EP3C10F256C8N - 10K LEs, 182 I/O Cyclone III FPGA | Altera/Intel
MPN: EP3C10F256C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.53 | $32.53 |
| 10 | $28.45 | $284.50 |
| 100 | $22.18 | $2,218.00 |
| 500 | $17.92 | $8,960.00 |
| 1,000 | $15.4 | $15,400.00 |
EP3C10F256C8N Overview
What is a Cyclone III FPGA? Cyclone III is the third-generation low-power FPGA family from Altera/Intel fabricated on a 60 nm process, sitting in the broader taxonomy of programmable logic devices (PLD) -> field-programmable gate array (FPGA) -> low-power FPGA -> SRAM-based FPGA -> semiconductor IC. It is engineered specifically for low static and dynamic power dissipation while integrating sufficient logic, memory and DSP resources to displace ASICs and ASSPs in volume production.
Key features of the EP3C10F256C8N include 23 embedded 18 x 18 multipliers (about 0.5 M Gates of equivalent logic), support for external memory interfaces such as DDR/DDR2/QDRII SRAM, embedded PLL-based clock management, Nios II soft-core processor compatibility, and the standard Altera Quartus II design flow. The device is RoHS-compliant, lead-free, and operates over the commercial 0 C to 85 C junction temperature range.
Technically, the EP3C10F256C8N integrates 10,320 logic elements organized into 645 LABs, 414 Kbits of embedded RAM (M9K blocks), 23 dedicated 18 x 18 multipliers for DSP, and four PLLs. The 256-pin FineLine BGA provides 182 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL and other single-ended and differential I/O standards with hot-socketing capability and configurable drive strength.
Typical applications include industrial motor control, video processing and display bridges, automotive infotainment (non-safety), consumer electronics control planes, communications line cards, and cost-optimized ASIC replacement. Its low power and high logic density at sub-$30 unit pricing make it suitable for both prototyping and volume production.
When designing with this part, plan the power distribution network around the 1.2 V core and per-bank I/O supplies, and use the Altera Quartus II development environment for synthesis, place-and-route, and timing closure. Ensure the PCB BGA layout follows Intel's recommended 1 mm pitch escape routing and that decoupling capacitors are placed as close to the package as possible.
This page synthesizes distributor pricing, verified cross-references within the Cyclone III family, and practical design notes not consolidated in the manufacturer datasheet, giving engineers a faster path to selection.
Drop-in alternatives for EP3C10F256C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C10F256C8N (same form factor and footprint) — differing in Package, Operating Temperature, RoHS Status, Process Technology, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C10F256C6N
✅ Drop-In✓ In Stock
$14.1 / Unit
View Datasheet →EP3C10F256I7N
✅ Drop-In✓ In Stock
$34.94 / Unit
View Datasheet →EP3C16F256C8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C25F256C8N
✅ Drop-In✓ In Stock
$38.95 / Unit
View Datasheet →EP3C10E144C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$15.2 / Unit
View Datasheet →EP3C10F256C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Logic Elements | 10,320 |
| Logic Array Blocks (LABs) | 645 |
| Embedded Memory (Bits) | 423,936 |
| User I/Os | 182 |
| Operating Frequency (max) | 402 MHz |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) |
| Process Technology | 60 nm low-power CMOS |
| Embedded 18x18 Multipliers | 23 |
| PLLs | 4 |
| Package | 256-pin FineLine BGA (FBGA-256, 17 x 17 x 1.8 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 C to 85 C (Commercial, 'C' grade) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | MSL3 (per JEDEC J-STD-020, typical for FineLine BGA) |
| Configuration Method | SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG |
| Equivalent Gate Count | ~0.5 M Gates (approximate) |
EP3C10F256C8N 256-pin fineline bga (fbga-256, 17 x 17 x 1.8 mm) Pin Configuration Guide
Pin configuration for EP3C10F256C8N (256-pin fineline bga (fbga-256, 17 x 17 x 1.8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C10F256C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C10F256C8N is suitable for 7 applications: Industrial Motor Control, Video Processing and Display Bridge, ASIC Prototype and Bridge Logic, Communications Line Card Interface, Consumer Electronics Control Plane, Low-Cost DSP / Signal Processing Front-End, Test and Measurement Instrumentation.
