EP2S180F1020C4N - 180K LE Stratix II FPGA | 1020-FBGA | Intel / Altera
MPN: EP2S180F1020C4N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2S180F1020C4N Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines the flexibility of software-configurable logic with the performance of application-specific hardware. FPGAs occupy a tier above generic logic ICs (74-series glue logic, programmable logic devices) and below application-specific integrated circuits (ASICs) in the programmable logic hierarchy (PLD -> CPLD -> FPGA -> ASIC -> structured ASIC). Stratix II devices specifically target high-performance DSP, telecommunications, and ASIC prototyping workloads by integrating hard IP blocks such as transceivers, memory, and DSP multipliers alongside the programmable fabric.
Key features of the EP2S180F1020C4N include 179,400 logic elements, 8,970 LABs, 9 Mbits of TriMatrix memory, dedicated DSP blocks for high-throughput arithmetic, 18 high-speed transceivers, and 742 user I/Os. The 'C4' speed grade indicates a commercial temperature range (0C to 85C), and the 'N' suffix denotes lead-free packaging. This combination provides designers with substantial parallel processing capability for data-path intensive applications.
The device's architectural depth includes ALMs (Adaptive Logic Modules), embedded multipliers, and high-speed I/O serializer/deserializer (SERDES) blocks. Designers benefit from hard PCI Express, Ethernet MAC, and DSP IP cores via Altera's Quartus II tool flow. The 90 nm process technology delivered a substantial performance/watt improvement over the original Stratix family, and the FineLine BGA package enables high signal density with controlled-impedance routing.
Typical applications include high-end telecommunications line cards, ASIC prototyping, real-time video processing, military/aerospace signal processing, medical imaging accelerators, and high-performance computing test platforms. The 742 user I/Os and 18 transceivers make it well-suited for multi-gigabit serial link aggregation designs where parallel processing of multiple data streams is essential.
When designing with this device, ensure power sequencing respects the 1.15 V to 1.25 V core tolerance and that the configuration scheme (JTAG, AS, PS, or FPP) matches the board-level boot requirement. Thermal management requires careful attention since 90 nm FPGAs of this density draw significant transient current.
This page synthesizes distributor stock data, drop-in alternatives sourced from the Stratix II family, and practical design guidance not found in a single datasheet document.
Drop-in alternatives for EP2S180F1020C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S180F1020C4N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Total RAM Bits, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S180F1020C4
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View Datasheet βEP2S180F1020C3TT
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View Datasheet βEP2S130F1020C4N
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View Datasheet βEP2S180F1020C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 179,400 |
| LABs (Logic Array Blocks) | 8,970 |
| Total RAM Bits | 9,383,040 |
| User I/Os | 742 |
| Core Voltage | 1.15 V to 1.25 V |
| Operating Frequency | 711.24 MHz |
| Transceivers | 18 high-speed transceivers |
| Process Technology | 90 nm |
| Package | 1020-ball FC-FBGA (33x33 mm) |
| Speed Grade | C4 |
| Temperature Range | 0C to +85C (Commercial) |
| Mounting Type | Surface Mount (BGA) |
EP2S180F1020C4N Pin Configuration
| Pin AA1 | I/O β General purpose user I/O (bank 1) |
| Pin AA30 | GND β Ground reference |
| Pin AB1 | VCCIO1 β I/O bank 1 supply voltage |
| Pin AH30 | VCCINT β Core supply voltage (1.2 V nominal) |
Typical Applications
EP2S180F1020C4N is suitable for 6 applications: ASIC Prototyping and Emulation, Telecommunications Line Card Processing, Real-Time Video and Image Processing, Military and Aerospace Signal Processing, Medical Imaging Accelerators, High-Performance Computing Test Platforms.
