EP2S130F1020C3N - Stratix II FPGA, 132K LE, 742 I/O, 1020-FBGA | Intel
MPN: EP2S130F1020C3N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1495 | $149,500.00 |
| 500 | $1280 | $640,000.00 |
| 1,000 | $1095 | $1,095,000.00 |
EP2S130F1020C3N Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and configurable I/O into a single die. FPGAs sit between general-purpose microcontrollers (which execute software) and application-specific integrated circuits (ASICs, which are fixed at fabrication), occupying a unique position in the digital design hierarchy: programmable hardware -> reconfigurable logic -> parallel processing fabric -> high-performance compute engine. Stratix II devices are positioned by Intel/Altera for high-end DSP, packet processing, and high-speed serial interconnect.
Key features of the EP2S130F1020C3N include up to 12 dedicated high-speed transceivers, 4 enhanced PLLs plus 8 fast PLLs, support for external memory interfaces including DDR2/QDRII/RLDRAM, and dedicated clock networks. The 1020-pin FBGA package provides controlled-impedance signal paths and supports single-ended I/O standards (LVTTL, LVCMOS, SSTL, HSTL) as well as differential standards (LVDS, LVPECL) on selected pins. This combination of logic capacity, memory bandwidth, and DSP resources is what differentiates Stratix II from earlier Cyclone and competing Spartan families.
The internal architecture uses adaptive logic modules (ALMs) rather than the older 4-input LUT structure, doubling effective logic density per area and improving DSP packing. Twelve clock networks (16 per quadrant) feed the global clock tree, while up to 4 PLLs per quadrant provide frequency synthesis, deskew, and dynamic phase shifting for source-synchronous interfaces.
Typical applications include high-end telecommunication baseband processing, military radar signal processing, ASIC prototyping, broadcast video switching, and high-performance data acquisition. Stratix II remains popular in long-lifecycle defense and test-and-measurement programs where newer Intel Agilex devices are unavailable or cost-prohibitive.
When designing with the EP2S130F1020C3N, plan for an 8-layer PCB minimum, dedicate 4 solid power planes (VCCINT, VCCIO banks, PLL analog supplies, GND), and use the Quartus II design software (13.0 or earlier) for synthesis, place-and-route, and timing closure - the device is no longer actively promoted in newer Quartus releases.
This page synthesizes distributor stock from 18 sources, drop-in FPGA alternatives, and practical Stratix II PCB layout guidance not consolidated in the original Stratix II Device Handbook.
Drop-in alternatives for EP2S130F1020C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F1020C3N (same form factor and footprint) β differing in Speed Grade, Operating Temperature, Package, RoHS Status, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S130F1020C3
β Drop-Inβ In Stock
$1295 / Unit
View Datasheet βEP2S180F1020C3N
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$6800 / Unit
View Datasheet βEP2S130F1020C3N Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix II |
| Logic Elements | 132,540 LE |
| Number of I/O | 742 |
| Package Type | 1020-FBGA (33x33 mm) |
| Operating Temperature | 0C to +85C (commercial) |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Embedded Multipliers | 504 (18x18) |
| PLL Count | 12 (4 enhanced + 8 fast) |
| Mounting Type | Surface Mount (BGA) |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
EP2S130F1020C3N 1020-fbga (33x33 mm) Pin Configuration Guide
Pin configuration for EP2S130F1020C3N (1020-fbga (33x33 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130F1020C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130F1020C3N is suitable for 7 applications: Telecommunication Baseband Processing, Military Radar Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Switching and Processing, High-Performance Data Acquisition, Industrial Automation and Machine Vision, Test and Measurement Instrumentation.
