EP2S30F672C5 - Stratix II FPGA, 33,880 LE, 672-FBGA | Intel
MPN: EP2S30F672C5 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 250 | $175 | $43,750.00 |
| 500 | $155 | $77,500.00 |
EP2S30F672C5 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable interconnect into a single silicon fabric. FPGAs sit in the broader hierarchy of programmable logic: CPLD (smaller, non-volatile, lower density) -> FPGA (large, volatile, high-density) -> SoC FPGA (FPGA fabric + hard CPU cores). They are widely used as hardware accelerators, glue logic, and prototyping platforms across wired communications, industrial, and test & measurement segments.
Key features of the EP2S30F672C5 include 1,694 Logic Array Blocks (LABs), 12 embedded DSP blocks for high-speed multiply-accumulate operations, and Stratix II's signature adaptive logic modules (ALMs) that give finer-grained resource utilization than the older 4-input LUT architecture. The device supports external memory interfaces including DDR, DDR2, QDR, and RLDRAM via dedicated PHY circuits, and offers high-speed serial I/O blocks for 1 Gbps+ LVDS and SERDES connectivity.
The architecture implements TriMatrix embedded memory totaling 1,369,728 RAM bits, distributed across three block sizes (M512, M4K, M-RAM) for flexible FIFO and lookup-table implementations. The 90 nm process and 1.2 V core keep dynamic power within FPGA norms for the era, while the speed grade 5 (-C5) indicates a moderate-speed bin suitable for commercial-grade designs operating at 0 to 85C junction temperature.
Typical applications include high-speed digital signal processing, telecom line-card glue logic, video and image processing pipelines, network protocol bridging, ASIC prototyping, and high-throughput data acquisition. Designers use the EP2S30F672C5 when they need more logic density than a CPLD but do not require the higher cost of Stratix IV/V parts.
When designing with this device, ensure proper power-plane decoupling (multiple bulk + ceramic caps near every VCC/VCCIO island), follow Altera's pinout guidelines for the 672-FBGA flip-chip package, and use Quartus II design software for synthesis, place-and-route, and timing closure. Plan board layout with controlled-impedance traces for high-speed serial links.
This page synthesizes distributor pricing, drop-in package-compatible alternatives from the same Stratix II family, and practical design considerations not found in the manufacturer datasheet.
Drop-in alternatives for EP2S30F672C5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S30F672C5 (same form factor and footprint) β differing in Speed Grade, Package, Operating Temperature, Configuration Method, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S30F672C5N
β Drop-Inβ In Stock
$450 / Unit
View Datasheet βEP2S30F672C4
β Drop-Inβ In Stock
$498.43 / Unit
View Datasheet βEP2S30F672C4N
β Drop-Inβ In Stock
$121 / Unit
View Datasheet βEP2S30F672C3
β Drop-Inβ In Stock
$780 / Unit
View Datasheet βEP2S30F672C3N
β Drop-Inβ In Stock
$55 / Unit
View Datasheet βEP2S30F672C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 33,880 |
| Logic Array Blocks (LABs) | 1,694 |
| Total RAM Bits | 1,369,728 |
| Embedded Multipliers (DSP blocks) | 12 DSP blocks |
| Maximum User I/Os | 500 |
| Core Voltage | 1.2 V |
| Maximum Operating Frequency | 609.76 MHz |
| Process Technology | 90 nm CMOS |
| Package | 672-pin FC-FBGA (flip-chip) |
| Speed Grade | C5 (moderate-speed bin) |
| Operating Temperature (Commercial) | 0C to 85C junction |
| Mounting Type | Surface Mount (BGA) |
| Memory Type | TriMatrix (M512 / M4K / M-RAM) |
EP2S30F672C5 672-pin fc-fbga (flip-chip) Pin Configuration Guide
Pin configuration for EP2S30F672C5 (672-pin fc-fbga (flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S30F672C5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S30F672C5 is suitable for 6 applications: High-Speed Digital Signal Processing, Telecom Line-Card Glue Logic, Video and Image Processing Pipelines, ASIC Prototyping and Emulation, Network Protocol Bridging, High-Throughput Data Acquisition.
