EP3CLS100F780I7N - Cyclone III LS FPGA, 100K LE, 780-FBGA | Intel
MPN: EP3CLS100F780I7N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $209 | $52,250.00 |
| 500 | $192 | $96,000.00 |
| 1,000 | $174 | $174,000.00 |
EP3CLS100F780I7N Overview
An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks, and high-speed transceivers. FPGAs sit between fixed-function ASICs and software-programmable microcontrollers in the design hierarchy: ASIC > FPGA > CPLD > microcontroller > DSP, allowing hardware-level parallelism while remaining fully reconfigurable in the field. The Cyclone III LS family specifically targets low-power, high-volume applications where ASIC NRE costs are not amortized.
Key features of the EP3CLS100F780I7N include 100,448 logic elements, 4,451,328 RAM bits (approximately 555 Kbytes), 4 PLLs for clock management, 413 maximum user I/Os, and support for DDR/DDR2/DDR3 external memory interfaces through dedicated PHY blocks. The device also embeds Cyclone III LS hard cryptographic accelerators and configuration bit-stream encryption (AES), making it suitable for secure communications designs.
Architecture details: the device uses a 4-input LUT-based logic element, M9K embedded memory blocks (total 486 blocks per datasheet references), and 17x17-bit hardware multipliers. The 65 nm LP process provides a balance between leakage and active power, while the LS suffix denotes the low-power static variant of the Cyclone III family. The 780-FBGA package uses a 1.0 mm ball pitch and provides ample signal escape for high I/O count designs.
Typical applications include industrial motor control, video processing pipelines, software-defined radio, low-cost ASIC prototyping, and embedded display controllers. The wide operating temperature range and high logic density make it suitable for factory automation, medical imaging pre-processing, and telecom baseband preprocessing.
When designing with this part, ensure the Quartus II / Quartus Prime design software targets the EP3CLS100 device and that power budgeting accounts for both quiescent and dynamic contributions. The 780-FBGA requires a multilayer PCB with microvia or via-in-pad construction; signal-integrity simulation is recommended for DDR3 interfaces exceeding 200 MHz.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III LS family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3CLS100F780I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS100F780I7N (same form factor and footprint) β differing in Package, Process Technology, Speed Grade, Embedded Memory Bits, Logic Elements.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3CLS100F780I7
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View Datasheet βEP3CLS100F780C8N
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View Datasheet βEP3CLS100F780C7N
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$298.75 / Unit
View Datasheet βEP3C120F780I7N
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$198.45 / Unit
View Datasheet βEP3C80F780I7N
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$514.03 / Unit
View Datasheet βEP3C55F780I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$195 / Unit
View Datasheet βEP3CLS100F780I7N Maximum Ratings & Electrical Characteristics
| Device Type | FPGA - Field Programmable Gate Array |
| Series | Cyclone III LS |
| Logic Elements | 100,448 |
| Embedded Memory Bits | 4,451,328 |
| Maximum User I/O | 413 |
| Total RAM Bits | 4,451,328 bits |
| Number of PLLs | 4 |
| Process Technology | 65 nm low-power (TSMC) |
| Core Supply Voltage | 1.2 V |
| Package Type | 780-FBGA |
| Package Code | F780 |
| Operating Temperature | -40C to +100C (industrial) |
| Speed Grade | 7 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
EP3CLS100F780I7N f780 Pin Configuration Guide
Pin configuration for EP3CLS100F780I7N (f780 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS100F780I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS100F780I7N is suitable for 7 applications: Industrial Motor Control, Video Processing Pipeline, Software Defined Radio, ASIC Prototyping Platform, Embedded Display Controller, Secure Communications Equipment, Medical Imaging Pre-Processing.
Industrial Motor Control
The EP3CLS100F780I7N's 100,448 logic elements, 4 PLLs, and industrial -40C to +100C temperature range make it ideal for multi-axis industrial motor control. The device can implement field-oriented control (FOC) loops, space-vector PWM, encoder feedback processing, and resolver-to-digital conversion in a single chip, replacing discrete DSP+microcontroller architectures. The 65 nm low-power process keeps total power dissipation under 2W typical, important for sealed IP65 enclosures with limited convection cooling.
Recommended
Video Processing Pipeline
The EP3CLS100F780I7N's 4,451,328 RAM bits provide 555 Kbytes of on-chip buffering sufficient for one or two video frame lines plus intermediate scaling coefficients, making it suitable for HD video scaling, deinterlacing, and color-space conversion. The 17x17 hardware multipliers accelerate convolution kernels for image enhancement. The 413 user I/Os accommodate parallel CMOS camera interfaces, HDMI bridge chips, and DDR2 frame buffers without external bus multiplexing.