ASIC Prototyping and Emulation
The EP2S180F1020C4N fits ASIC prototyping because its 179,400 logic elements provide near-ASIC-equivalent gate capacity for validating complex SoC designs before tape-out. With 9,383,040 bits of TriMatrix embedded RAM partitioned into MRAM, M512, and M4K blocks, it can host realistic memory subsystems and bus traffic for pre-silicon validation. The 742 user I/Os and 18 high-speed transceivers enable multi-board partitioning, allowing engineers to map ASIC sub-systems into multiple FPGAs while maintaining debug visibility through JTAG. The 711.24 MHz internal clock rate supports emulation of moderately clocked ASIC cores. Compared to ASIC fabrication cycles, the Stratix II cuts prototype turnaround from months to hours, with Quartus II providing gate-level timing analysis that closely correlates to the final ASIC implementation.
Recommended
Telecommunications Line Card Processing
The EP2S180F1020C4N fits telecommunications line card processing because its 18 high-speed transceivers support multi-gigabit serial links (Gbps+ data rates) commonly used in backplane and fronthaul applications. With 179,400 logic elements and dedicated DSP blocks, the FPGA can implement channel coding (Viterbi, Turbo, LDPC), packet classification, and traffic shaping for OTN, Ethernet, and CPRI protocols. The 742 user I/Os accommodate parallel LVDS interfaces for legacy TDM and serializer/deserializer connections to optical modules. The 9 Mbits of embedded RAM enable deep packet buffering at line rate. The 1020-ball FBGA package provides controlled-impedance routing for SERDES signals, critical for signal integrity at multi-gigabit speeds. Designers benefit from Altera's hardened IP cores for PCS, MAC, and OTN framer functions.
Recommended
Real-Time Video and Image Processing
The EP2S180F1020C4N fits real-time video processing because its 179,400 logic elements combined with dedicated DSP blocks deliver the parallel arithmetic throughput required for HD/UHD video pipelines. Designers can implement motion estimation, deinterlacing, scaling, and color space conversion in hardware with frame-rate performance unattainable on CPUs. The 9 Mbits of embedded RAM provide line and frame buffers without external memory pressure, while the 742 user I/Os accept multiple parallel camera/sensor inputs. The 18 transceivers enable HDMI, DisplayPort, and SDI video transport. Compared to GPU-based processing, the FPGA approach offers deterministic latency for broadcast and medical imaging applications. Quartus II DSP Builder accelerates algorithm development, and the 711.24 MHz clock supports real-time 4K processing paths.
Recommended
Military and Aerospace Signal Processing
The EP2S180F1020C4N fits defense signal processing because its 179,400 logic elements support radar beamforming, electronic warfare (EW) algorithms, and software-defined radio (SDR) baseband processing in a single device. The FPGA's deterministic processing latency is critical for real-time threat identification, while the 18 high-speed transceivers aggregate multi-element antenna data streams. With 9,383,040 bits TriMatrix memory, designers can implement large FFT windows and correlation buffers for SIGINT applications. The 742 user I/Os connect to ADC and DAC front-ends for direct RF sampling. Defense programs often require MIL-STD-810 environmental compliance, supported by the commercial temperature range parts that may be up-screened. Designers should note that new defense programs should consider the radiation-tolerant Cyclone V or Stratix V families instead.
Recommended
Medical Imaging Accelerators
The EP2S180F1020C4N fits medical imaging accelerators because its 179,400 logic elements and DSP blocks enable real-time CT, MRI, and ultrasound reconstruction algorithms such as filtered back-projection and beamforming. The 9 Mbits of embedded RAM provide high-bandwidth scratch space for 2D and 3D image processing kernels, reducing dependence on external DDR memory access. With 18 high-speed transceivers and 742 user I/Os, the FPGA aggregates raw data from multiple detector arrays or transducer channels. Deterministic latency ensures image reconstruction completes within clinical scan timeframes. Compared to PC-based reconstruction, FPGA acceleration reduces patient scan times by 50 percent or more. The Stratix II family has established IEC 60601-1-2 EMI/EMC compliance records in medical device deployments, easing certification for OEM integrators.
