EP3C5F256I7 - Cyclone III FPGA 5136 LE 256-BGA | Intel
MPN: EP3C5F256I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.43 | $38.43 |
| 10 | $35.12 | $351.20 |
| 100 | $28.86 | $2,886.00 |
| 500 | $25.04 | $12,520.00 |
| 1,000 | $22.36 | $22,360.00 |
EP3C5F256I7 Overview
An FPGA is an integrated circuit whose digital logic can be configured by the designer after manufacturing. In the component hierarchy, an FPGA is a programmable logic device (PLD) under the broader integrated circuit category, and it differs from a microcontroller by implementing parallel hardware logic instead of sequential software instructions. The EP3C5F256I7 is part of Intel's Cyclone III family, a mid-capacity low-cost FPGA line that balances logic density, memory, I/O count, and package size for industrial and communications systems.
The EP3C5F256I7 combines 5,136 logic elements with 423,936 bits of embedded RAM, 182 user I/O pins, and a 256-ball FBGA package. This capacity allows small state machines, UART/SPI bridges, FIFO buffers, image line buffers, motor-control logic, and communication protocol engines to be implemented in a single device. The industrial-temperature ordering option indicates the device is intended for extended-temperature equipment rather than consumer-only environments.
The device uses a square, ball-terminated FBGA-256 package with a lead-free finish according to the verified distributor listing. The high user-I/O count exposes most internal signals to board-level interfaces, making the FPGA practical as a glue-logic, pre-processing, or interface bridging element in a larger electronic system. Because Cyclone III devices are SRAM-based FPGAs, they require an external configuration device or host controller to load the bitstream after power-up.
Typical applications include industrial motor and PLC control, machine-vision image preprocessing, Ethernet and serial protocol bridging, data-acquisition front ends, and medical monitoring equipment. The 182 user I/O signals can connect to ADCs, DACs, sensors, memory buses, transceivers, and parallel LCD or LED interfaces.
When designing with the EP3C5F256I7, plan for BGA fanout and adequate power decoupling, and verify that the external configuration-source choice is compatible with required boot time and update flow. Use Intel Quartus software for pin assignment validation against the target board footprint. The package and pin count are significant PCB layout constraints.
This page adds practical value beyond a datasheet by combining distributor sources, same-family drop-in alternatives, estimated pricing, design guidance, and application context that helps engineers confirm the EP3C5F256I7 fits before committing to a layout.
Drop-in alternatives for EP3C5F256I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5F256I7 (same form factor and footprint) — differing in Package, Process Technology, Configuration Modes, Operating Temperature, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C5F256C8N
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EP3C5F256C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$14.2 / Unit
View Datasheet →EP3C5F256C6N
✅ Drop-In✓ In Stock
$18.85 / Unit
View Datasheet →EP3C5F256A7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$24.4 / Unit
View Datasheet →EP3C10F256I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$34.94 / Unit
View Datasheet →EP3C5F256I7 Maximum Ratings & Electrical Characteristics
| FPGA Family | Cyclone III |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 5136 |
| Total RAM Bits | 423936 bits |
| Maximum User I/O Count | 182 |
| Package / Case | 256-LBGA (FBGA-256) |
| Package Shape | Square |
| Number of Terminals | 256 |
| Terminal Form | Ball |
| Mounting Type | Surface Mount |
| Technology | CMOS |
| Maximum Operating Frequency | 472.5 MHz |
| Operating Temperature Range | -40C to 125C |
| Speed Grade | 7 (per -7 order code) |
| Temperature Grade | I (industrial, per -I7 order code) |
| Lead-Free Finish | Yes (per distributor listing) |
EP3C5F256I7 square Pin Configuration Guide
Pin configuration for EP3C5F256I7 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C5F256I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C5F256I7 is suitable for 6 applications: Industrial Automation and PLC Control, Machine Vision and Image Preprocessing, Communications and Protocol Bridging, Test and Measurement Data Acquisition, Medical Monitoring Equipment, IoT Gateway and Smart Sensor Hub.
Industrial Automation and PLC Control
EP3C5F256I7 fits industrial control panels and PLC modules because its 182 user I/O pins can directly capture limit switches, quadrature encoders, and proximity sensors while generating PWM outputs for motor and valve drivers. The FPGA executes parallel control logic with deterministic timing, avoiding the interrupt jitter common in software PLCs. Its 5,136 logic elements are sufficient for interlocking, safety monitoring, and communication protocol state machines, while 423,936 RAM bits support small command queues and fault logs. The industrial temperature option supports installations in unheated cabinets or near motors. For configuration, use an Intel/Altera serial configuration device such as EPCS4SI8N. Because this is an SRAM-based FPGA, the bitstream must be reloaded at power-up from serial flash by an external controller or configuration device.
Recommended
Machine Vision and Image Preprocessing
In machine-vision systems, EP3C5F256I7 can connect to CMOS image sensors or ADC outputs and perform real-time line buffering, thresholding, and pixel normalization before data reaches a processor. The FPGA's 182 user I/O pins are enough to interface parallel video buses, trigger signals, and sync outputs. The 423,936 embedded RAM bits act as line buffers for 2D filtering and ROI extraction, offloading repetitive tasks from the host CPU. Because image processing is highly parallel, the FPGA can process multiple pixels per clock cycle. A practical design places the FPGA between the image sensor and an SDRAM frame buffer; although embedded RAM is not large enough for full video frames, external SDRAM connected through FPGA I/O can handle frame storage. Industrial temperature operation is useful for vision cameras mounted near production machinery.