Telecommunication Baseband Processing
The EP2S130F1020C3N's 132,540 logic elements and 504 embedded 18x18 multipliers make it well suited for multi-channel baseband processing in 3G/4G base stations. The 12 PLLs (4 enhanced + 8 fast) provide the clock synthesis flexibility required for CPRI/OBSAI fronthaul links, while 6.7 Mbits of embedded TriMatrix memory supports symbol-rate buffering and chip-rate processing. Engineers typically instantiate multiple parallel Turbo/Viterbi decoder cores, achieving aggregate throughput far exceeding DSP-only solutions. The 742 user I/O pins carry high-speed LVDS links to RF ADC/DAC pairs. Compared to a generic DSP, the Stratix II FPGA's parallel architecture delivers deterministic latency for time-critical baseband functions while remaining programmable for evolving air-interface standards.
Recommended
Military Radar Signal Processing
Radar pulse-Doppler and SAR processing benefit from the EP2S130F1020C3N's combination of 504 dedicated 18x18 multipliers and on-chip TriMatrix memory. The architecture can sustain multi-stage FFT pipelines (8K/16K-point) at IF sampling rates up to 250 MHz without external memory roundtrips. The commercial 0C to 85C temperature grade suits ground-based and shipboard radar installations. Dual-port and true-dual-port memory blocks enable simultaneous read/write access, supporting sliding-window CFAR detection. Compared with discrete DSP arrays, the EP2S130 collapses 4-6 DSP chips and surrounding SRAM into a single device, reducing board area and SWaP-C for defense platforms.
Recommended
ASIC Prototyping and Emulation
The EP2S130F1020C3N is widely used as an ASIC prototype vehicle, where its 132K logic elements and 6.7 Mbits of internal memory can map mid-complexity SoC designs spanning up to 20 million ASIC gates. Quartus II supports rapid HDL recompilation and TimeQuest timing closure against the Stratix II timing models, letting verification teams iterate in days rather than weeks. The 1020-FBGA package exposes 742 I/O for connecting to daughter-card logic-analyzer probes and speed-adapter boards that emulate external memories. Compared to software simulation, hardware prototyping on Stratix II runs at 30-100 MHz, accelerating regression tests by 100x and enabling real-world software bring-up before tape-out.
Recommended
Broadcast Video Switching and Processing
Broadcast video routers and processing engines use the EP2S130F1020C3N to implement multi-format SDI cross-points (SD-SDI/HD-SDI/3G-SDI) and inline processing such as frame-sync, color-space conversion, and overlay blending. The 742 user I/O pins comfortably accommodate 144+ SDI streams using internal SERDES, and 504 multipliers handle real-time chroma-keying and deinterlacing. The 12 PLLs generate independent video clocks for asynchronous input streams, while embedded memory buffers full 1080p60 frames at low latency. Compared to a fixed-function video crosspoint ASIC, the EP2S130 supports any mix of SDI formats simultaneously and can be reprogrammed for new broadcast standards without board respins.
Recommended
High-Performance Data Acquisition
Scientific and industrial data-acquisition systems leverage the EP2S130F1020C3N's parallel fabric to capture and pre-process high-speed ADC data streams. The device pairs naturally with 16-bit ADCs at 200-250 MSPS, applying digital down-conversion, decimation, and triggering in real time. TriMatrix memory blocks store acquisition bursts, while 742 I/O pins accept LVDS ADC data and expose processed results over PCIe or gigabit Ethernet. Compared to a microcontroller + DSP pipeline, the Stratix II eliminates the bottleneck of sequential instruction execution, sustaining deterministic sub-microsecond latency critical for particle-physics and radar experiments. The 0-85C commercial grade suits laboratory environments, while the industrial -40C to +100C variant (EP2S130F1020I3N) suits field deployment.
Recommended
Industrial Automation and Machine Vision
Machine-vision controllers using the EP2S130F1020C3N achieve multi-camera inspection throughput well above microcontroller-class solutions. Embedded multipliers accelerate convolution kernels for defect detection, while 742 I/O pins interface with Camera Link, CoaXPress, or GigE Vision camera modules via FPGA IP cores. TriMatrix memory buffers full-resolution frames for line-scan cameras operating at 80 kHz+ line rates. The 12 PLLs generate pixel clocks for up to 12 independent cameras, and the deterministic fabric ensures zero frame jitter - critical for AOI (automated optical inspection) on PCB assembly lines. Compared to a GPU-based vision system, the EP2S130 offers lower latency, deterministic timing, and lower BOM cost at lower channel counts.
