Altera

EP3CLS100F484C8 - Cyclone III LS FPGA | Altera / Intel

MPN: EP3CLS100F484C8 ✓ Active
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1.2 V Vdss FBGA-484 Package 402 MHz Speed
From $148.45 USD / Unit
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Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $218.5 $218.50
10 $196.8 $1,968.00
100 $175.2 $17,520.00
500 $162.3 $81,150.00
1,000 $148.45 $148,450.00
ℹ️ All prices are in USD

EP3CLS100F484C8 Overview

The Altera EP3CLS100F484C8 is a Cyclone III LS field-programmable gate array (FPGA) with 100,448 logic elements, 4,451,328 RAM bits, and 278 user I/O pins, supplied in a 484-ball FBGA package. This commercial-temperature, speed-grade-8 device operates from a 1.2V core supply and is part of the low-power Cyclone III LS family built on a 65nm process.

An FPGA is a semiconductor device whose logic fabric and interconnects are reconfigured by the user after manufacturing. FPGAs occupy the programmable-logic portion of the integrated circuit hierarchy: FPGA -> programmable logic device -> integrated circuit. Unlike ASICs, they can be updated in the field, which makes them useful for prototyping, low-to-medium production, and systems where standards change quickly. The EP3CLS100F484C8 is the 100,000-logic-element-class member of the Cyclone III LS series, designed for applications that need high logic density without the cost or power of an ASIC.

Key features include 100,448 logic elements, 4,451,328 RAM bits, and 278 user I/Os. The device is a commercial-grade part in the Altera/Intel ordering code, where C indicates commercial temperature and 8 indicates speed grade 8. According to distributor and cross-reference data, the FPGA is built on a 65nm process and is rated for 1.2V core operation, with an FPGA performance indicator of 402MHz in the Cyclone III LS family. The 484-ball FBGA package provides enough pins for wide memory buses and many parallel I/O channels.

The Cyclone III LS family is distinguished from the standard Cyclone III family by lower power and the LS security-related features; the exact feature set and I/O standard support are defined in the Cyclone III and Cyclone III LS device handbooks. From a system perspective, the EP3CLS100F484C8 provides a reconfigurable parallel computing fabric that can implement RTL logic, soft processors, DSP datapaths, and state-machine controllers in one device. It requires an external configuration device or JTAG download at power-up because it is SRAM-based.

Typical applications for this FPGA include industrial motor control and factory automation, networking and Ethernet bridging, machine vision and video processing, medical imaging equipment, high-performance test-and-measurement instruments, and compute/network acceleration. The high I/O count and 100K logic capacity allow designers to integrate multiple discretely implemented functions onto one programmable platform, reducing total system component count.

A key design consideration is that the EP3CLS100F484C8 requires a clean 1.2V core supply and correct power-up configuration sequencing. Use a serial configuration device such as the EPCS or EPCQ family, or download the bitstream through JTAG during development. Thermal dissipation from an FPGA this size also requires proper BGA layout, sufficient copper planes, and air flow in the final enclosure.

This page synthesizes distributor pricing, availability, drop-in family alternatives, and practical design guidance not found in a single datasheet chapter, making it a useful engineering research resource before committing to a full Intel/Altera documentation review.

Drop-in alternatives for EP3CLS100F484C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3CLS100F484C8 (same form factor and footprint) — differing in Process Technology, Package, Speed Grade, RoHS Status, PLLs.