Recommended
Communications and Protocol Bridging
EP3C5F256I7 is suitable for communications bridging because its programmable logic can implement UART, SPI, I2C, CAN, and Ethernet MAC functions on the same device. With 182 user I/O pins, the FPGA can translate between legacy parallel buses, RS-485 transceivers, and Ethernet PHY devices while buffering packets in embedded RAM. The 5,136 logic elements can hold a multi-channel protocol engine, FIFO, address decoder, and status register without blocking the host processor. For Ethernet, connect an external PHY such as DP83848 and implement the MAC in FPGA logic. The 423,936 RAM bits support packet FIFOs up to a few hundred kilobytes aggregate, sufficient for control messages and short datagrams. Use a configuration flash device plus remote update logic if field firmware updates are required.
Recommended
Test and Measurement Data Acquisition
EP3C5F256I7 can serve as the acquisition front end in oscilloscopes, data loggers, and condition-monitoring instruments. Its parallel architecture can capture multiple ADC channels simultaneously, align samples, trigger on digital patterns, and stream data to a USB or Ethernet controller. The 182 user I/O pins connect to high-speed ADCs, DACs, digital potentiometers, and host processors. The 423,936 bits of internal memory can be used as FIFOs to absorb burst data from ADCs before transferring to an external host. Deterministic FPGA timing makes it suitable for coherent sampling and timestamping. Industrial temperature operation supports distributed condition monitoring on factory equipment. A practical signal chain connects an ADC such as AD9226 to FPGA inputs with careful clock distribution. The same FPGA can also generate the ADC sample clock and trigger logic.
Recommended
Medical Monitoring Equipment
EP3C5F256I7 can be used in patient monitors, infusion pumps, and diagnostic instruments where moderate logic density, deterministic timing, and wide I/O connectivity are required. Its industrial temperature range helps equipment operate reliably during warm-up, around power supplies, and inside enclosures with modest airflow. FPGA logic can acquire physiological sensor data, perform digital filtering, control pumps or valves, and generate alarm patterns without relying only on a host processor. The 5,136 logic elements and 423,936 RAM bits are adequate for multi-channel ADC interfaces, averaging filters, heartbeat detection state machines, and serial communication to a display controller. Medical designs should follow applicable isolation, safety, and risk-management standards at the system level; the FPGA itself does not provide certified medical isolation. Use carefully selected ADCs and isolated power interfaces around the FPGA.
Recommended
IoT Gateway and Smart Sensor Hub
EP3C5F256I7 can act as a smart sensor hub in IoT gateways by aggregating parallel and serial sensors, performing small-scale preprocessing, and forwarding data to a host application processor or wireless module. Its 182 user I/O pins allow many digital sensors, switch contacts, and indicator LEDs to be connected with minimal external logic. The embedded 423,936 RAM bits buffer time-stamped events, and the FPGA can implement multiple SPI/I2C/UART controllers for sensor buses. Because the FPGA is configured at every power-up, it must boot from serial flash via a device such as EPCS4SI8N. Designers can use the parallel logic to timestamp digital input changes accurately or implement low-latency alarm paths. This application is common in building automation, energy monitoring, and industrial IoT edge nodes.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5F256I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5F256C8N | EP3C5F256C7N | EP3C5F256C6N | EP3C5F256A7N | EP3C10F256I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (FBGA-256) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 5136 | 5136 | 5136 | 5136 | 5136 | 10320 |
| Total RAM Bits | 423936 | 423936 | 423936 | 423936 | 423936 | 423936 |
| User I/O Count | 182 | 182 | 182 | 182 | 182 | 182 |
| Temperature Grade | I (industrial) | C (commercial) | C (commercial) | C (commercial) | A (automotive-oriented) | I (industrial) |
| Speed Grade | 7 | 8 | 7 | 6 | 7 | 7 |
Key Differentiators
- Industrial temperature grade in the F256 package (vs EP3C5F256C8N)
- Lower logic density optimized for cost-sensitive control and bridge designs (vs EP3C10F256I7N)
- Standard industrial ordering grade without automotive-specific flow (vs EP3C5F256A7N)
Design Notes
EP3C5F256I7 is an SRAM-based FPGA, so it does not retain its configuration when power is removed. A configuration device such as EPCS4SI8N or an external host must load the bitstream after every power-up. Design the MSEL pins, DCLK, DATA0, and nCONFIG signals according to the Cyclone III configuration guidelines before PCB layout. Do not assume the FPGA can boot from internal flash; if faster boot time is required, review passive serial and JTAG configuration options.
The 256-ball FBGA package requires careful fanout and enough layers for routing all power and I/O pins. Place 100 nF ceramic bypass capacitors close to FPGA power balls, one per active power pin or voltage bank, and add bulk 10 uF capacitors at the board input. Because the actual core and I/O voltage requirements were not fully listed in the provided web data, verify the VCCINT and VCCIO values from the Cyclone III datasheet before assigning power planes.
The listed operating range is -40C to 125C, but package thermal performance depends on airflow, board copper, and power dissipation. Since no junction-to-ambient thermal resistance figure was provided, estimate power with the Intel Cyclone III PowerPlay Early Power Estimator using your actual logic utilization, clock frequency, and I/O standards. For enclosed industrial systems, add a small fan or a copper-spread thermal via field below the BGA to keep junction temperature below the device limit.
User I/O banks on Cyclone III can support multiple I/O standards, but each bank must use a consistent VCCIO voltage. When mixing 3.3V, 2.5V, or 1.8V signals, group them into separate banks and use series termination near the FPGA output pins for high-speed parallel buses. Plan the pin assignments in Intel Quartus Pin Planner so that output enable and clock regions align with timing-critical signals, avoiding unnecessary long traces across the BGA package.
Compliance Information
Verified web data lists the EP3C5F256I7 as lead-free. No explicit RoHS, REACH, halogen-free, or conflict-minerals statement was found in the supplied source snippets.
