | Intel
MPN: EP2S180F1020C3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8237.28 | $8,237.28 |
| 5 | $7900 | $39,500.00 |
| 10 | $7600 | $76,000.00 |
| 25 | $7200 | $180,000.00 |
| 100 | $6800 | $680,000.00 |
EP2S180F1020C3N Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture is built from a matrix of configurable logic blocks (LABs/CLBs), embedded memory blocks, DSP blocks, phase-locked loops, and high-speed transceivers, all connected through a programmable routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> FPGAs -> high-performance FPGAs. They differ from ASICs by being re-programmable in the field, and from microcontrollers by implementing logic in hardware, achieving deterministic, parallel throughput at clock rates of hundreds of MHz. The Stratix II family was introduced in 2004 as the first FPGA family to use an adaptive logic module (ALM) architecture instead of the older 4-input LUT.
Key features of the EP2S180F1020C3N include 8,970 LABs (logic array blocks), 9383040 bits of total RAM (approximately 1.1 MB), 96 DSP blocks for hardware-accelerated arithmetic, up to 12 PLLs (phase-locked loops) for clock management, and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The device also supports source-synchronous interfaces up to 1 Gbps via LVDS, and 4 phase-shift clock networks for fine-grained timing control. The high logic density makes it suitable for prototyping ASIC designs and large DSP pipelines.
Typical applications for the EP2S180F1020C3N include high-performance digital signal processing (DSP), telecom baseband processing, ASIC prototyping, image and video processing pipelines, high-speed networking equipment, and military/aerospace signal processing. The 742 user I/Os and high RAM-to-logic ratio also make it attractive for memory-intensive test and measurement equipment where parallel data acquisition must be buffered in real time.
When designing with this device, careful attention must be paid to power integrity because the 1020-ball FBGA package and high logic utilization can draw significant current. Designers should follow Altera's Stratix II PowerPlay Early Power Estimator (EPE) guidelines for thermal management. Pin assignment and PCB layout should also follow the Stratix II pin connection guidelines for unused I/Os and clock resources. This page synthesizes current distributor pricing, Stratix II drop-in alternatives, and engineering design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP2S180F1020C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S180F1020C3N (same form factor and footprint) — differing in Package, Operating Temperature, Total RAM Bits, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S180F1020C3
✅ Drop-In✓ In Stock
$1280 / Unit
View Datasheet →EP2S180F1020C3N
✅ Drop-In✓ In Stock
$6800 / Unit
View Datasheet →EP2S180F1020C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$171 / Unit
View Datasheet →EP2S180F1020C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4100 / Unit
View Datasheet →EP2S180F1020C3N Maximum Ratings & Electrical Characteristics
| Series | Stratix II |
| Family | Stratix II EP2S180 |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 179400 |
| Total RAM Bits | 9383040 |
| Number of LABs | 8970 |
| Number of I/O | 742 |
| DSP Blocks | 96 |
| PLLs | 12 |
| Core Voltage - Supply | 1.15 V to 1.25 V |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Speed Grade | -3 (slower) |
| Mounting Type | Surface Mount |
| Package / Case | 1020-BBGA, FCBGA (33 x 33 mm) |
| Supplier Device Package | 1020-FBGA (33x33) |
| RoHS Status | Compliant |
EP2S180F1020C3N 1020-fbga (33x33) Pin Configuration Guide
Pin configuration for EP2S180F1020C3N (1020-fbga (33x33) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S180F1020C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S180F1020C3N is suitable for 6 applications: ASIC Prototyping, High-Performance DSP Pipelines, Telecom Baseband Processing, Image and Video Processing, Military/Aerospace Signal Processing, High-Speed Networking Equipment.
ASIC Prototyping
The EP2S180F1020C3N fits ASIC prototyping because its 179,400 logic elements and 9383040 bits of embedded RAM map complex ASIC RTL designs with >90% utilization, while the 96 DSP blocks enable pre-silicon validation of FIR, FFT, and matrix-multiply pipelines. The Stratix II ALM architecture delivers deterministic, parallel throughput at 200+ MHz core clock, allowing functional verification at speed rather than relying on slow RTL simulation. Engineers use the Quartus II TimeQuest timing analyzer and SignalTap II logic analyzer to confirm real-time behavior before committing to silicon.
Recommended
High-Performance DSP Pipelines
The EP2S180F1020C3N is well suited to DSP pipelines because its 96 dedicated DSP blocks deliver 18 x 18-bit multiply-accumulate at 370 MHz, enabling 96 GMACs of throughput for radar, baseband, and beamforming workloads. Combined with the 9383040 bits of on-chip RAM (Triton RAM + M4K blocks), data can be streamed through the pipeline without round-trip to external SDRAM, eliminating memory-bottleneck stalls. Typical deployments include multi-channel digital-down-converter (DDC) chains and MIMO-OFDM physical layers in 4G/5G testbeds.
