EP2A25F672I8N - APEX II FPGA 900K Gates 672-BGA | Intel / Altera
MPN: EP2A25F672I8N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198.5 | $198,500.00 |
EP2A25F672I8N Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic elements (LEs), embedded memory blocks, and programmable interconnect. FPGAs sit within the broader semiconductor taxonomy as programmable logic -> programmable ICs -> integrated circuits, and they are widely used for ASIC prototyping, custom DSP pipelines, glue logic, and high-speed parallel interfaces where fixed-function ASSPs are unavailable or uneconomical. The APEX II family specifically targets high-density, multi-standard I/O designs by combining PLLs, True-LVDS capable I/O, and substantial on-chip memory on a single die.
Key features of the EP2A25F672I8N include 333 MHz internal operation, 1.69 ns propagation delay, 1.5 V core supply, 27 x 27 mm FineLine BGA with 1 mm pitch, and an industrial operating range of 0 °C to 85 °C. Each device is configured via Altera's Quartus II design software, which supports both VHDL and Verilog HDL entry, along with MegaWizard Plug-In Manager IP blocks for common functions such as memory controllers, FIFO buffers, and high-speed transceivers.
Typical applications include high-speed telecommunications backplanes, parallel DSP arrays, custom ASIC prototyping, and industrial control systems requiring multi-standard I/O. The combination of True-LVDS and HyperTransport support makes the EP2A25F672I8N well suited for bridging parallel bus standards in storage area networks and for prototyping proprietary interconnect fabrics.
When designing with this device, careful attention must be paid to the 1.5 V core supply decoupling (multiple low-ESR ceramic capacitors near each VCCINT ball) and to simultaneous-switching output (SSO) analysis for the 492 user I/Os. Because the part is mature and in its end-of-life window, designers should verify long-term availability with their distributor before committing to a new design-in.
Drop-in alternatives for EP2A25F672I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A25F672I8N (same form factor and footprint) — differing in Process Technology, Package, Operating Temperature, Speed Grade, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A25F672I8
✅ Drop-In✓ In Stock
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View Datasheet →EP2A25F672I7N
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View Datasheet →EP2A25F672C7N
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View Datasheet →EP2A15F672I8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP2A25F672I8N Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Device | EP2A25 |
| Logic Elements | 24,320 |
| Gates | 900,000 |
| Embedded Memory (bits) | 622,592 |
| User I/Os | 492 |
| Package | 672-ball FC-FBGA (FineLine BGA) |
| Package Size | 27 x 27 mm |
| Ball Pitch | 1 mm |
| Process Technology | 0.15 µm all-layer copper-metal |
| Metal Layers | Up to 8 |
| Core Voltage (VCCINT) | 1.5 V |
| Internal Frequency (max) | 333 MHz |
| Propagation Delay | 1.69 ns |
| Operating Temperature | 0 °C to 85 °C |
| Logic Family | CMOS |
| I/O Standards Supported | True-LVDS, LVPECL, PCML, HyperTransport |
| Configuration Method | SRAM-based (Altera Quartus II) |
| RoHS Status | unknown |
| Lead-Free | unknown |
EP2A25F672I8N 27 x 27 mm Pin Configuration Guide
Pin configuration for EP2A25F672I8N (27 x 27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A25F672I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A25F672I8N is suitable for 6 applications: High-Speed Telecommunications Backplane Bridging, Parallel DSP Array and FIR Filter Banks, Custom ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Storage Area Network Protocol Bridges, Legacy Medical Imaging Backplane Controllers.
High-Speed Telecommunications Backplane Bridging
The EP2A25F672I8N's 1 Gbps True-LVDS capable I/Os and HyperTransport support make it well suited to bridge between parallel telecom backplanes and parallel DSP or packet-processing pipelines. With 492 user I/Os available, designers can implement multiple 16- or 32-bit source-synchronous LVDS channels on a single device, and the 622,592 bits of embedded memory buffer packet bursts between line cards. The 1.5 V core and 27 x 27 mm FineLine BGA fit the dense form factor of modern optical line terminals. Designers should plan PLL placement carefully and use Altera's LVDS megafunction to constrain I/O timing accurately.
Recommended
Parallel DSP Array and FIR Filter Banks
The 24,320 logic elements and embedded multiplier support of the APEX II architecture let designers build parallel multiplier-accumulator arrays and FIR filter banks at sample rates up to 333 MHz. The 622,592 bits of embedded SRAM provide coefficient and sample-line buffering without external memory for moderate-length filters, and the industrial 0-85 °C range covers most outdoor and rack-mounted signal processing installations. For long-tap filters, designers should add external ZBT or DDR SRAM using the EP2A25F672I8N's plentiful LVDS I/Os to extend the data path.
Recommended
Custom ASIC Prototyping and Emulation
With 900K system gates, the EP2A25F672I8N provides a practical prototyping platform for ASICs up to roughly 500K gate-equivalents when accounting for utilization overhead. The Quartus II design flow supports Verilog and VHDL synthesis identical to the target ASIC flow, enabling functional verification at near-real-time speeds, and the 1 Gbps LVDS I/Os let engineers emulate high-speed ASIC pads. Designers commonly prototype one ASIC slice per device and multi-FPGA partition across several EP2A25 units on a single emulation board. The mature Quartus II toolchain with MegaWizard IP is well documented for rapid IP reuse.