Industrial Motor Control
The EP3C10F256C8N is well suited for industrial motor control applications where deterministic PWM generation, encoder feedback processing, and field-oriented control (FOC) loops are required. Its 10,320 logic elements comfortably implement multi-axis control algorithms with hardware-accelerated math, while the 23 dedicated 18x18 multipliers handle Park/Clarke transforms and PI controllers at high update rates. The 182 user I/Os accommodate multiple encoder inputs, Hall sensors, and gate driver interfaces. According to the Cyclone III device handbook, the PLLs provide precisely-tunable switching frequencies for IGBT/MOSFET gate drive, while LVDS-capable I/Os enable robust communication with resolver-to-digital converters.
Recommended
Video Processing and Display Bridge
The EP3C10F256C8N's 423,936 bits of embedded RAM and 182 user I/Os make it a practical choice for cost-sensitive video processing, format conversion, and display bridge applications. The M9K memory blocks efficiently implement line buffers and frame buffers at common display resolutions up to 720p, while LVDS I/Os support direct connection to flat-panel displays and MIPI-style interfaces through bridge logic. The 23 hardware multipliers accelerate scaling, color-space conversion (RGB to YCbCr), and chroma resampling operations. Quartus II video IP cores integrate cleanly, and the FineLine BGA's 1.0 mm pitch supports reflow-compatible PCB manufacturing for consumer-grade production runs.
Recommended
ASIC Prototype and Bridge Logic
The EP3C10F256C8N is a popular choice for ASIC prototyping, where it allows engineers to validate design functionality before committing to NRE charges for ASIC fabrication. With 10,320 logic elements and DDR2 memory controller support, it can emulate full SoC subsystems including processor cores, peripherals, and bus arbiters. The 4 PLLs generate the multiple clock domains typical of complex ASIC designs, and the 1.2 V core enables accurate power estimation. Engineers can prototype with the EP3C10F256C8N today and migrate to a lower-cost ASIC for volume production, with Quartus II providing ASIC handoff support via the HardCopy II flow.
Recommended
Communications Line Card Interface
In telecom line card applications, the EP3C10F256C8N implements glue logic between PHY devices, network processors, and backplane SERDES interfaces. Its 182 user I/Os are sufficient for TDM bus aggregation, framer interfacing, and HDLC channelization, while the LVDS-capable I/Os handle high-speed backplane links. The 4 PLLs provide independent clock synthesis for each major interface domain, reducing external clock-tree complexity. Low-power operation (typical 0.5 W static + dynamic) suits the thermal envelope of densely-packed line cards. Combined with Altera's Triple Speed Ethernet MAC and firmware IP, it can implement complete line-interface modules.
Recommended
Consumer Electronics Control Plane
Cost-sensitive consumer products such as set-top boxes, digital photo frames, home appliances, and toys benefit from the EP3C10F256C8N's low unit price ($15-32 range), modest power, and flexible I/O. Designers can integrate display controllers, user-interface logic, sensor fusion, and peripheral glue into a single chip, eliminating the cost of multiple discrete ICs. The Nios II soft-core processor fits comfortably in 10,320 logic elements for embedded control tasks, and the on-chip PLLs eliminate external clock-generation chips. The commercial 0 C to 85 C temperature range covers most indoor consumer environments.
Recommended
Low-Cost DSP / Signal Processing Front-End
The EP3C10F256C8N's 23 dedicated 18x18 hardware multipliers deliver approximately 23 GMACs of DSP throughput, suitable for audio processing, simple radar/sonar front-ends, and software-defined radio baseband at low sample rates. M9K memory blocks efficiently implement FIR filter delay lines and FFT working memory, while the 4 PLLs generate the precise clock relationships required for synchronous sampling. Compared to a discrete DSP processor approach, the FPGA offers parallel processing flexibility - multiple filter chains can run concurrently. For higher DSP throughput, the EP3C25F256C8N (66 multipliers) is a pin-compatible upgrade path.
Recommended
Test and Measurement Instrumentation
For OEM test equipment, ATE fixtures, and laboratory instrumentation, the EP3C10F256C8N offers reconfigurable stimulus/response generation, custom protocol decoding, and timing-critical trigger logic. Its 402 MHz maximum internal frequency handles fast UART, SPI, I2C, and parallel bus protocols at full speed, while the embedded RAM supports deep capture buffers. The 182 I/Os connect directly to test points, fixtures, and DUTs without external muxing. Engineers can update test patterns in the field by reloading the SRAM configuration, accelerating NPI and validation cycles without replacing hardware.