High-Speed Digital Signal Processing
The EP2S30F672C5's 12 dedicated DSP blocks each support 18x18-bit signed multiplication with 36-bit accumulators at up to 450 MHz, making it well-suited for FIR, IIR, and FFT pipelines in telecom baseband processing. Its 33,880 logic elements can absorb complex state machines and address-generation logic around the DSP fabric, while the TriMatrix memory (1,369,728 total RAM bits) provides per-tap coefficient storage and sample buffering without burning external SRAM. Designers typically place the FPGA between ADC/DAC channels and a host processor, where the C5 speed grade is sufficient for sample rates up to ~250 MSPS per channel. Compared with newer Stratix IV/V parts, the EP2S30 has fewer DSP blocks but adequate headroom for many mid-tier DSP designs.
Recommended
Telecom Line-Card Glue Logic
The EP2S30F672C5 with 500 user I/Os in the 672-ball FC-FBGA is ideal for telecom line cards that aggregate many low-speed control signals alongside high-speed serial links. The device bridges between network processors, PHYs, framer/mapper ASICs, and backplane SERDES, while implementing protocol-aware logic for SONET/SDH, Ethernet, or proprietary framing. The 90 nm process and 1.2 V core keep per-board power within the envelope of typical ATCA or AdvancedTCA line cards, while the high I/O count eliminates the need for an external bus-expansion CPLD. Designers commonly use the EP2S30F672C5 on line cards that previously required multiple smaller FPGAs, consolidating BOM and simplifying timing closure.
Recommended
Video and Image Processing Pipelines
The EP2S30F672C5's 33,880 logic elements and 1,369,728 RAM bits handle real-time video pipelines such as color-space conversion, scaling, de-interlacing, and overlay composition at HD resolutions. The 500 user I/Os provide enough LVDS pairs to drive or receive 24-bit RGB panels and parallel camera interfaces, while TriMatrix memory blocks act as line buffers without consuming external SDRAM bandwidth. The C5 speed grade supports pixel clocks up to ~150 MHz, sufficient for most 720p/1080i video designs. Compared with newer Cyclone/Arria parts, the EP2S30 trades power for higher absolute throughput and a more mature DSP block set, useful when retrofitting legacy video infrastructure.
Recommended
ASIC Prototyping and Emulation
Engineers used the EP2S30F672C5 widely as an ASIC prototyping vehicle before Stratix IV/V became dominant, because its 33,880 logic elements could host multi-million-gate ASIC RTL partitions while preserving timing-accurate I/O behavior. The 672-ball FC-FBGA exposes enough high-speed LVDS channels to mimic ASIC-to-ASIC buses, and the TriMatrix memory supports transaction-level testbench infrastructure for cache and DMA modeling. Quartus II's incremental compile and LogicLock regions map cleanly onto this part, letting teams prototype sub-modules independently and stitch them together for full-chip bring-up. Compared with software simulators, hardware prototyping on the EP2S30F672C5 runs at MHz real-time speeds for firmware development.
Recommended
Network Protocol Bridging
The EP2S30F672C5 is a flexible protocol-bridging platform for converting between SPI, I2C, UART, parallel GPIO, GMII/RGMII, SGMII, PCIe Gen1, and proprietary LVDS buses in industrial routers and gateways. Its 500 user I/Os allow simultaneous connection to multiple PHY chips, and the embedded DSP blocks accelerate CRC, hashing, and small-packet encryption without offloading to software. Designers commonly use the EP2S30F672C5 in mid-range industrial Ethernet switches, where it bridges between management CPUs and PHY/MAC layers, and in legacy industrial gateways that must terminate fieldbus (Modbus, Profibus) on one side and Ethernet on the other.
