EP3CLS150F780I7N - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel
MPN: EP3CLS150F780I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172.5 | $1,725.00 |
| 100 | $156 | $15,600.00 |
| 500 | $142 | $71,000.00 |
| 1,000 | $128 | $128,000.00 |
EP3CLS150F780I7N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks (M9K/M144K), PLLs, and high-speed I/O serializers. FPGAs occupy a tier between fixed-function ASICs and microcontrollers: like microcontrollers they are software-programmed and shipped in volume, but like ASICs they implement parallel hardware logic at clock rates up to hundreds of MHz. Cyclone III LS sits in the low-power, cost-optimized segment of the FPGA taxonomy (FPGA -> programmable logic -> semiconductor IC -> integrated circuit) and competes with Xilinx Spartan-6 and Lattice ECP3 families.
Key features of the EP3CLS150F780I7N include 150,848 logic elements (LEs), 6,137,856 embedded memory bits organized into M9K blocks, four general-purpose PLLs, 413 maximum user I/O supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, and up to 437 MHz internal operation on a 1.2 V core supply. The LS security engine performs bitstream encryption, JTAG lockdown, and side-channel resistance for IP protection. The 780-FBGA package exposes the largest I/O count in the EP3CLS150 family and integrates an exposed thermal pad for board-level heat spreading.
Architecturally, the Cyclone III LS combines a 65 nm SRAM-based logic fabric with hard IP blocks (18x18 multipliers, M9K RAM, PLLs, and external memory controllers) to balance logic density, DSP throughput, and power. The LS series additionally integrates a configuration AES engine and tamper-monitor pins (TDI/TMS/TRST-conditioned secure JTAG), making it suitable for designs that must protect firmware IP at rest and resist physical tampering.
Typical applications include industrial motor control, secure communications gateways, software-defined radio (SDR) baseband, machine-vision pre-processing, military/aerospace secure embedded systems, and FPGA-based PCIe endpoint prototyping. The 780-ball package supports the highest I/O count in the family, so it is preferred for memory-intensive or high-bandwidth designs that need 16-bit DDR2/DDR3 external memory interfaces.
When designing with this part, plan for configuration via JTAG or passive serial from a configuration flash (EPCS), and budget for the 1.2 V core, 2.5 V/3.3 V I/O bank, and 1.0 V PLL analog supplies. The exposed pad must be soldered to a properly sized copper pour for thermal dissipation; without it, junction temperature can exceed 100 C under sustained high-utilization workloads.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical FPGA design notes not found in the standalone manufacturer datasheet, giving engineers and procurement teams an information-density advantage.
Drop-in alternatives for EP3CLS150F780I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS150F780I7N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, RoHS Status, Embedded Memory Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS150F780I7
✅ Drop-In✓ In Stock
$712.5 / Unit
View Datasheet →EP3CLS150F780C8N
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EP3CLS150F780C7N
✅ Drop-In✓ In Stock
$88.4 / Unit
View Datasheet →EP3CLS100F780I7N
✅ Drop-In✓ In Stock
$174 / Unit
View Datasheet →EP3CLS100F780C8N
✅ Drop-In✓ In Stock
$105.8 / Unit
View Datasheet →EP3CLS150F780I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements | 150,848 |
| Embedded Memory Bits | 6,137,856 |
| Maximum User I/O | 413 |
| Package | 780-FBGA (FineLine BGA) |
| Pins / Balls | 780 |
| Supply Voltage (Core) | 1.2 V |
| Process Technology | 65 nm low-power CMOS |
| Maximum Internal Frequency | 437 MHz |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Number of PLLs | 4 |
| Configuration Method | JTAG, Passive Serial (EPCS), Active Serial |
| Security Features | AES-128/256 bitstream encryption, JTAG security, tamper detection |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
| RoHS Status | Compliant |
| Device Type | FPGA - Field Programmable Gate Array |
EP3CLS150F780I7N 780-fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3CLS150F780I7N (780-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS150F780I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS150F780I7N is suitable for 6 applications: Industrial Motor Control and Servo Drives, Secure Communications Gateway, Software Defined Radio (SDR) Baseband, Machine Vision Pre-Processing, Military and Aerospace Secure Embedded Systems, PCIe Endpoint Prototyping and Acceleration.