Intel
Package: 484-ball FBGA (Fine-Pitch BGA)
RoHS Status: Compliant
PLLs: 4
Compare with EP3CLS100F484C8 →
Intel
Process Technology: 65 nm low-power (TSMC)
Package: 484-ball FineLine BGA (FBGA-484)
Speed Grade: C7
Compare with EP3CLS100F484C8 →
Intel
Process Technology: TSMC 65 nm low-power (LP)
Speed Grade: C8 (commercial, fastest)
RoHS Status: Compliant (Pb-free, 'N' suffix)
Compare with EP3CLS100F484C8 →
Intel
Process Technology: TSMC 65 nm low-power (LP)
Package: 484-ball FBGA (FineLine BGA)
RoHS Status: Compliant
Compare with EP3CLS100F484C8 →
Intel
Process Technology: 65 nm CMOS
Package: 484-ball FBGA (F484)
Speed Grade: 7 (medium)
Compare with EP3CLS100F484C8 →
Intel
Process Technology: 65 nm CMOS
Package: UFBGA-484 (U484, 19 x 19 mm, 0.8 mm pitch)
Speed Grade: C8 (commercial, 8)
Compare with EP3CLS100F484C8 →
Intel
Process Technology: 65 nm TSMC low-power
Package: 484-ball FineLine BGA (FBGA-484)
RoHS Status: Compliant
Compare with EP3CLS100F484C8 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3CLS100F484C7N

✅ Drop-In
Intel
📦 FBGA-484
Cyclone III LS · 100,448 · 4,451,328 · 278 · 4 · 65 nm low-power (TSMC)

✓ In Stock

$495.8 / Unit

View Datasheet →

EP3CLS100F484C7

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-484
Cyclone III LS · 100,448 · 4,451,328 · 278 · 47 · 1.2 V · 65 nm · 437.5 MHz

✓ In Stock

$62.8 / Unit

View Datasheet →

EP3CLS100F484I7N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-484
Cyclone III LS · FPGA - Field Programmable Gate Array · 100,448 · 6,278 · 4,451,328 bits (M9K blocks) · 278 · 294 · 4

✓ In Stock

$67.9 / Unit

View Datasheet →

EP3CLS100F484I7

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-484
Cyclone III LS · 100,448 · 278 · 4,451,328 bits · 610 (per datasheet family) · 66 · 16 dedicated · 4

✓ In Stock

$113.6 / Unit

View Datasheet →

EP3CLS100F484C8N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-484
Cyclone® III LS · Cyclone III LS · 100,448 · 4,451,328 bits · 278 (maximum user I/O) · 47 (logic blocks reported by DigChip snapshot) · FBGA-484 (FineLine BGA, lead-free) · 484

✓ In Stock

$115.4 / Unit

View Datasheet →

EP3CLS100F484C8 Maximum Ratings & Electrical Characteristics

Product Type FPGA - Field Programmable Gate Array
Series Cyclone III LS
Number of Logic Elements 100448
Total RAM Bits 4451328 bits
Number of User I/O 278
Core Supply Voltage 1.2 V
Process Technology 65 nm
Maximum Clock Frequency Rating 402 MHz
Package Type FBGA-484
Number of Pins 484
Package Shape Square
Terminal Form Ball
Mounting Type Surface Mount
Speed Grade 8 (from C8 ordering code)
Temperature Grade Commercial (C)
RoHS Status unknown

EP3CLS100F484C8 square Pin Configuration Guide

Pin configuration for EP3CLS100F484C8 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

square package pinout diagram for EP3CLS100F484C8

No detailed pinout data available for EP3CLS100F484C8.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3CLS100F484C8 is suitable for 6 applications: Industrial Automation and Machine Control, Wired Networking and Ethernet Bridging, Machine Vision and Video Processing, Medical Imaging and Patient Monitoring, Test and Measurement Instruments, Compute and Network Acceleration.

🏭

Industrial Automation and Machine Control

The EP3CLS100F484C8 provides 100,448 logic elements, enough to implement multi-axis motor-control loops, fieldbus interfaces, and safety logic in a single 484-ball FPGA. The 278 user I/Os allow glueless connection to position encoders, gate-driver signals, and HMI bridges. 4,451,328 RAM bits are sufficient for local data logging and small Ethernet packet buffers. When used as a central controller, its 1.2V core supply reduces system power without sacrificing 65nm performance. The C suffix supports 0°C to 85°C, adequate for many indoor industrial applications; for extreme environments consider I-suffix variants. Typical companions include an external EPCS/EPCQ configuration flash and an isolated transceiver for fieldbus communications.

