EP2S130GF1508C3N - Stratix II FPGA, 132K LEs, 1508-FCBGA | Altera
MPN: EP2S130GF1508C3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $7650 | $76,500.00 |
| 50 | $6975 | $348,750.00 |
| 100 | $6375 | $637,500.00 |
| 250 | $5950 | $1,487,500.00 |
EP2S130GF1508C3N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs) interconnected by a programmable routing fabric. It belongs to the broader hierarchy programmable logic device (PLD) -> CPLD/FPGA -> system-on-chip fabric -> semiconductor. FPGAs are differentiated from ASICs by being fully reconfigurable in the field, while delivering ASIC-class throughput for parallel workloads such as digital signal processing, packet processing, and high-speed interfacing.
Key features of the EP2S130GF1508C3N include up to 36 embedded DSP blocks organized into a column-based multiplier/accumulator fabric, support for external memory interfaces up to DDR2 SDRAM and QDRII/RLDRAM-II, and a multi-gigabit transceiver-less general-purpose I/O subsystem with up to 1126 user I/Os. The device also supports Altera's Enhanced Configuration (EPC) devices for fast parallel configuration from flash memory.
The Stratix II architecture uses an adaptive logic module (ALM) containing 8 inputs and a fracturable look-up table (LUT) that can be split into two 4-input LUTs or recombined to implement 7-input functions. Combined with the TriMatrix memory block hierarchy (MLABs, M512, M4K, M-RAM), the device delivers very high logic utilization and block-memory density for dataflow applications.
Typical applications include high-performance digital signal processing (radar, software defined radio, video processing), telecom line-card packet processing, ASIC prototyping, and high-throughput memory controllers. The 1508-FCBGA package with exposed thermal lid enables high I/O density and efficient heat extraction for full-power operation.
When designing with this device, pay close attention to power integrity and decoupling: the 1508-BGA package requires a multi-layer PCB with continuous power and ground planes beneath the device. Use the Quartus II power calculator and thermal-aware pin planner to manage the >15 W typical dissipation at full DSP utilization.
This page synthesizes distributor stock, Stratix II family drop-in alternatives, and design notes not found in the manufacturer datasheet. Last refreshed 2026-09-09.
Drop-in alternatives for EP2S130GF1508C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130GF1508C3N (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Mounting Type, Family.
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EP2S130F1508C3N
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View Datasheet βEP2S130F1508C4N
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View Datasheet βEP2S130F1508C3
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View Datasheet βEP2S130F1508I4N
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View Datasheet βEP2S130F1508I4
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View Datasheet βEP2S130F1508C4RB
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View Datasheet βEP2S130F1508C5RB
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View Datasheet βEP2S130GF1508C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 132,540 |
| Adaptive Logic Modules (ALMs) | 53,016 |
| Total Memory Bits | 6,747,840 bits |
| Embedded 18x18 Multipliers | 1126 |
| DSP Blocks | 36 |
| Package | 1508-ball FCBGA (FineLine BGA) |
| Process Technology | 90 nm CMOS |
| Configuration Scheme | Enhanced Configuration (EPC) supported |
| External Memory Support | DDR2 SDRAM, QDRII, RLDRAM-II |
| Operating Temperature | Commercial (0C to +85C) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Design Software | Quartus II (legacy) |
| Lead-Free | Yes |
EP2S130GF1508C3N 1508-ball fcbga (fineline bga) Pin Configuration Guide
Pin configuration for EP2S130GF1508C3N (1508-ball fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130GF1508C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130GF1508C3N is suitable for 6 applications: High-Performance Digital Signal Processing, Telecom Line-Card Packet Processing, ASIC Prototyping and Emulation, High-Throughput Memory Controllers, Software Defined Radio Baseband, Medical Imaging and Diagnostics.
High-Performance Digital Signal Processing
The EP2S130GF1508C3N's 1126 18x18-bit hardware multipliers and 36 dedicated DSP blocks deliver up to ~75 GMACs of multiply-accumulate throughput at 200 MHz - ideal for high-end DSP workloads. In radar beamforming, software defined radio (SDR), and video codec pipelines, the parallel multiplier fabric outperforms sequential DSP processors by 10x or more. Use the device when your DSP algorithm maps to massively parallel MAC operations and fits within 132K LEs of control logic.
Recommended
Telecom Line-Card Packet Processing
Telecom line cards require multi-gigabit packet classification, queue management, and traffic shaping - workloads that map directly to the EP2S130GF1508C3N's 132,540 LEs and 6.7 Mbit TriMatrix memory. The DDR2/QDRII/RLDRAM-II memory controllers provide sufficient bandwidth for 10+ Gbps aggregate throughput. Altera's Stratix II IP cores for Ethernet MAC, packet classifier, and traffic manager integrate cleanly with the device's memory hierarchy.
Recommended
ASIC Prototyping and Emulation
With 132K LEs and abundant DSP/memory resources, the EP2S130GF1508C3N can emulate ASIC RTL blocks of ~1-3 million gates depending on clock rate and pipeline depth. Multi-FPGA partitioning allows emulation of 10+ million gate ASICs using multiple Stratix II devices with high-speed LVDS interconnect. The 1508-ball FCBGA package exposes enough I/Os for inter-FPGA time-domain-multiplexed channels - a standard ASIC emulation architecture.
