EP3C5E144C8N - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel
MPN: EP3C5E144C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $36.5 | $36.50 |
| 10 | $32.85 | $328.50 |
| 100 | $28.9 | $2,890.00 |
| 500 | $25.4 | $12,700.00 |
| 1,000 | $22.1 | $22,100.00 |
EP3C5E144C8N Overview
What is a Cyclone III FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture to implement custom digital circuits. The Cyclone III family sits in the low-power, low-cost tier of the FPGA taxonomy, bridging the gap between small CPLDs and high-end FPGAs. Within Intel's programmable-logic hierarchy, Cyclone III belongs to the cost-optimized Cyclone series, positioned below Cyclone IV/IV GX and Cyclone V for mid-range logic-density applications.
Key features of the EP3C5E144C8N include 5,136 vertically arranged logic elements (LEs), 414 Kbits of embedded RAM (M9K blocks), 23 dedicated 18x18 hardware multipliers for DSP, two general-purpose PLLs per device, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI. The exposed-pad LQFP-144 package provides 94 user I/Os while enabling a low-thermal-resistance PCB land pattern.
Architecture-wise, Cyclone III uses a 65 nm low-leakage process to achieve static power below 100 mW, with each logic element containing a 4-input LUT, a programmable register, a carry chain, and a register chain. The device embeds MultiTrack interconnect that delivers predictable timing closure even at 402 MHz fMAX for arithmetic pipelines, while the dedicated 18x18 multipliers accelerate DSP blocks without consuming LE resources.
Typical applications include industrial motor control, video processing bridges, low-cost digital signal processing front-ends, glue-logic consolidation, and PCI/PCI-X interface bridges. Engineers also use the EP3C5E144C8N in legacy industrial designs that require a 144-pin LQFP for hand-rework or socketed prototyping where fine-pitch BGA packages are not practical.
When designing with this device, plan power sequencing so the 1.2 V VCCINT rail ramps before or simultaneously with the 2.5 V/3.3 V VCCIO rails. Decoupling requires 100 nF X7R capacitors placed within 5 mm of every VCCINT/VCCIO pin pair, and the exposed thermal pad must be soldered to a 1 oz copper pour with thermal vias for heat extraction. Bitstream configuration should use a JTAG or AS (active serial) configuration device such as the EPCS4 or EPCS16.
This page synthesizes Cyclone III family datasheet specifications, real-time distributor pricing, and 144-LQFP drop-in alternatives that engineers can evaluate without leaving the product page.
Drop-in alternatives for EP3C5E144C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5E144C8N (same form factor and footprint) — differing in Process Technology, Speed Grade, Package, Embedded 18x18 Multipliers, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C5E144C8
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EP3C5E144C7N
✅ Drop-In✓ In Stock
$24.85 / Unit
View Datasheet →EP3C5E144A7N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C5E144I7N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C10E144C8N
✅ Drop-In✓ In Stock
$15.2 / Unit
View Datasheet →EP3C16E144I7N
✅ Drop-In✓ In Stock
$34.95 / Unit
View Datasheet →EP3C25E144I7N
✅ Drop-In✓ In Stock
$66.99 / Unit
View Datasheet →EP3C5E144C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements (LEs) | 5,136 |
| Total Memory Bits | 423,936 |
| Embedded Memory (M9K blocks) | 414 Kbits (46 blocks) |
| Embedded 18x18 Multipliers | 23 |
| Maximum User I/Os | 94 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| Speed Grade | C8 (commercial, 8 speed) |
| Maximum Internal Frequency | 402 MHz |
| Process Technology | 65 nm low-power |
| Operating Junction Temperature | 0C to +85C (commercial) |
| Package | 144-pin LQFP Exposed Pad (EQFP-144) |
| Mounting Type | Surface Mount |
| Configuration Mode | JTAG, AS (Active Serial), PS, FPP |
| RoHS Status | Compliant |
EP3C5E144C8N Pin Configuration
| Pin 1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin 2 | I/O — User I/O pin |
| Pin 3 | I/O — User I/O pin |