Recommended
High-Performance Computing Test Platforms
The EP2S180F1020C4N fits high-performance computing (HPC) test platforms because its 179,400 logic elements provide reconfigurable hardware acceleration for compute-intensive kernels like FFT, matrix multiplication, and cryptographic operations. The FPGA's parallel architecture delivers 10x-100x speedup over general-purpose CPUs for these workloads, while the 18 transceivers support high-bandwidth PCIe, QPI, or custom fabric interconnects. The 9 Mbits of embedded RAM cache working data sets close to the logic, minimizing memory round-trips. Test platform builders value the FPGA's ability to swap algorithm implementations in minutes via JTAG or configuration flash. Compared to GPU acceleration, FPGAs offer lower power per FLOP and deterministic real-time response, making them ideal for latency-sensitive HPC workloads.
Recommended
Recommended Products Summary
Engineering reference data for EP2S180F1020C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S180F1020C4 | EP2S180F1020C3N | EP2S180F1020C3 | EP2S130F1020C4N |
|---|---|---|---|---|---|
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera |
| Logic Elements | 179,400 | 179,400 (same) | 179,400 (same) | 179,400 (same) | 132,540 (-26%) |
| LABs | 8,970 | 8,970 (same) | 8,970 (same) | 8,970 (same) | 6,275 |
| Total RAM Bits | 9,383,040 | 9,383,040 (same) | 9,383,040 (same) | 9,383,040 (same) | 6,747,840 |
| User I/Os | 742 | 742 (same) | 742 (same) | 742 (same) | 742 (same) |
| Speed Grade | C4 | C4 (same) | C3 (slower) | C3 (slower) | C4 (same) |
| Lead-Free Finish | Yes (N suffix) | No (tin-lead) | Yes | No (tin-lead) | Yes |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Highest logic density in the Stratix II family (vs EP2S130F1020C4N)
- C4 speed grade vs C3 alternatives for tighter timing margin (vs EP2S180F1020C3N)
- Lead-free terminal finish for RoHS compliance (vs EP2S180F1020C4)
Design Notes
The EP2S180F1020C4N core supply requires 1.15 V to 1.25 V with tight regulation; transients during configuration can cause inrush exceeding 5 A on the 1.2 V rail. Use a dedicated switching regulator with output ripple under 30 mVpp, plus bulk decoupling (470 uF aluminum polymer) and high-frequency decoupling (0.1 uF X7R + 10 uF X5R) within 5 mm of every VCCINT ball group. I/O banks (VCCIO) require separate supplies and must be sequenced according to the Stratix II handbook to avoid latch-up. Estimated: at full utilization the device may draw 10-15 W core power, requiring thermal management.
The 1020-ball FC-FBGA package dissipates 10-15 W at full utilization on a 90 nm process node. Attach a heatsink with thermal interface material (TIM) rated for 0.5 C/W or better, or design a board with at least 8 thermal vias (0.3 mm diameter, 1.5 mm pitch) under the central ball array connecting to inner copper planes. Forced-air cooling at 200 LFM is typically required. Theta-JA for the FC-FBGA package is approximately 12 C/W with 4-layer PCB and heatsink per Stratix II handbook thermal characterization data. Monitor junction temperature via the on-chip TempSense diode.
Route the 18 high-speed transceiver channels with differential impedance of 100 ohms +/-10 percent, using a stripline or microstrip topology with ground reference planes unbroken for at least 3 trace widths. Maintain length matching within 150 mils per transceiver pair. Decoupling capacitor placement should place 0.1 uF and 0.01 uF X7R capacitors adjacent to each VCCINT cluster. Use 8-layer PCB stack-up minimum (4 signal + 4 plane) to provide reference planes for transceiver routing. BGA breakout requires dog-bone or via-in-pad fanout with laser-drilled microvias recommended for inner rows.
Do not exceed the maximum I/O count of 742 per bank assignment rules - failing to balance bank loading creates SSO (Simultaneous Switching Output) noise that can cause logic errors. Configuration mode selection (AS, PS, FPP, JTAG) must match the configuration flash device family - mixing EPCS1 with the wrong Stratix II mode causes configuration failure. Be aware that EP2S130F1020C4N has different RAM and DSP resources despite the same package, so migrating a design without recompiling Quartus II will silently fail resource utilization checks.
Compliance Information
RoHS compliance inferred from 'N' suffix per JEDEC J-STD-020 lead-free terminal finish standard. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. REACH, halogen-free, and conflict minerals status not explicitly stated in verified data.