Industrial Motor Control and Servo Drives
The EP3CLS150F780I7N fits industrial motor control designs where deterministic parallel logic, multiple encoder interfaces, and AES bitstream protection against IP theft are simultaneously required. With 150,848 LEs and 413 user I/O, it can host 3-axis field-oriented control loops (FOC), resolver-to-digital conversion, PWM generation, and CAN/EtherCAT communication state machines on a single chip. The 65 nm low-power process keeps total device power under 1.5 W at typical 50-70% utilization, allowing fan-less drives to operate in sealed enclosures. Compared to a microcontroller+DSP two-chip solution, the FPGA consolidates gate driver timing, current sampling, and safety logic into one part with sub-microsecond deterministic latency. Pair it with EPCS configuration flash and the Analog Devices AD2S1210 resolver-to-digital converter.
Recommended
Secure Communications Gateway
The EP3CLS150F780I7N's hardware AES-128/256 bitstream encryption and JTAG security make it well suited for secure communications gateways that handle encrypted traffic and must protect firmware IP at rest. Its 150K LEs comfortably implement IPsec/SSL offload, packet classification, and traffic shaping pipelines. The 780-FBGA package exposes 413 I/O - enough for multiple SGMII/SerDes lanes to PHY chips, DDR3 external memory, and parallel bus interfaces. Bitstream encryption prevents reverse engineering even if a configured device is removed from a board, addressing IP protection requirements common in defense and critical infrastructure. Designers should also enable the LS tamper-detection pins and route them to supervisory circuitry.
Recommended
Software Defined Radio (SDR) Baseband
The EP3CLS150F780I7N delivers up to 437 MHz internal clock and contains dedicated 18x18 multipliers that make it viable as a baseband processor for narrow-band to mid-band SDR applications up to ~50 MHz signal bandwidth. Its 150K LEs run FFT/IFFT cores, digital down-converters, and channel-coding accelerators (Viterbi, turbo) at deterministic throughput. The 6.1 Mbit embedded memory holds channelization filters and intermediate sample buffers, reducing the need for external SRAM. For wider-bandwidth or higher-channel-count radios, designers typically migrate to Cyclone V GT or Arria 10, but for sub-50 MHz cost-sensitive waveforms the Cyclone III LS remains attractive. Pair with an AD9361 or AD9371 RF transceiver.
Recommended
Machine Vision Pre-Processing
The EP3CLS150F780I7N serves as a pre-processing pipeline for machine vision systems, where deterministic latency and parallel pixel processing matter more than raw CPU throughput. Its 413 user I/O support multiple MIPI/parallel image sensor interfaces (after external deserialization), and the 150K LEs implement Bayer demosaicing, lens distortion correction, and histogram generation in real time. The 6.1 Mbit embedded memory holds line buffers, while the 780-FBGA exposes the high I/O count needed for multi-lane sensor aggregation. Compared to GPU or CPU pre-processing, the FPGA delivers fixed latency and lower power per pixel - critical for factory-floor inspection systems. Pair with an ON Semiconductor AR0521 or Sony IMX264 image sensor.
Recommended
Military and Aerospace Secure Embedded Systems
The EP3CLS150F780I7N's tamper detection, AES bitstream encryption, and industrial temperature grade position it for ruggedized defense and aerospace embedded applications where firmware protection is mandated. It hosts secure boot logic, sensor-fusion pipelines, and MIL-STD-1553 or ARINC 429 bus interfaces on a single chip. The 780-FBGA package withstands shock and vibration typical of vehicle and airborne platforms when properly underfilled and PCB-mounted with staking. Although it is not formally MIL-PRF-38535 qualified, the industrial-temp silicon and security engine make it a common choice for prototypes and lower-tier programs. Pair with a TI SN65HVD20-1553 transceiver for MIL-STD-1553 databus termination.