🌐

Wired Networking and Ethernet Bridging

With 4,451,328 RAM bits and a rated 402MHz FPGA performance indicator, the EP3CLS100F484C8 can implement Ethernet MAC bridging, frame parsing, traffic classification, and queue management logic in one device. The 278 user I/Os provide sufficient pins for GMII/RGMII PHY connections, control-plane interfaces, and sideband management buses. Using the FPGA for packet preprocessing offloads a host CPU and makes the product field-upgradable when protocol definitions change. The 65nm 1.2V core reduces power compared to older 1.5V FPGAs, which is important in compact networking equipment. In this application, place the FPGA close to PHY devices, keep clock routing length-matched, and couple it with an EPCS/EPCQ flash for autonomous boot.

🎥

Machine Vision and Video Processing

A 100K-logic-element FPGA such as the EP3CLS100F484C8 is suitable for real-time image sensor interface, Bayer demosaic, color-space conversion, and low-latency feature extraction. The device’s 278 user I/Os enable parallel connections to CMOS imagers, DDR memory, and display controllers without requiring an external video bridge. Because the FPGA fabric performs pixel operations in parallel, it can maintain full-frame throughput at high resolutions while leaving a host processor free for higher-level algorithms. Its commercial temperature grade fits indoor machine-vision enclosures and test benches. The 1.2V core helps manage the thermal load in cameras and smart-vision modules. Use an external image sensor with a parallel or LVDS interface and a configuration flash for standalone boot.

💊

Medical Imaging and Patient Monitoring

In medical imaging systems such as ultrasound front ends, optical coherence tomography engines, and diagnostic monitoring equipment, the EP3CLS100F484C8 can perform real-time digital filtering, demodulation, and data formatting before sending results to a CPU. The 65nm low-power process keeps heat dissipation low in sealed medical housings, while the 100K logic elements and 278 I/O allow integration of multiple channels. The 4,451,328 RAM bits support line buffers and small scan-conversion tables. For medical bench equipment and hospital devices that do not require extended automotive temperature, the C-suffix variant is acceptable; however, system-level safety certifications and EMC requirements must be validated separately. Design with clean power planes and place bypass capacitors close to the FPGA core balls.

🔧

Test and Measurement Instruments

The EP3CLS100F484C8 is well suited for oscilloscopes, logic analyzers, spectrum analyzers, and protocol analyzers where high-I/O parallel data acquisition and trigger logic are required. Its 278 user I/Os allow direct connection to multiple ADC/DAC devices, front-panel controls, and high-speed backplanes. The reconfigurable fabric enables custom trigger patterns, decimation filters, and real-time data reduction, which reduces the burden on an embedded processor. 4,451,328 RAM bits are useful for acquisition buffers and FFT frame packaging. In test equipment, use a low-jitter clock source and carefully route high-speed data buses into the FPGA. The commercial temperature grade is sufficient for benchtop instruments operating in a controlled lab environment.

🖥️

Compute and Network Acceleration

In server and edge-computing applications, the EP3CLS100F484C8 can accelerate packet classification, hashing, data deduplication, and message parsing while a host CPU manages higher-level processing. The 1.2V core and 65nm process provide a balance of logic density and power for PCIe or Ethernet-attached accelerator cards. 100,448 logic elements can hold multiple soft pipeline stages, and 278 I/O are enough to interface with memory buffers, PHYs, and host bridge logic. Because FPGAs are reprogrammable, acceleration algorithms can be updated without hardware changes, which is advantageous for evolving protocols. This device is not meant for high-end 100G SmartNIC designs but works well in cost-sensitive 1/10G acceleration paths and embedded compute modules. Use configuration flash and a suitable power converter for the 1.2V core.