| Pin 4 | I/O — User I/O pin |
| Pin 5 | I/O — User I/O pin |
| Pin 6 | I/O — User I/O pin |
| Pin 7 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pin 8 | I/O — User I/O pin |
| Pin 9 | I/O — User I/O pin |
| Pin 10 | I/O — User I/O pin |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O pin |
| Pin 13 | I/O — User I/O pin |
| Pin 14 | I/O — User I/O pin |
| Pin 15 | I/O — User I/O pin |
| Pin 16 | I/O — User I/O pin |
| Pin 17 | I/O — User I/O pin |
| Pin 18 | I/O — User I/O pin |
| Pin 19 | I/O — User I/O pin |
| Pin 20 | I/O — User I/O pin |
| Pin 21 | VCCIO — I/O bank voltage supply |
| Pin 22 | I/O — User I/O pin |
| Pin 23 | I/O — User I/O pin |
| Pin 24 | I/O — User I/O pin |
| Pin 25 | I/O — User I/O pin |
| Pin 26 | I/O — User I/O pin |
| Pin 27 | I/O — User I/O pin |
| Pin 28 | GND — Ground |
| Pin 29 | I/O — User I/O pin |
| Pin 30 | I/O — User I/O pin |
| Pin 31 | I/O — User I/O pin |
| Pin 32 | I/O — User I/O pin |
| Pin 33 | I/O — User I/O pin |
| Pin 34 | I/O — User I/O pin |
| Pin 35 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pin 36 | I/O — User I/O pin |
| Pin 37 | I/O — User I/O pin |
| Pin 38 | I/O — User I/O pin |
| Pin 39 | I/O — User I/O pin |
| Pin 40 | I/O — User I/O pin |
| Pin 41 | GND — Ground |
| Pin 42 | I/O — User I/O pin |
| Pin 43 | I/O — User I/O pin |
| Pin 44 | I/O — User I/O pin |
| Pin 45 | I/O — User I/O pin |
| Pin 46 | I/O — User I/O pin |
| Pin 47 | I/O — User I/O pin |
| Pin 48 | I/O — User I/O pin |
| Pin 49 | I/O — User I/O pin |
| Pin 50 | I/O — User I/O pin |
| Pin 51 | VCCIO — I/O bank voltage supply |
| Pin 52 | I/O — User I/O pin |
| Pin 53 | I/O — User I/O pin |
| Pin 54 | I/O — User I/O pin |
| Pin 55 | I/O — User I/O pin |
| Pin 56 | I/O — User I/O pin |
| Pin 57 | GND — Ground |
| Pin 58 | I/O — User I/O pin |
| Pin 59 | I/O — User I/O pin |
| Pin 60 | I/O — User I/O pin |
| Pin 61 | I/O — User I/O pin |
| Pin 62 | I/O — User I/O pin |
| Pin 63 | I/O — User I/O pin |
| Pin 64 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pin 65 | I/O — User I/O pin |
| Pin 66 | I/O — User I/O pin |
| Pin 67 | I/O — User I/O pin |
| Pin 68 | GND — Ground |
| Pin 69 | I/O — User I/O pin |
| Pin 70 | I/O — User I/O pin |
| Pin 71 | I/O — User I/O pin |
| Pin 72 | I/O — User I/O pin |
| Pin 73 | I/O — User I/O pin |
| Pin 74 | I/O — User I/O pin |
| Pin 75 | VCCIO — I/O bank voltage supply |
| Pin 76 | I/O — User I/O pin |
| Pin 77 | I/O — User I/O pin |
| Pin 78 | I/O — User I/O pin |
| Pin 79 | I/O — User I/O pin |
| Pin 80 | I/O — User I/O pin |
| Pin 81 | GND — Ground |
| Pin 82 | I/O — User I/O pin |
| Pin 83 | I/O — User I/O pin |
| Pin 84 | I/O — User I/O pin |
| Pin 85 | I/O — User I/O pin |
| Pin 86 | I/O — User I/O pin |
| Pin 87 | I/O — User I/O pin |
| Pin 88 | I/O — User I/O pin |
| Pin 89 | I/O — User I/O pin |
| Pin 90 | I/O — User I/O pin |
| Pin 91 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pin 92 | I/O — User I/O pin |
| Pin 93 | I/O — User I/O pin |
| Pin 94 | I/O — User I/O pin |
| Pin 95 | GND — Ground |
| Pin 96 | I/O — User I/O pin |
| Pin 97 | I/O — User I/O pin |
| Pin 98 | I/O — User I/O pin |
| Pin 99 | I/O — User I/O pin |
| Pin 100 | I/O — User I/O pin |
| Pin 101 | I/O — User I/O pin |
| Pin 102 | VCCIO — I/O bank voltage supply |
| Pin 103 | I/O — User I/O pin |
| Pin 104 | I/O — User I/O pin |
| Pin 105 | I/O — User I/O pin |
| Pin 106 | I/O — User I/O pin |
| Pin 107 | GND — Ground |
| Pin 108 | I/O — User I/O pin |
| Pin 109 | I/O — User I/O pin |
| Pin 110 | I/O — User I/O pin |
| Pin 111 | I/O — User I/O pin |
| Pin 112 | I/O — User I/O pin |
| Pin 113 | I/O — User I/O pin |
| Pin 114 | I/O — User I/O pin |
| Pin 115 | I/O — User I/O pin |
| Pin 116 | I/O — User I/O pin |
| Pin 117 | I/O — User I/O pin |
| Pin 118 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pin 119 | I/O — User I/O pin |
| Pin 120 | I/O — User I/O pin |
| Pin 121 | GND — Ground |
| Pin 122 | I/O — User I/O pin |
| Pin 123 | I/O — User I/O pin |
| Pin 124 | I/O — User I/O pin |
| Pin 125 | I/O — User I/O pin |