Recommended
Test and Measurement Instrumentation
High-bandwidth oscilloscopes, logic analyzers, and protocol testers employ the EP2S130F1020C3N for waveform capture, real-time pattern generation, and protocol decoding. The 132K logic elements and 504 multipliers support real-time eye-diagram measurement, BERT (bit-error-rate) processing, and SerDes protocol analysis at multi-Gbps rates. TriMatrix memory provides deep capture buffers, and 742 I/O pins interface with high-speed ADCs and pattern-generator DACs. Compared to fixed-function T&M ASICs, the FPGA-based architecture allows in-field firmware updates to support new protocols (USB4, PCIe Gen5) without hardware refresh. The Stratix II's proven silicon and long-term availability make it favored in long-lifecycle test platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F1020C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1020C3 |
|---|---|---|
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) - same |
| Brand | Intel | Intel - same |
| Logic Elements | 132,540 LE | 132,540 LE - identical |
| User I/O | 742 | 742 - identical |
| Embedded Multipliers (18x18) | 504 | 504 - identical |
| PLL Count | 12 (4 enhanced + 8 fast) | 12 - identical |
| Core Voltage | 1.2 V | 1.2 V - identical |
| Lead Finish | Lead-free (Pb-free) | SnPb (leaded) |
| Lifecycle Status | Last Time Buy (2026-09-09) | Last Time Buy - same |
Key Differentiators
- Highest available density at 1020-FBGA within last-time-buy inventory (vs EP2S90F1020C3N)
- Drop-in compatibility with EP2S130F1020C3 lead-finish variant (vs EP2S130F1020C3)
- Last-time-buy inventory still widely brokered (vs Xilinx Virtex-5 FX130T)
Design Notes
Estimated: Stratix II EP2S130 with 132K LE running at 50% toggle rate and 250 MHz clock typically draws 1.5-2.5 W from VCCINT (1.2 V) plus 0.5-1.5 W from each VCCIO bank depending on I/O switching activity. A 4-plane power distribution network (VCCINT, VCCPD, VCCIO banks, GND) with at least 20 decoupling caps per supply (0.1 uF + 10 uF bulk) is mandatory. Use an isolated analog supply for the PLL_VCCA pins - shared switching noise will degrade PLL jitter by 50-100 ps.
The 1020-ball FBGA requires a minimum 8-layer PCB stackup with 1 oz copper outer layers and 0.5 oz inner layers. Microvia or stacked-via technology is required for the 1.0 mm pitch BGA escape routing. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS/LVPECL pairs. Reference the Altera AN 471: Stratix II Board Design Guidelines for the recommended stackup and via pattern.
Estimated: 1020-FBGA at 33x33 mm with theta_JA around 12 C/W (still air) and 8 C/W (200 LFM airflow). At 3.5 W total power and 25 C ambient, junction temperature reaches 53 C still air / 25 C with 200 LFM airflow - well within the 85 C commercial limit. For industrial -40C to 100C operation, derate to 60% airflow or apply a heatsink. Never operate Stratix II without airflow on a closed chassis - junction can exceed 110 C and trigger thermal shutdown.
Three common Stratix II design pitfalls: (1) Do not reuse Quartus Prime 17.0+ projects - Stratix II support was removed after 13.1; downgrade to Quartus II 13.0sp1. (2) The MSEL[2:0] configuration mode pins must match the chosen configuration scheme (AS, PS, JTAG, Fast Passive Parallel) - incorrect setting results in a 'configuration failed' error that is often mistaken for a bad JTAG chain. (3) Differential I/O standards (LVDS) require external 100 ohm termination across the P/N pins - internal termination is not sufficient above 500 Mbps.
Compliance Information
RoHS compliant per digchip.com cross-reference; lead-free terminal finish confirmed by 'N' suffix in MPN per Altera ordering code convention. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-grade part. For automotive applications, choose Cyclone IV/V automotive grades instead.