Recommended Products Summary

EPCS16SI8N Altera Used in: Industrial Automation and Machine Control, Machine Vision and Video Processing, Medical Imaging and Patient Monitoring ISO1050 Isolated CAN transceiver for industrial fieldbus interface Used in: Industrial Automation and Machine Control 88E1512 Gigabit Ethernet PHY for RGMII/GMII connection to FPGA Used in: Wired Networking and Ethernet Bridging, Compute and Network Acceleration EPCS64SI16N Configuration flash for storing FPGA bitstream in network equipment Used in: Wired Networking and Ethernet Bridging, Test and Measurement Instruments, Compute and Network Acceleration MT9V034 CMOS image sensor for machine vision with parallel data output Used in: Machine Vision and Video Processing ADS1298 Multi-channel low-power ADC for biomedical signal acquisition Used in: Medical Imaging and Patient Monitoring AD9230BCPZ-250 250 MSPS ADC for high-speed data acquisition front end Used in: Test and Measurement Instruments
What is EP3CLS100F484C8?
The EP3CLS100F484C8 is an Altera Cyclone III LS FPGA with 100,448 logic elements, 4,451,328 RAM bits, and 278 user I/Os in a 484-ball FBGA package. It is the commercial-temperature, speed-grade-8 version of the Cyclone III LS 100K device. According to DigiKey and Mouser listings, it is available as a standard FPGA product and is used in applications such as industrial automation, networking, video, and medical systems.
What are the key specifications of EP3CLS100F484C8 that engineers should know?
The most important EP3CLS100F484C8 parameters are 100,448 logic elements, 4,451,328 RAM bits, 278 user I/Os, 1.2V core supply, and FBGA-484 packaging. The device is based on 65nm technology and, according to the FindIC comparison listing, has an FPGA rating of 402MHz. Designers using this FPGA must supply a 1.2V core rail and external configuration memory, and should confirm the exact I/O and power-pin assignments from the device pin files.
What voltage does EP3CLS100F484C8 use?
The EP3CLS100F484C8 core operates at 1.2V. The DigChip datasheet entry also confirms a 1.2V supply voltage for the Cyclone III LS EP3CLS100 family. Your board design should provide this core rail plus separate VCCO rails for each I/O bank; consult the Cyclone III pin and power-management tables before layout.
Is EP3CLS100F484C8 lead-free / RoHS compliant?
The EP3CLS100F484C8 listing does not carry the N suffix that Altera/Intel uses to denote lead-free (RoHS) versions, so the lead-free status of this exact code is unconfirmed in the supplied supplier data. If RoHS compliance is mandatory, choose a part with the N suffix, such as EP3CLS100F484C7N or EP3CLS100F484C8N, after verifying from the manufacturer datasheet.
What is the speed grade of EP3CLS100F484C8?
The EP3CLS100F484C8 is a speed-grade-8 device in Altera's Cyclone III LS ordering scheme; the C suffix indicates a commercial-temperature version. In Altera/Intel order codes, the numeral after the temperature letter is the speed grade, so C8 means commercial temperature, speed grade 8. Speed grade 8 is slower than grade 7; if you need higher Fmax, consider EP3CLS100F484C7N.
Can EP3CLS100F484C7N replace EP3CLS100F484C8?
Yes, EP3CLS100F484C7N is a drop-in, pin-compatible replacement for EP3CLS100F484C8: both have the same Cyclone III LS die (100,448 logic elements, 4,451,328 RAM bits, 278 I/Os) in the same 484-ball FBGA package. C7N differs from C8 in speed grade (7 vs 8, so it is capable of equal or better timing) and has a lead-free N finish. A design fitted to C8 timing will generally work on C7N.
What is the difference between EP3CLS100F484C8 and EP3CLS100F484C7N?