Recommended
High-Throughput Data Acquisition
The EP2S30F672C5's high I/O count and embedded memory make it a strong fit for multi-channel data-acquisition front-ends in test & measurement, radar, and medical imaging. The 12 DSP blocks perform real-time FFTs, windowing, and pulse compression on streaming ADC samples at rates up to ~250 MSPS per channel, while the TriMatrix memory serves as deep capture buffers before DMA to a host processor over PCIe or external parallel bus. The 672-ball FC-FBGA exposes enough LVDS pairs to fan out to multiple ADCs simultaneously. Designers value the EP2S30F672C5 in oscilloscope and logic-analyzer front-end designs where deterministic latency and high DSP throughput are both required.
Recommended
Recommended Products Summary
Engineering reference data for EP2S30F672C5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S30F672C5N | EP2S30F672C4 | EP2S30F672C4N | EP2S30F672C3 | EP2S30F672C3N |
|---|---|---|---|---|---|---|
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Speed Grade | C5 | C5 | C4 (faster) | C4 (faster) | C3 (fastest) | C3 (fastest) |
| Pb-free Finish | No (SnPb) | Yes (Pb-free) | No (SnPb) | Yes (Pb-free) | No (SnPb) | Yes (Pb-free) |
| Total RAM Bits | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| DSP Blocks | 12 | 12 | 12 | 12 | 12 | 12 |
| Maximum User I/Os | 500 | 500 | 500 | 500 | 500 | 500 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Speed-grade flexibility in identical 672-FBGA footprint (vs EP2S30F672C5N)
- Pb-free finish option without electrical change (vs EP2S30F672C4N)
- Higher logic density than lower Stratix II siblings (vs EP2S15F672C5)
Design Notes
The EP2S30F672C5 requires multiple supply rails: VCCINT (1.2 V core), VCCIO (one or more of 1.5/1.8/2.5/3.3 V per bank), VCC_PLL (analog PLL supply, typically filtered from 2.5 V or 1.2 V), and VCCPD (pre-driver supply). Decoupling requires at least 10 bulk 220 uF tantalum or polymer caps around the board periphery plus 0.1 uF and 0.01 uF ceramics under every VCC/VCCIO pin cluster. Use a star-ground topology with the FPGA as the center, and isolate PLL analog ground from digital ground with a single ferrite bead. Estimated: at typical utilization (50% LE, 50% memory, 100% DSP block toggling at 250 MHz), VCCINT current is approximately 1.0 to 1.5 A; always refer to the Stratix II PowerPlay early-power estimator for design-specific budgets.
The 672-ball FC-FBGA has a 1.0 mm ball pitch, requiring microvia (laser-drilled) or stacked-via PCB technology on at least the FPGA breakout layers. Plan at minimum a 6-layer stack-up with dedicated ground and power planes; 8 to 10 layers are recommended for designs that use multiple high-speed serial channels. Use length-matched routing for LVDS pairs (intra-pair skew under 10 ps) and matched-impedance traces for DDR2/QDR interfaces (50 ohm single-ended, 100 ohm differential). The flip-chip package has a die-up orientation; thermal vias under the BGA thermal pad are mandatory to dissipate the 5 to 10 W typical dissipation.
Common pitfalls when designing with the EP2S30F672C5: (1) Quartus II fitter can place user I/O into incompatible VCCIO banks - always run I/O Bank Assignment verification before board tape-out; (2) The C5 speed grade is the slowest bin, so designs requiring tight Fmax over 300 MHz may not close timing; consider C4 or C3 alternatives from the same Stratix II family in the same 672-FBGA footprint. (3) Stratix II uses 1.2 V VCCINT which is sensitive to IR drop - keep VCCINT plane as solid as possible and avoid routing signals across the core region. (4) Confirm factory-traceable stock because the part is obsolete; counterfeits are common.
Compliance Information
The EP2S30F672C5 uses SnPb (tin-lead) ball finish and is therefore not Pb-free; choose the N-suffix (EP2S30F672C5N) for RoHS-compliant assemblies. Other compliance attributes (REACH, halogen-free, conflict minerals) are not explicitly stated in the verified datasheet excerpts and are marked unknown per Data Authenticity Rule 2.