Recommended
Telecom Baseband Processing
The EP2S180F1020C3N fits telecom baseband applications because its 742 user I/Os and LVDS support up to 1 Gbps source-synchronous interfaces, sufficient for CPRI/OBSAI fronthaul links to base station RFICs. The 12 PLLs and 4 phase-shift clock networks provide the multiple clock domains needed for digital up-conversion (DUC), crest-factor reduction (CFR), and digital pre-distortion (DPD) feedback loops. Combined with 9383040 bits of RAM, baseband buffers and protocol stacks can be held on-chip without external memory for low-latency switching.
Recommended
Image and Video Processing
The EP2S180F1020C3N enables image and video processing pipelines because its 179,400 logic elements support multi-tap spatial filters, motion-estimation engines, and JPEG/MPEG-2/4 codecs in a single device. The 742 user I/Os accommodate parallel camera-sensor LVDS channels (e.g., Channel Link, FPD-Link) at up to 85 MHz pixel clock, while 9383040 bits of RAM buffer multiple video frames for de-interlacing and noise reduction. Industrial machine-vision and medical imaging systems rely on this combination for real-time, deterministic throughput.
Recommended
Military/Aerospace Signal Processing
The EP2S180F1020C3N supports military and aerospace signal-processing payloads because its high logic density enables software-defined-radio (SDR) waveforms, electronic-warfare (EW) pulse trains, and radar-signal processing on a single chip. The 1020-FBGA package supports Mil-Std-883 screening flows via authorized distributors like Rochester Electronics for extended-temperature and ruggedized builds. The 96 DSP blocks deliver the GMAC-rate throughput required for SAR imaging and SIGINT demodulation, while 742 I/Os provide the interface headroom for multi-antenna arrays.
Recommended
High-Speed Networking Equipment
The EP2S180F1020C3N fits high-speed networking equipment because its 742 user I/Os include dedicated LVDS pairs and SERDES-friendly I/O standards supporting 1 Gbps source-synchronous links to SPI-4.2, SFI-4.1, or XAUI PHYs. Combined with the 9383040 bits of on-chip RAM, the device can buffer packet queues, perform header inspection, and run TCAM-like lookup engines without external memory access. Routers, switches, and OTN framer/mapper designs from the Stratix II era used the EP2S180 as the central packet processor.
Recommended
Recommended Products Summary
Engineering reference data for EP2S180F1020C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S180F1020C3 | EP2S180F1020C4N | EP2S180F1020C5N |
|---|---|---|---|---|
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 179400 | 179400 (same) | 179400 (same) | 179400 (same) |
| Total RAM Bits | 9383040 | 9383040 (same) | 9383040 (same) | 9383040 (same) |
| Speed Grade | -3 | -3 (same) | -4 (faster) | -5 (fastest) |
| User I/Os | 742 | 742 (same) | 742 (same) | 742 (same) |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) |
| Terminal Finish | Lead-free (Pb-free) | Tin-Lead (SnPb) - non-RoHS | Lead-free (Pb-free) | Lead-free (Pb-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Pb-free terminal finish for RoHS assemblies (vs EP2S180F1020C3)
- Speed grade -3 is the lowest-cost Stratix II EP2S180 option (vs EP2S180F1020C4N)
- Same 1020-FBGA (33x33) footprint as -4 and -5 speed grades (vs EP2S180F1020C4N)
Design Notes
Estimated: At 1.2 V core, 100% logic utilization, and 200 MHz toggle rate, the EP2S180F1020C3N can dissipate 8-12 W. The 1020-FBGA package theta_JA is ~8 C/W on a standard 4-layer JEDEC board, producing an 80-100 C junction rise. Designers must use the Stratix II PowerPlay Early Power Estimator (EPE) spreadsheet for accurate per-design budgets and provide thermal vias beneath the central BGA balls plus a heat spreader for >8 W designs.
The 1020-FBGA uses 1.0 mm ball pitch, requiring microvia (laser-drilled) stackup with sequential lamination; standard 1.6 mm 4-layer FR-4 boards cannot route this BGA without HDI. Plan for at least 8 PCB layers (4 signal + 4 dedicated power/ground planes) with matched impedance (50 ohm SE / 100 ohm diff) for LVDS pairs. Place decoupling capacitors within 100 mils of each power pin group per the Stratix II pin connection guidelines.
Do not leave unused I/Os floating - the Stratix II I/O structure requires all pins to be configured as outputs driving '0' or as inputs with weak pull-ups via the Quartus II pin planner. Floating pins cause oscillation during configuration and can latch-up the I/O bank. Also, do not skip the Power-on-Reset (POR) delay; the 1.15 V to 1.25 V core must ramp monotonically within the datasheet's t_RAMP specification or configuration will fail silently.
LVDS pairs to external memory (DDR/DDR2) must be length-matched within 50 mils intra-pair and 200 mils inter-pair; failure to do so corrupts write captures. Use the Quartus II TimeQuest tool with the Stratix II memory controller IP to verify timing closure. For source-synchronous interfaces above 500 Mbps, simulate with IBIS models for both the EP2S180 and the partner PHY before committing to layout.
Compliance Information
Lead-free (Pb-free) terminal finish per JEDEC J-STD-609 indicated by 'N' suffix. RoHS compliant per DigiKey listing 1033770. AEC-Q100 not applicable (FPGA, not automotive-grade IC). REACH and conflict-minerals compliance assumed per Intel/Altera corporate policy.