The main difference between the EP3CLS100F484C8 and EP3CLS100F484C7N is speed grade: C8 is speed grade 8 and C7N is speed grade 7, with C7N offering better maximum clock performance. C7N also uses a lead-free 'N' finish while the C8 code without N has no confirmed RoHS declaration. Logic capacity, RAM, I/O, power, and package are otherwise identical.
Where can I buy EP3CLS100F484C8 online?
You can buy EP3CLS100F484C8 from online distributors such as DigiKey, Mouser, BonChip, Lisleapex, and chip-inventory.com. The DigiKey listing shows 'Buy now, ships today' as of 2026-09-09, indicating current availability there. For large-quantity or firm pricing, request a quote from these distributors or from XAIPART.
What is the price of EP3CLS100F484C8?
As of 2026-09-09, distributor pricing for EP3CLS100F484C8 is not shown in the search snippets; the price tier table on this XAIPART page provides an estimated list of about $218.50 at quantity 1, decreasing to about $148.45 at quantity 1,000. Because FPGA pricing is volatile and depends on stock, confirm the current price with DigiKey, Mouser, or Octopart before ordering.
What is the lead time for EP3CLS100F484C8?
As of 2026-09-09, the EP3CLS100F484C8 appears available at DigiKey ('buy now, ships today'); if stock is not on hand, non-stocked Cyclone III devices typically have lead times of 6 to 12 weeks from Intel/Altera distributors. For the exact current lead time, check the distributor listing or ask for a stock/quote from XAIPART.
Can EP3CLS100F484C8 be used in automotive applications?
The EP3CLS100F484C8 is not designated as an automotive-qualified device in the verified supplier data, so for production automotive electronics, use Intel/Altera FPGAs that carry AEC-Q100 qualification, such as automotive-grade Cyclone V or MAX 10 parts. This Cyclone III LS part is better suited to commercial/industrial systems where AEC-Q100 grade is not required.
Where can I download EP3CLS100F484C8 datasheet PDF?
You can download the Cyclone III / Cyclone III LS datasheet chapters from Intel's official Cyclone III FPGA product page at intel.com/content/www/us/en/products/details/fpga/cyclone/iii.html. Independent aggregators such as DigChip and digchip.com also index the Altera Cyclone III device data sheet text. Intel separates Cyclone III and Cyclone III LS chapters in the Cyclone III device handbook; use the Cyclone III LS chapter for this device.
What is the difference between the C and I temperature grades in EP3CLS100F484C8?
In the EP3CLS100F484C8 order code, C denotes commercial temperature grade and I would denote industrial temperature grade. Commercial Cyclone III devices are commonly specified for 0°C to 85°C while industrial devices are specified for -40°C to 100°C, but engineers should verify exact limits from the Cyclone III LS datasheet because the actual ranges are published in the device handbook.
Hey Google, what can replace EP3CLS100F484C8?
A socket-compatible replacement for EP3CLS100F484C8 is any other EP3CLS100F484 variant in the same 484-ball FBGA package, including EP3CLS100F484C7N, EP3CLS100F484C7, EP3CLS100F484I7N, EP3CLS100F484I7, and EP3CLS100F484C8N. All share the same Cyclone III LS die, logic capacity, RAM, and I/O, but differ in speed grade and temperature grade.
Is EP3CLS100F484C8 the same as EP3C80F484C8?
No, the EP3CLS100F484C8 is not the same as EP3C80F484C8. The LS part has about 100,448 logic elements, whereas the Cyclone III EP3C80F484C8 belongs to the smaller EP3C80 family; their logic capacities, memory sizes, and pinouts are different. Only EP3CLS100F484 variants are true drop-in equivalents for the EP3CLS100F484C8.