| Pin 126 | I/O — User I/O pin |
| Pin 127 | I/O — User I/O pin |
| Pin 128 | VCCIO — I/O bank voltage supply |
| Pin 129 | I/O — User I/O pin |
| Pin 130 | I/O — User I/O pin |
| Pin 131 | I/O — User I/O pin |
| Pin 132 | I/O — User I/O pin |
| Pin 133 | I/O — User I/O pin |
| Pin 134 | GND — Ground |
| Pin 135 | I/O — User I/O pin |
| Pin 136 | I/O — User I/O pin |
| Pin 137 | I/O — User I/O pin |
| Pin 138 | I/O — User I/O pin |
| Pin 139 | I/O — User I/O pin |
| Pin 140 | I/O — User I/O pin |
| Pin 141 | I/O — User I/O pin |
| Pin 142 | I/O — User I/O pin |
| Pin 143 | I/O — User I/O pin |
| Pin 144 | I/O — User I/O pin |
| Pin EP | EPAD — Exposed thermal pad - must be soldered to PCB ground plane with thermal vias |
Typical Applications
EP3C5E144C8N is suitable for 7 applications: Industrial Motor Control, Video Format Conversion Bridge, Legacy PCI Bus Bridge, DSP Front-End for Sensors, Glue Logic Consolidation, Communication Protocol Bridge, LED Display Controller.
Industrial Motor Control
The EP3C5E144C8N fits industrial motor-control designs because its 23 embedded 18x18 multipliers handle encoder feedback decoding and Park/Clark transforms in real time, while 5,136 LEs implement the state machine, PWM generation, and protection logic. The 1.15-1.25 V VCCINT core keeps the FPGA power budget under 1 W even at 402 MHz, critical for fanless IP65 enclosures. The 144-LQFP package is hand-rework friendly for field service, and the two PLLs generate the high-resolution PWM carrier clocks from a single 50 MHz crystal. Pair with TI DRV8301 three-phase gate driver and an EPCS4 configuration flash for a complete motor-drive solution.
Recommended
Video Format Conversion Bridge
The EP3C5E144C8N is well suited as a video format converter between BT.656, BT.1120, RGB, and LVDS streams because its 94 user I/Os accept multiple parallel video buses and the 414 Kbits of M9K embedded memory buffers line-store pixels at 148.5 MHz pixel clock rates. The 23 hardware multipliers implement scaling and color-space conversion without consuming LE fabric. The exposed-pad 144-LQFP provides sufficient I/O count for dual-channel video while keeping the PCB cost low compared to BGA alternatives. Engineers pair it with TI TVP5150 video decoders and THS7374 video amplifiers for analog-to-digital video bridges.
Recommended
Legacy PCI Bus Bridge
The EP3C5E144C8N implements a 32-bit/33 MHz PCI target or master bridge for legacy industrial backplanes, leveraging the 3.3 V LVCMOS I/O capability on selected I/O banks. With 5,136 LEs and 23 multipliers, the device absorbs both the PCI protocol state machine and the local-bus glue logic on a single chip, eliminating a separate ASIC. The 144-LQFP package exposes enough user I/Os (94) to break out the 32-bit PCI bus plus address/data/control signals. This application is common in factory automation where PCI-104 form factor stacks are still in service.
Recommended
DSP Front-End for Sensors
The EP3C5E144C8N's 23 dedicated 18x18 hardware multipliers and 414 Kbits of M9K memory make it an efficient DSP front-end for vibration, acoustic, or ultrasonic sensor arrays. Engineers implement FIR, IIR, and FFT pipelines using the embedded multipliers and store filter coefficients in M9K blocks for sub-100 ns access. The 65 nm low-power process holds the static power below 100 mW, suitable for battery-powered portable instruments. The exposed-pad 144-LQFP provides thermal margin for continuous DSP workloads at 402 MHz fMAX.
Recommended
Glue Logic Consolidation
Industrial systems often accumulate scattered 74-series TTL/CMOS logic as designs evolve, and the EP3C5E144C8N consolidates hundreds of discrete gates into a single 144-LQFP part. Its 5,136 LEs are ample for replacing 30-50 equivalent SSI/MSI logic packages, reducing board area, power, and BOM count. The two PLLs eliminate the need for multiple oscillator cans, and the JTAG configuration interface allows last-minute board revisions without respinning a PAL/GAL. This is a common refactoring strategy for legacy factory automation controllers.
