EP2S180F1508C3NAA - Stratix II 180K LEs FPGA | Intel | 1508-FBGA
MPN: EP2S180F1508C3NAA ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $420 | $420.00 |
| 10 | $380 | $3,800.00 |
| 100 | $345 | $34,500.00 |
| 500 | $310 | $155,000.00 |
| 1,000 | $285 | $285,000.00 |
EP2S180F1508C3NAA Overview
What is a Stratix II FPGA? A Stratix II FPGA is a programmable logic device from the Altera/Intel Stratix II family of high-performance, SRAM-based field-programmable gate arrays. An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of configurable logic blocks, programmable interconnect, and specialized hard IP such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit in the broader taxonomy as follows: programmable logic device (PLD) -> field programmable gate array (FPGA) -> SRAM-based FPGA -> high-density Stratix II family. Stratix II devices are typically used in applications requiring very high logic density, high-speed serial connectivity, and substantial embedded memory and arithmetic resources.
Key features of the EP2S180 include 179,400 equivalent logic elements (LEs), 9,383,040 bits of total embedded RAM (M4K and M-RAM combined), 96 embedded DSP blocks capable of up to 384 18x18 multipliers, and 12 full-duplex transceiver channels supporting data rates up to 6.375 Gbps. The 1508-FBGA package provides 1170 user I/Os and uses Intel's flip-chip BGA technology for high I/O density and excellent signal integrity at high frequencies.
The device architecture combines Look-Up Table (LUT) based adaptive logic modules (ALMs), TriMatrix embedded memory blocks, DSP blocks with hardware multipliers, and embedded transceivers. The adaptive logic module architecture provides finer-grained logic utilization compared to prior Stratix generations, allowing more efficient implementation of complex arithmetic and control logic.
Typical applications include high-performance digital signal processing (radar, software defined radio, video processing), wireline telecom line cards with multiple SerDes channels, ASIC prototyping for large SoC designs, high-speed data acquisition, and test and measurement instrumentation. The combination of high logic density, embedded transceivers, and substantial block RAM makes it well-suited to throughput-intensive compute systems.
When designing with this device, carefully consider power distribution network design (PDN) for the 1508-ball flip-chip BGA, signal integrity for high-speed transceiver channels, and thermal management for the 1.0 V core supply at high toggle rates. Use Intel Quartus II design software (legacy version recommended for Stratix II) for synthesis, place-and-route, and timing closure. Per-package ball maps and reference schematics should be obtained from the manufacturer pin-out file.
This page synthesizes distributor availability, same-package drop-in variants, and design guidance that is not found in the manufacturer datasheet, and is intended for engineers performing second-source qualification or migrating to a higher density Stratix II member.
Drop-in alternatives for EP2S180F1508C3NAA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S180F1508C3NAA (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Logic Elements, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S180F1508C3N
✅ Drop-In✓ In Stock
$1200 / Unit
View Datasheet →EP2S180F1508C3
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2S130GF1508C3N
✅ Drop-In✓ In Stock
$5950 / Unit
View Datasheet →EP2S130F1508C3
✅ Drop-In✓ In Stock
$1350 / Unit
View Datasheet →EP2S130F1508C3N
✅ Drop-In✓ In Stock
$270 / Unit
View Datasheet →EP2S180F1508C3NAA Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 179,400 LEs |
| Adaptive Logic Modules (ALMs) | 71,760 ALMs |
| Embedded RAM (total) | 9,383,040 bits (M4K + M-RAM) |
| M4K RAM Blocks | 930 blocks of 4 Kbits each |
| M-RAM Blocks | 9 blocks of 512 Kbits each |
| DSP Blocks | 96 blocks (18x18 multipliers) |
| 18x18 Embedded Multipliers | 384 |
| Transceivers | 12 channels |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| Maximum User I/O | 1170 user I/O pins |
| Package | 1508-ball FCBGA |
| Process Technology | 90 nm CMOS |
| Speed Grade | -3 (commercial, faster) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
EP2S180F1508C3NAA 1508-ball fcbga Pin Configuration Guide
Pin configuration for EP2S180F1508C3NAA (1508-ball fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S180F1508C3NAA.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S180F1508C3NAA is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line Card with Multi-Channel SerDes, High-Performance Digital Signal Processing (Radar / SDR), Video Broadcast and Image Processing, Test & Measurement Instrumentation, High-Speed Data Acquisition and Storage.
