EP3CLS100F484C7 - Cyclone III LS FPGA 100K LE 484-FBGA | Intel
MPN: EP3CLS100F484C7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $96.5 | $96.50 |
| 10 | $88.2 | $882.00 |
| 100 | $79.5 | $7,950.00 |
| 250 | $73.1 | $18,275.00 |
| 500 | $68.4 | $34,200.00 |
| 1,000 | $62.8 | $62,800.00 |
EP3CLS100F484C7 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hardware such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism with infinite reprogrammability. The Cyclone III LS family specifically targets low-static-power designs by adding power-management features and a lower-leakage silicon option versus the standard Cyclone III lineup.
Key features include 100,448 logic elements, 4,451,328 embedded memory bits, four phase-locked loops (PLLs), 278 maximum user I/O pins, and dedicated hardware multipliers that accelerate DSP workloads. The device supports external memory interfaces including DDR, DDR2, and QDR II, and integrates Cyclone III LS low-power enhancements suitable for thermally constrained boards.
The EP3CLS100F484C7 uses a 65 nm copper process with a 1.2 V core voltage rail and auxiliary supplies for I/O banks and phase-locked loops. Configuration is supported through Altera (now Intel) Quartus II design software, which provides synthesis, place-and-route, timing analysis, and bitstream generation. Designers can leverage pre-verified IP cores from the Altera IP library to shorten development time across common interfaces such as DDR controllers, Ethernet MACs, and PCI Express soft cores.
Typical applications include industrial motor control, video processing bridges, low-power wireless baseband preprocessing, and embedded display controllers. The 278 user I/Os and large logic capacity also make the device suitable for test-and-measurement front ends, factory automation I/O expansion, and prototyping bridges between legacy parallel buses and modern serial protocols.
When designing with this FPGA, ensure the FPGA fabric junction temperature is computed from actual toggle rates and ambient temperature. The 484-ball FBGA package requires a multi-layer PCB with controlled-impedance traces and matched-length routing for DDR interfaces. Quartus II software is the supported design toolchain; migrate projects to Quartus Prime for ongoing support on newer OS versions.
This page synthesizes Intel/authorized-distributor pricing, drop-in compatible Cyclone III LS variants, and engineering design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EP3CLS100F484C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS100F484C7 (same form factor and footprint) — differing in Package, RoHS Status, Process Technology, Series, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS100F484C8N
✅ Drop-In✓ In Stock
$115.4 / Unit
View Datasheet →EP3CLS100F484C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3CLS100F484C7N
✅ Drop-In✓ In Stock
$495.8 / Unit
View Datasheet →EP3CLS100F484I7
✅ Drop-In✓ In Stock
$113.6 / Unit
View Datasheet →EP3C80F484C7
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP3C80F484C7N
✅ Drop-In✓ In Stock
$306.54 / Unit
View Datasheet →EP3CLS100F484C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements (LE) | 100,448 |
| Embedded Memory Bits | 4,451,328 |
| Maximum User I/Os | 278 |
| Logic Blocks / Logic Cells | 47 |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm |
| Maximum Internal Frequency | 437.5 MHz |
| PLLs | 4 |
| Package | 484-ball FBGA (Fine-Pitch BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Commercial |
| RoHS Status | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) |
| Design Software | Quartus II / Quartus Prime |
EP3CLS100F484C7 484-ball fbga (fine-pitch bga) Pin Configuration Guide
Pin configuration for EP3CLS100F484C7 (484-ball fbga (fine-pitch bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS100F484C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS100F484C7 is suitable for 6 applications: Industrial Motor Control, Video Processing Bridge, Low-Power Wireless Baseband, Embedded Display Controller, Factory Automation I/O Expansion, Test & Measurement Front End.
Industrial Motor Control
The EP3CLS100F484C7's 100K logic elements and four PLLs deliver deterministic multi-axis motor control for industrial drives. Low-static-power Cyclone III LS silicon keeps dissipation under 1.5 W at typical toggle rates, eliminating active cooling in sealed IP65 enclosures. The 278 user I/Os provide encoder, Hall-sensor, and resolver interfaces per axis, while on-chip DSP blocks execute field-oriented control (FOC) and space-vector PWM at 100 kHz switching frequency without external microcontrollers.
Recommended
Video Processing Bridge
Streaming 1080p60 video requires approximately 148 MHz pixel clock with associated line/frame buffering. The EP3CLS100F484C7's 4,451,328 embedded memory bits provide frame-buffer storage for scaling, deinterlacing, and format conversion in real time. LVDS-capable I/O banks drive the original parallel-RGB output or HDMI bridge PHY. The 65 nm process and 1.2 V core supply keep total board power below 3 W, critical for fanless set-top boxes and signage players.
Recommended
Low-Power Wireless Baseband
Low-power wireless protocols (LoRa, Zigbee, BLE baseband) require modest logic density but strict idle-current budgets. The EP3CLS100F484C7's Cyclone III LS low-static-power option holds leakage under 100 mA core current at 25C, extending battery life in remote sensor nodes. Four PLLs generate the symbol and carrier clocks, while 278 I/Os interface RF transceivers via SPI and provide GPIO for sensors. The 484-ball FBGA accommodates RF traces beneath the BGA shadow.