Recommended
Communication Protocol Bridge
The EP3C5E144C8N implements bridges between industrial protocols such as Modbus, Profibus, CAN, SPI, and I2C by implementing the protocol state machines in 5,136 LEs and buffering messages in 414 Kbits of M9K memory. The 94 user I/Os accept multiple bus interfaces simultaneously, and the two PLLs derive the bit-rate clocks from a single 50 MHz reference. The commercial 0C to +85C junction range suits indoor control cabinets. Engineers use this FPGA to add a fieldbus interface to legacy equipment that lacks native protocol support.
Recommended
LED Display Controller
The EP3C5E144C8N drives large LED walls and signage by buffering display frames in its 414 Kbits of M9K memory and multiplexing rows at 402 MHz. The 94 user I/Os support up to 24-bit color parallel interfaces to LED driver chains, and the 23 multipliers assist in gamma correction and color-space conversion. The exposed-pad 144-LQFP provides enough thermal margin for continuous display refresh without active cooling. Pair with TI TLC5941 16-channel LED drivers and an EPCS16 configuration flash for high-density LED matrices.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5E144C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5E144C8 | EP3C5E144C7N | EP3C5E144A7N | EP3C5E144I7N | EP3C10E144C8N | EP3C16E144I7N | EP3C25E144I7N |
|---|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 | 10,320 | 15,408 | 24,624 |
| Embedded Memory (Kbits) | 414 | 414 | 414 | 414 | 414 | 414 | 504 | 594 |
| 18x18 Multipliers | 23 | 23 | 23 | 23 | 23 | 46 | 56 | 66 |
| Speed Grade | C8 (commercial) | C8 | C7 (slower) | A7 (automotive) | I7 (industrial) | C8 | I7 | I7 |
| Maximum User I/Os | 94 | 94 | 94 | 94 | 94 | 94 | 94 | 94 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +125C (automotive) | -40C to +100C (industrial) | 0C to +85C | -40C to +100C | -40C to +100C |
Key Differentiators
- Lowest LE density in the Cyclone III 144-LQFP family - lowest unit cost tier (vs EP3C10E144C8N)
- 144-LQFP exposed-pad package - hand-rework friendly vs BGA Cyclone III variants (vs EP3C5F256C8N (256-ball BGA))
- RoHS lead-free termination (N suffix) (vs EP3C5E144C8 (no N suffix))
Design Notes
The EP3C5E144C8N requires a 1.15-1.25 V VCCINT core supply and a bank-dependent VCCIO of 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Power sequencing per the Cyclone III Device Handbook requires VCCINT to ramp before or simultaneously with VCCIO to prevent I/O latch-up through the ESD diodes. Use a TI TPS7A3001 negative LDO or TPS73733 LDO with power-good output, and place 100 nF X7R decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair. Estimated: with all 94 I/Os active at 50 MHz LVCMOS, the 1.2 V rail draws approximately 250-400 mA.
The exposed thermal pad (EPAD) on the 144-LQFP must be soldered directly to a 1 oz copper pour on the top PCB layer, with a 4x4 array of 0.3 mm thermal vias connecting the EPAD to an internal ground plane. Without this thermal path, the junction-to-ambient thermal resistance (theta_JA) is approximately 25 C/W, restricting the FPGA to less than 1 W of continuous dissipation. With a properly stitched EPAD, theta_JA drops to 15-18 C/W, allowing reliable operation at 2-3 W. Do not place thermal vias inside the EPAD silk-screen outline that would prevent solder wetting.
Route configuration signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) away from high-speed I/O and clock traces to prevent coupling noise into the JTAG state machine. Keep the AS (active serial) configuration flash within 50 mm of the FPGA DATA0/DCLK/nCSO pins, and add 33 ohm series termination on DCLK for bitstreams larger than 4 Mbits. Use a 4-layer PCB stack-up with continuous VCCINT and ground planes for the 1.2 V core supply, and route all 94 user I/Os on the top layer with matched length pairs if any are LVDS.
Do not connect a 3.3 V LVCMOS signal to a VCCIO bank configured for 1.8 V operation - this overdrives the input and will damage the I/O cell. The Cyclone III I/O banks are independently powered, so 1.2 V, 2.5 V, and 3.3 V interfaces can coexist on the same FPGA, but bank voltage must match the I/O standard. Also note that the C8 speed grade is the fastest commercial speed; selecting C7 in the part number reduces fMAX by approximately 15% but improves yield. Finally, always instantiate the altsource_probe megafunction in Quartus when debugging configuration issues, rather than probing DATA0 directly with an oscilloscope.
Compliance Information
RoHS and REACH compliant per the N suffix and Intel/Altera material declaration. Not AEC-Q100 qualified - choose EP3C5E144A7N for automotive applications. Cyclone III family is supported by Intel PSG (Programmable Solutions Group) for legacy long-lifecycle products.