ASIC Prototyping and Emulation
The Intel EP2S180F1508C3NAA with 179,400 LEs and 9.4 Mbits of embedded RAM is well-aligned for ASIC prototyping where the full SoC must fit on a single FPGA for pre-silicon validation. The 96 DSP blocks (384 18x18 multipliers) at -3 speed grade support high-throughput arithmetic units in the emulated design, while the 12 transceivers at up to 6.375 Gbps provide realistic chip-to-chip serial I/O. This part is commonly paired with external SRAM/SSRAM and high-speed DDR memory controllers for emulating complex SoCs.
Recommended
Telecom Line Card with Multi-Channel SerDes
The 12 embedded transceiver channels supporting up to 6.375 Gbps make the EP2S180F1508C3NAA a strong fit for telecom line cards where multi-gigabit serial links are required. The 1170 user I/Os in the 1508-FBGA package support extensive parallel bus interfacing to framer/mapper ASICs and network processors, while the 9.4 Mbits of embedded RAM buffer packet data at line rate. Designers can implement PCS, MAC, and forwarding logic in fabric alongside SerDes channels, reducing board area and BOM.
Recommended
High-Performance Digital Signal Processing (Radar / SDR)
The 96 DSP blocks delivering up to 384 18x18 multipliers, combined with 9.4 Mbits of embedded RAM, allow the EP2S180F1508C3NAA to implement large FFT, FIR, and matrix-multiply pipelines for radar processing and software-defined radio. The -3 speed grade maximizes Fmax for DSP-heavy paths, and the 1508-FBGA package supports the multi-channel ADC/DAC interface with up to 1170 user I/Os. The 12 transceivers enable high-speed digitized IF data transport to/from FPGA fabric.
Recommended
Video Broadcast and Image Processing
With 179,400 LEs and 9.4 Mbits of embedded RAM, the EP2S180F1508C3NAA supports broadcast video processing pipelines such as multi-channel SD/HD/3G-SDI routing, color-space conversion, and real-time video effects. The 1170 user I/Os accommodate multiple parallel video buses (BT.1120, BT.656, RGB/YCbCr), while the 96 DSP blocks accelerate motion-estimation and deinterlacing kernels. The 12 transceivers at 6.375 Gbps support 3G-SDI and HDMI serialization/deserialization.
Recommended
Test & Measurement Instrumentation
The EP2S180F1508C3NAA's 1170 user I/Os, 96 DSP blocks, and 12 multi-gigabit transceivers enable high-channel-count arbitrary waveform generators, logic analyzers, and protocol testers. The -3 commercial speed grade supports fast logic analyzer timing closure, while the 9.4 Mbits of embedded RAM buffer deep capture memory. The 1508-FBGA package supplies the signal integrity required for multi-GHz probe interfacing and high-density pin electronics.
Recommended
High-Speed Data Acquisition and Storage
The 12 embedded transceivers at up to 6.375 Gbps enable multi-lane data acquisition from high-speed ADCs and storage controllers such as SATA/SAS interfaces. The 9.4 Mbits of embedded RAM buffer raw ADC samples at line rate, while the 96 DSP blocks allow on-FPGA pre-processing and decimation before transfer to host processors. The 1508-FBGA package exposes 1170 user I/Os for parallel LVDS interfaces to ADC/DAC clusters.