Recommended
High-Throughput Memory Controllers
The EP2S130GF1508C3N's external memory interface supports DDR2 SDRAM, QDRII, and RLDRAM-II with dedicated PHY and controller IP. In storage and database acceleration applications, multiple memory channels can be driven from one device for high aggregate bandwidth (>20 GB/s). The TriMatrix memory blocks (MLAB/M512/M4K/M-RAM) provide flexible on-chip buffering between the external memory and the datapath fabric.
Recommended
Software Defined Radio Baseband
SDR baseband processing for wireless infrastructure (LTE, WiMAX, multi-standard base stations) requires parallel FFT/filters/modulators that map efficiently to the EP2S130GF1508C3N's DSP fabric. With 132K LEs and 1126 multipliers, one device can process multiple antennas or carrier channels simultaneously. The Stratix II DSP block's accumulate mode simplifies FIR and CIC filter implementations, reducing LE usage by ~40% versus pure-LUT implementations.
Recommended
Medical Imaging and Diagnostics
CT, MRI, and ultrasound imaging systems use the EP2S130GF1508C3N to process real-time image reconstruction algorithms such as filtered back-projection and beamforming. The 6.7 Mbit embedded memory and high multiplier count enable sub-frame latency for 30+ fps image rendering. The 1508-ball FCBGA package's exposed thermal lid supports continuous operation at full DSP utilization in air-cooled medical imaging chassis.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130GF1508C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1508C3N | EP2S130F1508C4N | EP2S130F1508C5N | EP2S130F1508I4N |
|---|---|---|---|---|---|
| Package | 1508-ball FCBGA | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 132,540 | 132,540 - same | 132,540 - same | 132,540 - same | 132,540 - same |
| Embedded Memory (bits) | 6,747,840 | 6,747,840 - same | 6,747,840 - same | 6,747,840 - same | 6,747,840 - same |
| 18x18 Multipliers | 1126 | 1126 - same | 1126 - same | 1126 - same | 1126 - same |
| Speed Grade | C3 | C3 - same | C4 (faster) | C5 (fastest) | I4 (industrial) |
| Temperature Range | Commercial (0C to +85C) | Commercial - same | Commercial - same | Commercial - same | Industrial (-40C to +100C) |
| EPC Configuration Support | Yes (G suffix) | No (standard configuration) | No (standard configuration) | No (standard configuration) | No (standard configuration) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Enhanced Configuration (EPC) device support (vs EP2S130F1508C3N)
- Commercial speed grade C3 - most widely available (vs EP2S130F1508C4N)
- Highest density Stratix II in 1508-ball package (vs EP2S130F1020C5N (1020-ball variant))
Design Notes
Estimated: At full DSP utilization with ~75% toggle rate, the EP2S130GF1508C3N can dissipate 15-20 W. Use the Quartus II PowerPlay power analyzer early in the design cycle to characterize your specific workload - actual consumption varies 5x between control-plane and DSP-saturated designs. Provide at least four dedicated power planes (VCCINT, VCCIO banks, VCCAUX, VCCD_PLL) with bulk decoupling of 330 uF per rail plus 0.1 uF/10 nF/1 nF high-frequency bypass on each power pin group. Voltage droop under transient load can cause functional failure even within the datasheet's steady-state limits.
The 1508-ball FCBGA package uses an exposed thermal lid on top of the die - heat MUST be extracted through the lid with a heatsink or heat-pipe assembly. Without a thermal solution, junction temperature can exceed 100C within seconds at full DSP utilization. Apply thermal interface material (TIM) with conductivity >= 3 W/mK between lid and heatsink, and torque the heatsink to the recommended pressure (~30 psi) to avoid die cracking. The bottom of the package also benefits from thermal vias in the PCB inner planes.
The 1508-ball FCBGA's 1.0 mm ball pitch requires microvia or via-in-pad PCB technology for reliable fanout. Use an 8-layer or 10-layer stackup with continuous ground planes on layers 2 and N-1 beneath the device for power integrity and signal return paths. Trace impedance must be controlled to 50 ohm single-ended / 100 ohm differential for LVDS pairs used in multi-FPGA or memory interconnect. Consult Altera's Stratix II Board Design Guidelines for the recommended stackup and via patterns.
Place the EPC configuration flash (EPC16UC88 or EPC64) within 2 inches of the FPGA's configuration data bus to meet setup/hold timing on DCLK and DATA[]. Route configuration signals on the same PCB layer with controlled impedance and matched lengths. Avoid routing them adjacent to high-speed LVDS or DDR memory signals to prevent crosstalk-induced configuration failures. Provide a JTAG header (10-pin 0.1-inch dual-row) accessible without removing the heatsink for in-system programming.
DDR2/QDRII/RLDRAM-II interfaces running at 200+ MHz require matched-length address/command/clock traces within 25 ps skew across byte lanes per the Stratix II External Memory Interface Handbook. Use the Memory Interface PIN Planner in Quartus II to generate the pin assignments and length-matching constraints; manual pin selection is error-prone. Series-termination resistors are NOT allowed on DDR2 address/command/clock signals for the Stratix II - use the on-chip OCT (on-chip termination) feature instead, configured per bank in the Quartus II Assignment Editor.
Compliance Information
RoHS compliant per Altera/Intel product page. Lead-free BGA balls (SAC305 or SnAgCu). Halogen-free status not confirmed in verified data - assumed unknown. NRND as of 2026-09-09.