Recommended
PCIe Endpoint Prototyping and Acceleration
The EP3CLS150F780I7N can implement a single-lane PCIe Gen1 endpoint with the hard IP block in the Cyclone III LS fabric, making it a popular target for PCIe device prototyping and IP validation. Its 150K LEs provide enough room for the PCIe IP core plus user application logic (DMA engines, protocol accelerators, or FPGA-based coprocessors). The 780-FBGA's 413 I/O support PCIe transmit/receive pairs, DDR2/DDR3 external memory, and host-side register interfaces. Designers typically use the Altera PCIe Compiler IP block under Quartus Prime to integrate the PHY/MAC. For higher PCIe lane counts or Gen2/Gen3, migrate to Cyclone V GT or Arria 10. Pair with a TI TPS5430 switching regulator for PCIe slot power.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS150F780I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS150F780I7 | EP3CLS150F780C8N | EP3CLS150F780C7N | EP3CLS100F780I7N | EP3CLS100F780C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 150,848 | 150,848 (same) | 150,848 (same) | 150,848 (same) | 100,448 (-33%) | 100,448 (-33%) |
| Embedded Memory Bits | 6,137,856 | 6,137,856 (same) | 6,137,856 (same) | 6,137,856 (same) | 3,888,384 (-37%) | 3,888,384 (-37%) |
| Maximum User I/O | 413 | 413 (same) | 413 (same) | 413 (same) | 413 (same) | 413 (same) |
| Speed Grade | I7 (industrial, 7) | I7 (same) | C8 (commercial, 8) | C7 (commercial, 7) | I7 (same) | C8 (commercial, 8) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Bitstream Encryption (AES-128/256) | Yes (LS security engine) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Supply Voltage (Core) | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS (same) | 65 nm low-power CMOS (same) | 65 nm low-power CMOS (same) | 65 nm low-power CMOS (same) | 65 nm low-power CMOS (same) |
Key Differentiators
- Largest logic density in the Cyclone III LS family (vs EP3CLS100F780I7N)
- Hardware AES bitstream encryption and tamper detection (vs EP3C120F780I7N (standard Cyclone III, non-LS))
- Industrial temperature grade with same package as commercial variants (vs EP3CLS150F780C8N)
Design Notes
Estimated: at 100% utilization on 150K LEs with all PLLs active, the EP3CLS150F780I7N can dissipate up to ~1.5 W from a 1.2 V core. With a theta_JA of approximately 18 C/W for the 780-FBGA on a JEDEC 4-layer test board, junction rise above ambient is roughly 27 C. Designers must solder the exposed thermal pad to a PCB copper pour of at least 1 square inch to keep Tj below 100 C; without thermal vias under the pad, junction temperature can exceed safe limits under sustained workload.
The 780-FBGA package requires a 1.0 mm or 1.27 mm ball pitch PCB footprint per the Altera package specification. Use a minimum 4-layer stack-up with continuous power and ground planes under the BGA. Decoupling: place 0.1 uF X7R ceramic capacitors on every VCCINT, VCCPD, VCCA_PLL, and VCCIO pin within 100 mil trace length. For high-speed LVDS or DDR2/3 interfaces, route signals on the top layer over a solid reference plane and length-match differential pairs to within 20 mil.
Do not mix I7 and C7/C8 speed-grade bitstreams - while the silicon is identical, the Quartus Prime timing analysis uses different derating factors. Confusing I7 industrial temp silicon with C7 commercial temp during a field failure analysis is a frequent support ticket root cause. Also, configuration via passive serial (EPCS) requires MSEL pins to be strapped correctly at boot; leaving them floating is one of the most common bring-up failures on first prototypes.
Compliance Information
RoHS compliance confirmed by the trailing 'N' suffix per the standard naming convention. AEC-Q100 is not applicable for FPGAs. Halogen-free status is not stated in the verified web data and is marked as unknown. Conflict minerals compliance follows Intel's standard supply chain reporting.