Recommended
Industrial Control and Factory Automation
The industrial 0-85 °C operating range and 492 user I/Os let the EP2A25F672I8N interface with dozens of sensors, encoders, and actuators simultaneously, while the embedded memory and 24,320 LEs implement real-time control loops at deterministic 333 MHz clock rates. The True-LVDS support enables direct connection to modern industrial cameras and high-speed serial links without external transceivers. Robust 1.5 V core regulation with multi-rail decoupling is essential for factory floor EMI immunity, and designers should allocate GPIO banks for both 3.3 V and 5 V signaling levels using APEX II bank-I/O features.
Recommended
Storage Area Network Protocol Bridges
Fibre Channel and Serial ATA bridges in storage area networks benefit from the EP2A25F672I8N's parallel LVDS bandwidth and 622 Kbit embedded SRAM for command and payload queuing. The 333 MHz internal clock and 1.69 ns propagation delay let designers implement protocol state machines with tight loop times, and the HyperTransport I/O standard supports direct attachment to AMD processor-based storage controllers of that era. Designers typically use the APEX II's PLLs to generate multiple clock domains for serializer/deserializer and protocol logic from a single board-level reference.
Recommended
Legacy Medical Imaging Backplane Controllers
The EP2A25F672I8N has historically been deployed as a backplane controller in ultrasound and digital X-ray imaging systems where multiple LVDS sensor arrays converge on a single image-processing FPGA. With 492 user I/Os, one device can aggregate data from up to several 16-channel LVDS sensor heads, and the embedded memory buffers raw image lines before forwarding to the host processor. The mature Quartus II IP catalog includes image-line buffers and color-space converters specifically tuned for APEX II. Designers should verify long-term availability with their distributor before committing to new production runs.
Recommended
Recommended Products Summary
Engineering reference data for EP2A25F672I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A25F672I8 | EP2A25F672I7N | EP2A25F672C9N | EP2A25F672C7N | EP2A15F672I8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Speed Grade | -8 | -8 | -7 (slower) | -9 (faster) | -7 (slower) | -8 |
| Operating Temperature | 0 °C to 85 °C (industrial) | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 70 °C (commercial) | 0 °C to 70 °C (commercial) | 0 °C to 85 °C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Same die and pinout as the -8 industrial sibling EP2A25F672I8, with only Pb-free suffix difference (vs EP2A25F672I8)
- Higher Fmax margin (333 MHz internal) than the -7 speed grade variant (vs EP2A25F672I7N)
- Industrial 0-85 °C temperature range supports rack and factory-floor deployment (vs EP2A25F672C9N)
Design Notes
Estimated: at 333 MHz full toggle on 24,320 LEs, the EP2A25F672I8N core current at 1.5 V is on the order of 1.5 to 2.5 A. Provide at least four 100 µF tantalum bulk caps and a dense 0.1 µF + 1 µF ceramic decoupling network on every VCCINT ball row. Use a dedicated 1.5 V LDO or switching regulator with 1% accuracy - the APEX II core is sensitive to VCCINT ripple above 50 mV p-p. Include a power-good reset to the nCONFIG pin to prevent configuration corruption during brownouts.
The 672-ball FC-FBGA at 27 x 27 mm with 1 mm pitch requires 0.5 mm pads on the PCB, microvia or 4-mil via-in-pad escape, and ENIG or ENEPIG surface finish for reliable assembly. Match the BGA land pattern exactly to the Altera reference land pattern in the APEX II Device Handbook - deviating can cause solder joint opens or shorts. Use at least 8-layer stack-up with dedicated VCCINT, VCCIO, and GND planes. Escape routing under the BGA must be designed with the manufacturer's via pattern in mind; do not hand-route without simulation.
With 492 user I/Os supporting 1 Gbps True-LVDS, simultaneous switching output (SSO) noise analysis is mandatory in Quartus II before sign-off. Use the APEX II I/O Bank Planner to assign high-speed LVDS pairs to banks with adjacent GND balls, and avoid placing noisy 3.3 V single-ended I/Os in the same bank as 1 Gbps LVDS receivers. Maintain 100 ohm differential impedance on LVDS pairs and 50 ohm on single-ended. Series-termination resistors near the FPGA pin help damp reflections on long board traces.
Three pitfalls recur in APEX II 25 designs: (1) using the wrong configuration mode (e.g., passive serial with the wrong clock edge) - always verify with the ByteBlaster II cable and Quartus II programmer; (2) forgetting the JTAG TCK pull-down resistor, which can leave the device in JTAG mode at power-up; (3) running pre-compiled timing reports from the wrong speed grade - if you migrate from -8 to -7 to save cost, regenerate all timing analysis with the new speed bin. Also note the device is in last-time-buy - verify long-term inventory before production commit.
Compliance Information
The 'N' suffix in the MPN denotes Pb-free (lead-free) packaging per Altera ordering convention. Specific RoHS, REACH, and AEC-Q100 status not confirmed in verified web data - refer to manufacturer declaration for compliance certificate.
