EP2S30F672I5 - Stratix II FPGA, 33.8K LE, 672-BGA | Intel (Altera)
MPN: EP2S30F672I5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $185 | $185,000.00 |
EP2S30F672I5 Overview
What is an FPGA? A Field-Programmable Gate Array is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic -> semiconductor -> integrated circuit, alongside CPLDs and structured ASICs. Stratix II FPGAs specifically target high-performance DSP, telecom, and parallel processing workloads where ASIC development cost is prohibitive.
Key features include up to 500 user I/Os (492 outputs reported), embedded memory blocks totaling approximately 1.36 Mbits, 16 DSP blocks (each capable of 9-bit multiplications), four enhanced PLLs, and dedicated high-speed serial interfaces supporting multiple gigabit protocols. The Stratix II architecture introduces adaptive logic modules (ALMs) that pack 8 inputs into a single look-up-table-based slice, doubling effective logic density versus the original Stratix family.
The device leverages a true 1.2 V 90 nm core with copper interconnect layers, reducing dynamic power by approximately 50% compared with the previous 130 nm Stratix generation. Internal signal integrity is enhanced through dedicated clock networks with skew matching across all four quadrants of the die. Designers benefit from Quartus II development suite support, including SOPC Builder for embedded processor subsystems and DSP Builder for algorithmic block synthesis.
Typical applications include high-speed digital signal processing in wireless base stations, medical imaging front-ends, ASIC prototyping, high-end video and image processing pipelines, and telecom line-card packet processing. The 672-ball package provides sufficient I/O for multi-channel gigabit serializer/deserializer interfaces, while the rich DSP fabric accelerates FFT, FIR, and Viterbi decoding in real time.
When designing with the EP2S30F672I5, ensure proper decoupling with low-ESR ceramic capacitors near each power pin and a 4-layer PCB with dedicated ground and power planes. The 1.00 mm ball pitch requires precise PCB manufacturing - non-solder mask defined (NSMD) pads with microvia-in-pad are recommended for reliable BGA assembly. Thermal management via the package's exposed thermal pad is essential when operating at full DSP throughput.
This page consolidates distributor stock, lifecycle risk, and practical design considerations not found in the manufacturer datasheet alone, helping engineers validate sourcing, footprint reuse, and migration paths across the Stratix II family.
Drop-in alternatives for EP2S30F672I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S30F672I5 (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Operating Temperature, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S30F672C5N
✅ Drop-In✓ In Stock
$450 / Unit
View Datasheet →EP2S30F672I4N
✅ Drop-In✓ In Stock
$145 / Unit
View Datasheet →EP2S30F672I4
✅ Drop-In✓ In Stock
$695 / Unit
View Datasheet →EP2S30F672C5
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP2S30F672C5NRB
✅ Drop-In✓ In Stock
$180 / Unit
View Datasheet →EP2S30F672C5NGC
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2S30F672I5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements (LE) | 33,880 |
| Adaptive Logic Modules (ALM) | 13,567 (approx., per Stratix II family ratio) |
| Total RAM Bits | 1,368,576 (1.36 Mbit) |
| DSP Blocks | 16 (9-bit x 9-bit multipliers) |
| Maximum User I/Os | 500 (492 outputs reported) |
| Maximum Operating Frequency | 609.76 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Package | 672-ball FC-FBGA (FineLine BGA) |
| Ball Pitch | 1.00 mm |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Speed Grade | 5 (fast) |
EP2S30F672I5 672-ball fc-fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP2S30F672I5 (672-ball fc-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S30F672I5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S30F672I5 is suitable for 6 applications: Wireless Base Station DSP, Medical Imaging Front-End, ASIC Prototyping Platform, High-End Video Processing Pipeline, Telecom Line-Card Packet Processing, Industrial Motor Control.
Wireless Base Station DSP
The EP2S30F672I5's 33,880 logic elements and 16 dedicated DSP blocks deliver up to 3.0 GMACs of 9-bit multiply-accumulate throughput, well-matched to W-CDMA, LTE, and WiMAX baseband processing where chip-rate FIR filtering and Viterbi decoding must complete within microsecond latencies. The 1.36 Mbit embedded RAM holds approximately 256 K samples of soft-decision data, sufficient for soft-input Viterbi and turbo decoder buffers. The 500 user I/Os interface directly to multi-antenna radio front-ends, while the four enhanced PLLs provide independent clock domains for ADC/DAC sampling, CPRI link serialization, and backhaul Ethernet. At 1.2 V core on 90 nm CMOS, the device balances throughput and power for indoor pico-cell deployments.
Recommended
Medical Imaging Front-End
Ultrasound and CT imaging front-ends rely on the EP2S30F672I5's 16 DSP blocks to implement 32-tap FIR beamformers in real time across 64 to 128 channels simultaneously. The 1.36 Mbit embedded RAM captures raw RF A-scan lines at 40 MSPS, allowing on-chip coherent averaging before backhaul transfer over LVDS pairs on the dedicated SERDES channels. The industrial -40C to +100C temperature rating ensures reliable operation in mobile cart-based ultrasound equipment where ambient can swing widely. The 672-ball FC-FBGA footprint supports the dense LVDS routing to multi-channel ADC arrays (such as the AD9228) while keeping the PCB under 10 cm x 10 cm for handheld probe heads.
Recommended
ASIC Prototyping Platform
With 33,880 logic elements, the EP2S30F672I5 prototypes ASICs targeting up to 500 K ASIC gates at clock rates exceeding 200 MHz, accelerated by the Stratix II ALM architecture that maps 8-input LUTs efficiently to random logic. The 500 user I/Os and SERDES channels replicate most ASIC pad sets including DDR2 memory controllers and PCI Express endpoints, allowing real-IO verification rather than simulation. Multiple EP2S30F672I5 devices can be co-traced via dedicated global clock networks, partitioning multi-million-gate ASICs across two to four FPGAs on a single daughter card. The 90 nm process silicon delivers predictable timing closure with Quartus II TimeQuest, reducing prototype iteration cycles.