Engineering reference data for EP3CLS100F484C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3CLS100F484C8 when your design requires 100K-class Cyclone III LS FPGA resources, 278 user I/Os, a 484-ball FBGA footprint, and a commercial temperature grade is acceptable. This part is the most cost-oriented C8 speed-grade member of the EP3CLS100F484 family. If your timing closure needs more margin, choose EP3CLS100F484C7N or EP3CLS100F484C7, which are speed grade -7. If you must operate in an industrial-temperature environment, choose EP3CLS100F484I7N or EP3CLS100F484I7. If you specifically need a confirmed lead-free (RoHS-visible) finish, choose an N-suffix variant such as EP3CLS100F484C8N. Because all listed alternatives share the same 484-ball FBGA package and same Cyclone III LS die, a single PCB layout can support every member of this family; timing and temperature specifications should be adjusted in the project constraints according to the chosen suffix.

Comparison with Alternatives

Parameter This Product EP3CLS100F484C7N EP3CLS100F484C7 EP3CLS100F484I7N EP3CLS100F484I7 EP3CLS100F484C8N
Brand Altera Altera Altera Altera Altera Altera
Package FBGA-484 FBGA-484 - same FBGA-484 - same FBGA-484 - same FBGA-484 - same FBGA-484 - same
Number of Logic Elements 100448 100448 100448 100448 100448 100448
Total RAM Bits 4451328 4451328 4451328 4451328 4451328 4451328
Number of User I/O 278 278 278 278 278 278
Core Supply Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V
Speed Grade (ordering code) 8 (C8) 7 (C7N) 7 (C7) 7 (I7N) 7 (I7) 8 (C8N)
Temperature Grade C (Commercial) C (Commercial) C (Commercial) I (Industrial) I (Industrial) C (Commercial)
Pb-free N suffix No N in MPN Yes (N suffix) No Yes (N suffix) No Yes (N suffix)

Key Differentiators

  • Commercial C-suffix part targets indoor, cost-sensitive systems (vs EP3CLS100F484I7N)
  • Speed grade 8 is a lower performance but potentially more economical grade (vs EP3CLS100F484C7N)
  • Non-N suffix may simplify legacy SnPb soldering process reuse (vs EP3CLS100F484C8N)

Design Notes

The EP3CLS100F484C8 core is a 1.2V SRAM FPGA. Provide a low-impedance 1.2V core rail plus separate VCCO supplies for each I/O bank according to the Cyclone III pin connection guidelines. Place 100nF ceramic capacitors as close as possible to the FPGA power/ground balls and add bulk capacitance on the board. Sizing the power distribution network should be based on the final design toggle rate; do not simply copy a low-density FPGA decoupling layout.

Cyclone III LS devices are SRAM-based and require an external configuration source after power-up. Plan for active serial configuration using an EPCS/EPCQ configuration device, or use JTAG during development. At power-on, drive nCONFIG low until the power supplies have stabilized, then release it to start configuration. Protect the configuration device from accidental writes if in-system update is not used.

The 484-ball FBGA package uses a BGA land pattern with hidden rows. Use the official Intel/Altera footprint and pin files to generate the PCB symbol, and route inner balls using via-in-pad or escape vias under the component when necessary. Provide a continuous ground plane beneath the FPGA and minimize the distance between vias and power balls to reduce inductance.

For high-speed source-synchronous interfaces, keep clock and data trace lengths matched within the values recommended by the interface standard. Add series termination resistors near the FPGA outputs when driving long traces or multiple loads. Unused user I/O pins should be assigned to tri-state in the Quartus assignment editor to prevent bus contention during configuration and after boot.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

No explicit compliance declarations were provided in the verified web data. The absence of an 'N' in the part number may indicate a non-lead-free finish, but this must be confirmed with the manufacturer or an authorized distributor.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel EP3CLS100F484C8 EP3CLS100F484C7N EP3CLS100F484C7 EP3CLS100F484I7N EP3CLS100F484I7 EP3CLS100F484C8N Cyclone III LS FPGA Field Programmable Gate Array Programmable Logic Device Logic Element RAM bit User I/O FBGA-484 Ball Grid Array BGA 65nm process 1.2V core supply Commercial temperature grade Industrial temperature grade Speed grade RTL Quartus
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