Recommended
Recommended Products Summary
Engineering reference data for EP3C10F256C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C10F256C6N | EP3C10F256I7N | EP3C16F256C8N | EP3C25F256C8N |
|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same |
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera |
| Logic Elements | 10,320 | 10,320 | 10,320 | 15,408 (+49%) | 24,624 (+139%) |
| Embedded Memory (bits) | 423,936 | 423,936 | 423,936 | 516,096 (+22%) | 594,432 (+40%) |
| User I/Os | 182 | 182 | 182 | 182 (same) | 156 (-14%) |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 56 (+143%) | 66 (+187%) |
| Speed Grade | C8 | C6 (slower) | I7 (industrial, C7 speed) | C8 (same) | C8 (same) |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C | -40 C to 100 C (Industrial) | 0 C to 85 C | 0 C to 85 C |
| Approximate Unit Price (qty 1, as of 2026-09-09) | $32.53 | $28-32 (slightly lower) | $38-45 (industrial premium) | $42-50 | $70-85 |
Key Differentiators
- Lowest unit cost in Cyclone III family (vs EP3C16F256C8N)
- Mature, widely-stocked part with extensive IP ecosystem (vs Newer FPGA families (Cyclone V, Cyclone 10))
- Higher-density path without PCB rework (vs EP3C25F256C8N)
Design Notes
The EP3C10F256C8N requires a clean 1.2 V VCCINT supply capable of delivering up to approximately 500 mA during configuration and typical operation. Use a buck regulator with at least 20% headroom above peak current, and decouple with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of each VCCINT ball group. VCCIO supplies must match the I/O bank voltage (typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V); each of the 8 I/O banks can run at an independent voltage. Per Cyclone III documentation, VCCA (2.5 V analog PLL supply) and VCCD_PLL (1.2 V PLL digital supply) must be powered before or simultaneously with VCCINT to prevent latch-up.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia (laser-drilled) stackup for escape routing. Per Intel's Cyclone III hardware design guidelines, place at least 4 decoupling capacitors (0.1 uF) under the package on the opposite PCB side from the BGA. Use a solid ground plane directly beneath the package for thermal spreading and signal return. Avoid routing high-speed signals across the package's center rows - use periphery escape routing and break-out channels to fan out into the routing channels. Solder paste stencil aperture design should follow the 1:1 ball-to-pad ratio recommended by Intel for FineLine BGA packages.
Estimated: at maximum utilization (all 10,320 LEs switching at 402 MHz, all I/Os active), the EP3C10F256C8N dissipates approximately 1.5-2.5 W depending on toggle rate and I/O loading. With the FineLine BGA's typical theta_JA of 18-22 C/W (still air, JEDEC test board), junction temperature rise is approximately 30-55 C above ambient - within the commercial 85 C limit at room temperature, but may require airflow in enclosed industrial environments. Add a thermal pad array on the bottom of the PCB and stitch vias to inner copper planes for improved heat spreading. Use the Quartus II PowerPlay analyzer to estimate power consumption for your specific design before finalizing thermal design.
Three common pitfalls when designing with the EP3C10F256C8N: (1) Forgetting to connect all GND balls - the FineLine BGA has many GND balls that must all be soldered for both electrical and thermal performance; missing balls cause instability and overheating. (2) Using an incorrect configuration mode - the default MSEL[3:0] pins select between AS, PS, JTAG and fast AS modes; wrong settings cause configuration failure with cryptic error codes. (3) Driving LVDS into unterminated lines - LVDS requires a 100 ohm differential termination at the receiver; without it, signal integrity degrades and timing margins collapse. Always verify MSEL settings and configuration file format (POF/SOF/HEX) match your programmer and JTAG toolchain before bringing up the board.
For high-speed DDR/DDR2 interfaces on the EP3C10F256C8N, follow the Cyclone III External Memory Interfaces Handbook for read/write capture timing and pin assignment rules. Use the Quartus II DDR/DDR2 controller IP with the pin planner to ensure matched trace lengths within the specified tolerance (typically +/- 25 ps for DQ/DQS, +/- 50 ps for address/command). Source-synchronous interfaces (LVDS DDR, DDR2) require 100 ohm differential impedance; use a PCB stackup calculator (e.g., Saturn PCB Toolkit) to verify differential trace width and spacing produce the correct impedance. Series termination resistors may be needed for longer address/command traces; refer to the IBIS model provided by Intel/Altera for accurate simulation.
Compliance Information
RoHS compliant per Altera/Intel product compliance information. Lead-free per N suffix in part number. REACH compliance not explicitly published in retrieved web data - listed as 'unknown'. AEC-Q100 not applicable (commercial grade FPGA). For automotive applications, consult Altera/Intel automotive-grade product list.