Recommended
High-End Video Processing Pipeline
The EP2S30F672I5 implements full HD 1080p60 video processing at 148.5 MHz pixel clock, with the 1.36 Mbit embedded RAM buffering 3-4 frame lines of RGB data for deinterlacing, scaling, and color-space conversion. The 16 DSP blocks accelerate motion-adaptive deinterlacing algorithms and 2D noise reduction kernels. The 500 user I/Os support HDMI 1.3a input plus dual LVDS display outputs simultaneously, eliminating external bridge chips. The industrial temperature rating suits industrial signage and broadcast equipment where chassis temperatures approach 70C during continuous 24/7 operation, and the 672-ball FC-FBGA accommodates the high trace density required for parallel video buses.
Recommended
Telecom Line-Card Packet Processing
The EP2S30F672I5 implements 10 Gbps packet classification and queuing at line rate, with the embedded SERDES supporting four lanes of SGMII or one lane of XAUI toward network processors. The 1.36 Mbit embedded RAM holds up to 32K packet descriptors in external TCAM shadow tables, while the 16 DSP blocks accelerate hash-based lookups and CRC32 checksums. The four enhanced PLLs provide independent clocks for each SERDES lane plus a system-side 156.25 MHz reference, eliminating external clock buffers. The 500 user I/Os connect to quad SFP+ cages, RLDRAM-II classification memory, and SPI-control PHY devices within a single ATCA line card.
Recommended
Industrial Motor Control
The EP2S30F672I5 drives multi-axis field-oriented control (FOC) loops for industrial servo drives, with the 16 DSP blocks computing Park/Clarke transforms and PID loops for 3-phase PMSM motors at 100 kHz PWM rates. The 1.36 Mbit embedded RAM stores 256-point sine/cosine LUTs and adaptive controller state, while the 500 user I/Os interface to resolvers, encoders, gate drivers, and isolated current sensors. The industrial -40C to +100C temperature range supports factory-floor enclosures without air conditioning, and the 672-ball FC-FBGA with 1.00 mm pitch accommodates the dense routing to multi-axis inverter boards. The four enhanced PLLs synchronize PWM outputs to encoder feedback within 5 ns jitter.
Recommended
Recommended Products Summary
Engineering reference data for EP2S30F672I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S30F672C5N | EP2S30F672I4N | EP2S30F672I4 | EP2S30F672C5 | EP2S30F672C5NRB | EP2S30F672C5NGC |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | 5 (fast) | 5 (fast) | 4 (slower) | 4 (slower) | 5 (fast) | 5 (fast) | 5 (fast) |
| Lead-Free (RoHS) | Yes | Yes | Yes | No (leaded) | No (leaded) | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Highest logic density at 90 nm with 16 dedicated DSP blocks (vs Cyclone V 5CEFA7F672I7)
- Industrial temperature grade variant available as direct drop-in (vs EP2S30F672C5N)
- Speed grade 5 yields the fastest timing closure in the Stratix II family (vs EP2S30F672I4N)
Design Notes
The 672-ball FC-FBGA uses a 1.00 mm ball pitch and requires a 4-layer PCB with non-solder mask defined (NSMD) pads of 0.50 mm diameter. Microvia-in-pad technology is strongly recommended for reliable BGA assembly, particularly under thermal cycling. Solid ground and power planes should be placed on layers 2 and 3 respectively, with the top layer reserved for signal escape routing. Decoupling requires at least 22 low-ESR 0.1 uF ceramic capacitors distributed around the package perimeter plus a single 100 uF tantalum or polymer bulk capacitor adjacent to each VCC core pin cluster. Estimated via-in-pad cost adds approximately $0.50 per board compared with standard dog-bone fanout.
Estimated: at full DSP throughput (16 DSP blocks @ 300 MHz, all logic switching), the EP2S30F672I5 dissipates approximately 5 to 8 W in the 672-FBGA package. With a typical theta_JA of 12 C/W on a 4-layer JEDEC test board, junction temperature rises 60 to 95 C above ambient. For sealed enclosures or industrial environments reaching 70 C ambient, attach a heatsink via the package thermal pad using thermal interface material rated at 0.2 C/W or better. Airflow of 200 LFM reduces effective theta_JA by approximately 30%.
The EP2S30F672I5 requires four independent power rails: VCCINT (1.2 V core), VCCIO (1.2 V to 3.3 V I/O banks), VCCPD (1.2 V to 3.3 V pre-driver), and VCCA (2.5 V PLL analog). Power sequencing is mandatory - VCCINT must reach 0.9 V before VCCIO and VCCPD exceed 0.6 V to prevent I/O latch-up. Use the Stratix II PowerPlay early power estimator in Quartus II to size the DC-DC converters before final board layout; typical VCCINT current at 300 MHz full utilization is 2.5 A, with peaks to 4 A during configuration.
Do not migrate from EP2S30F672I5 to a Cyclone V or Arria V 672-pin device assuming pin compatibility - the ball maps differ significantly even though both use 672-ball FBGA packages. Verify against the Stratix II handbook pinout file (stx2_51002.pdf) before PCB layout. Additionally, the Quartus II programmer support for Stratix II ends at version 13.0 - do not attempt to use newer Quartus Prime releases for compilation, as they have removed the Stratix II device database entirely.
Compliance Information
RoHS compliant per ordering code suffix 'N' (I5N variant). AEC-Q100 not applicable - this is an FPGA, not a discrete automotive IC. Conflict minerals compliance per Intel's CMRT filings.