Recommended
Recommended Products Summary
Engineering reference data for EP2S180F1508C3NAA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S180F1508C3N | EP2S180F1508C3 | EP2S130GF1508C3N | EP2S130F1508C3 | EP2S130F1508C3N |
|---|---|---|---|---|---|---|
| Package | 1508-FBGA | 1508-FBGA - same | 1508-FBGA - same | 1508-FBGA - same | 1508-FBGA - same | 1508-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 179,400 LEs | 179,400 LEs | 179,400 LEs | 132,540 LEs | 132,540 LEs | 132,540 LEs |
| DSP Blocks | 96 blocks | 96 blocks | 96 blocks | 63 blocks | 63 blocks | 63 blocks |
| Embedded RAM | 9,383,040 bits | 9,383,040 bits | 9,383,040 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits |
| Transceivers | 12 channels | 12 channels | 12 channels | 12 channels | 12 channels | 12 channels |
| Speed Grade | -3 (commercial) | -3 (commercial) | -3 (commercial) | -3 (commercial) | -3 (commercial) | -3 (commercial) |
| Maximum User I/O | 1170 | 1170 | 1170 | 1126 | 1126 | 1126 |
| Lifecycle Status | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy |
Key Differentiators
- Highest-density member of the Stratix II family at 1508-ball package (vs EP2S130F1508C3)
- Identical 1508-FBGA footprint enables drop-in alternative qualification (vs EP2S180F1508C3N)
- Same 1508-FBGA package as EP2S130 enables field upgrade paths (vs EP2S130F1508C3)
Design Notes
The EP2S180F1508C3NAA Stratix II device requires a multi-rail power distribution network (PDN) including a 0.9 V to 1.1 V VCCINT core supply, a 1.5 V or 1.8 V VCCPD programming supply, a 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V VCCIO for I/O banks, and a separate analog supply for transceiver PLLs. Per the Stratix II device handbook, the VCCINT supply must be decoupled with low-ESR bulk and 0.1 uF ceramic capacitors placed as close as possible to each supply pin pair. Use a power sequencer to enforce the manufacturer's required power-up/power-down order to avoid latch-up. Estimated: at typical 50% toggle activity and 25 degC ambient, expect total device power in the 8-15 W range.
The 1508-ball FCBGA package has a junction-to-ambient thermal resistance (theta_JA) in the 8-12 C/W range with adequate PCB thermal vias and copper pours, depending on airflow. Stratix II devices at the EP2S180 density typically dissipate 10-15 W at moderate toggle rates and 20+ W at full utilization, so a thermal management plan including PCB thermal vias, internal copper planes, and possibly a heat spreader is essential. Designers should perform thermal simulations in Quartus II PowerPlay to estimate junction temperature under worst-case workloads.
The 1508-ball FCBGA requires a high-density PCB stack-up with microvias or via-in-pad for the inner-row balls. Per Intel's package guidelines, the 1508-FBGA uses a 1.0 mm ball pitch - designs must use high-density interconnect (HDI) PCB technology with at least 4-6 build-up layers. Controlled-impedance routing for 6.375 Gbps transceiver channels and LVDS I/Os requires 50 ohm single-ended and 100 ohm differential impedance with at most 5-10% tolerance. Decoupling capacitors must be placed within 100 mils of their respective supply pins.
Stratix II EP2S180 designs must configure the I/O standards and bank voltages before bringing up the fabric. Common pitfalls include: (1) mixing 1.5 V and 1.8 V VCCIO in the same I/O bank - this is not supported; (2) leaving transceiver reference clocks unterminated - this prevents PLL lock; (3) using Quartus II versions newer than 13.0sp1, which do not include Stratix II support; (4) ignoring configuration scheme selection (AS, PS, JTAG) before PCB layout, which determines passive component placement around MSEL pins. Verify all MSEL pin settings against the configuration mode required by your design.
For 6.375 Gbps transceiver operation, PCB stack-up, transceiver channel routing, and AC-coupling capacitors must meet the Stratix II device handbook's signal-integrity guidelines. Use stripline routing for inner layers and ensure reference planes are continuous beneath the entire transceiver channel. AC-coupling capacitors should be 0402 or 0201 size, placed within 250 mils of the FPGA pin, with ground vias adjacent for return-current continuity. Estimated: at 6.375 Gbps, expect 1-3 dB channel loss over a 10-inch FR4 trace.
Compliance Information
Compliance status not specified in the verified web data. Per the XAIPART cross-reference, EP2S180F1508C3N is the Pb-free N-suffix variant; the NAA suffix is a special-order code. Confirm RoHS/REACH status with the distributor before design-in.