Recommended
Embedded Display Controller
TFT-LCD panels up to XGA (1024x768) at 60 Hz fit comfortably in the EP3CLS100F484C7's logic budget. Hardware accelerators implemented in fabric handle 2D graphics operations, color-space conversion (RGB to LVDS), and backlight PWM control. The 4.4 Mbit embedded memory holds frame buffers and character ROM, eliminating external SRAM. The 278 I/Os drive 24-bit parallel RGB plus touch-screen SPI/I2C without bank-sharing conflicts.
Recommended
Factory Automation I/O Expansion
PLC backplanes and industrial PCs need flexible discrete I/O expansion cards. The EP3CLS100F484C7's 278 I/Os and 100K LE capacity implement 64-channel opto-isolated input cards with debounce, counter, and timestamp logic in a single chip. Quartus II SOPC Builder generates the soft Nios II processor and industrial Ethernet MAC IP for Modbus TCP or EtherNet/IP slave operation. LS silicon lowers standby power for sleep-mode PLC racks.
Recommended
Test & Measurement Front End
Benchtop instruments and ATE boards benefit from the EP3CLS100F484C7's reprogrammable logic and high I/O count. Custom trigger logic, pattern generation, and protocol decoding (I2C, SPI, UART, parallel) fit in 100K LEs. Four PLLs provide the multi-rate sample clocks for ADC/DAC interfacing. The 484-ball FBGA brings out 278 signals for connector fan-out, simplifying the interface to high-pin-count test fixtures in production ATE racks.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS100F484C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS100F484C8N | EP3CLS100F484C6N | EP3CLS100F484C7N | EP3CLS100F484I7 | EP3C80F484C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Family | Cyclone III LS | Cyclone III LS - same | Cyclone III LS - same | Cyclone III LS - same | Cyclone III LS - same | Cyclone III (non-LS) |
| Logic Elements | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 | 81,264 (-19%) |
| Embedded Memory Bits | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 2,810,880 (-37%) |
| Maximum User I/Os | 278 | 278 | 278 | 278 | 278 | 278 (same) |
| Speed Grade | C7 (commercial 7) | C8 (faster) | C6 (slower) | C7 (same) | I7 (industrial 7) | C7 (same) |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C | 0C to 85C | 0C to 85C | -40C to 100C (Industrial) | 0C to 85C |
| Approx. Unit Price (qty 1) | 96.50 USD | 110-125 USD | 85-95 USD | 97-105 USD | 115-130 USD | 70-85 USD |
Key Differentiators
- Low-static-power silicon for thermally constrained boards (vs EP3C80F484C7 (standard Cyclone III))
- Mid-density 100K LE capacity with 278 I/Os in 484-FBGA (vs EP3C55F484C7 (55K LE in 484-FBGA))
- Higher-density upgrade path on the same footprint (vs EP3C120F484C7N (Cyclone III, 120K LE, 484-FBGA))
Design Notes
Cyclone III LS silicon at 65 nm produces a moderate thermal envelope: typical junction-to-ambient thermal resistance (theta_JA) on the 484-ball FBGA is around 13 C/W with standard 4-layer PCB. Run the Quartus PowerPlay early in the design cycle to estimate static and dynamic power from toggle rate and clock frequency. For designs above 2 W core power, use thermal vias beneath the BGA thermal pad and provide a minimum 10x10 mm copper pour on the top layer.
The 484-ball FBGA uses 1.0 mm ball pitch, which requires microvia (laser-drilled) technology on 4-layer stack-ups. For 8-layer stack-ups with sequential lamination, conventional 0.3 mm vias are acceptable. Matched-length routing on DDR2 data and address lines must be within +/- 25 ps for 200 MHz operation; use the Quartus II pin planner and PCB tool's length-matching constraint checker. Decouple each VCCINT pin with a 0.1 uF X7R 0402 ceramic within 100 mil of the ball, and add four bulk 47 uF tantalum capacitors distributed around the package perimeter.
Do not exceed the 1.2 V core supply tolerance (+/- 5 percent); use a high-accuracy LDO such as the TI TPS74401 or equivalent. The configuration pins MSEL[3:0] must be tied to defined logic levels (not floating) to select Active Serial, Passive Serial, or JTAG mode. The JTAG TCK pin must be pulled down through 1 kohm at power-up if unused, otherwise the device may mis-behave during configuration. Dual-purpose configuration pins (nIO-pullup, nCE, etc.) require Quartus II pin-assignment overrides to set them as user I/O after configuration completes.
LVDS signaling requires 100 ohm differential trace impedance and length matching within 10 ps across each LVDS pair. Use 8 mil / 8 mil trace width/spacing on 4 mil dielectric for the typical FR4 stack-up. Minimize via stubs on high-speed serial lines; back-drill vias longer than 8 mil to reduce stub resonance above 1 GHz. Place series AC-coupling capacitors within 200 mil of the driver side and place 100 ohm differential termination at the receiver end.
Compliance Information
RoHS compliance per Intel/Altera product declaration. Commercial temperature grade (C7) not AEC-Q100 qualified - choose EP3CLS100F484I7 industrial grade for extended temperature environments. Halogen-free status not explicitly stated in the verified data.