Recommended
Software Defined Radio
For software-defined radio baseband processing, the EP3CLS100F780I7N provides enough logic elements to implement digital down-conversion (DDC), channelization filters, and basic demodulation algorithms for narrowband signals. The 4 PLLs generate the multiple clock domains needed for ADC sampling, decimation, and CPU interfaces. Compared to a DSP-only solution, the FPGA's parallelism delivers much higher throughput per watt for FFT and FIR filter operations.
Recommended
ASIC Prototyping Platform
The EP3CLS100F780I7N serves as a low-cost ASIC prototyping vehicle for designs targeting 50K-100K ASIC gates, allowing firmware and software teams to validate systems before mask commit. The Cyclone III LS AES bit-stream encryption protects the prototype RTL from unauthorized IP extraction during shared development environments. The 780-FBGA package exposes enough I/Os to map most ASIC pad-limited designs without multiplexing compromises.
Recommended
Embedded Display Controller
Driving TFT-LCD panels up to 1280x800 resolution with multiple overlay layers, the EP3CLS100F780I7N provides ample logic for the timing controller, color palette lookup, and 2D graphics acceleration. The 4,451,328 RAM bits accommodate at least one full display frame in 16-bit color plus two-layer overlay buffers. The 413 user I/Os expose parallel RGB, LVDS, and control interfaces simultaneously.
Recommended
Secure Communications Equipment
The Cyclone III LS hardware AES bit-stream encryption and configuration scrubbing make the EP3CLS100F780I7N suitable for tamper-resistant communications hardware such as encrypted radios and secure network appliances. Combined with 100K logic elements for protocol processing and 4 PLLs for multi-rate interface clocking, the device supports AES-encrypted IPsec or proprietary cipher pipelines. The industrial temperature grade ensures operation in outdoor telecom enclosures.
Recommended
Medical Imaging Pre-Processing
Ultrasound front-end pre-processing, including beamforming, envelope detection, and logarithmic compression, fits comfortably within the EP3CLS100F780I7N's 100,448 logic elements and 4,451,328 RAM bits. The 4 PLLs generate the high-frequency sampling clocks for multi-channel ADC arrays, while the industrial temperature range supports portable cart-based imaging systems. Low static power improves battery runtime on handheld diagnostic devices.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS100F780I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS100F780I7 | EP3CLS100F780C8N | EP3CLS100F780C7N | EP3C120F780I7N | EP3C80F780I7N | EP3C55F780I7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 100,448 | 100,448 | 100,448 | 100,448 | 119,088 | 81,264 | 55,856 |
| Embedded Memory (bits) | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 3,981,312 | 2,810,880 | 2,396,160 |
| Maximum User I/O | 413 | 413 | 413 | 413 | 531 | 429 | 377 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Speed Grade | 7 | 7 | 8 | 7 | 7 | 7 | 7 |
| Series (Security) | Cyclone III LS (hardware AES encryption) | Cyclone III LS (hardware AES encryption) | Cyclone III LS (hardware AES encryption) | Cyclone III LS (hardware AES encryption) | Cyclone III (no hardware encryption) | Cyclone III (no hardware encryption) | Cyclone III (no hardware encryption) |
Key Differentiators
- Hardware AES bit-stream encryption unavailable on standard Cyclone III (vs EP3C120F780I7N)
- Lower static power than standard Cyclone III at same density (vs EP3C120F780I7N)
- Higher logic density than smaller Cyclone III LS alternatives (vs EP3C55F780I7N)
Design Notes
Estimated: Cyclone III LS FPGAs at 100% logic utilization in the 780-FBGA package dissipate approximately 1.5W to 3W depending on toggle rate. The 780-FBGA has a theta_JA of approximately 20 C/W with a standard 4-layer JEDEC test board. At 2W dissipation, junction temperature rise is ~40C above ambient, so at the industrial upper limit of +100C the junction remains within the 125C maximum. Designers should attach thermal vias under the package center thermal pad to the internal ground plane for additional margin in sealed enclosures.
The 780-FBGA uses a 1.0 mm ball pitch and requires multilayer PCB construction with microvia or via-in-pad technology. Estimated: signal trace widths of 0.1 mm with 0.2 mm spacing are typical for escape routing. DDR3 interfaces running above 200 MHz require matched-length routing within Β±25 ps and characteristic impedance of 50 ohms single-ended, 100 ohms differential. The dedicated DQS/DQ groups must be routed as matched bus topologies; refer to the Cyclone III external memory interface guidelines in the device handbook.
Do not attempt to use Quartus Prime software to compile designs for Cyclone III LS - only Quartus II 13.0sp1 or earlier supports this family. Mixing MSEL[3:0] configuration pins with user I/O without proper setting will prevent configuration. The CONFIG_DATA pins require external 4.7k ohm pull-up resistors to VCCIO of the configuration bank. For AES-encrypted bit-streams, the key must be programmed into a volatile key register; loss of VCC without battery backup erases the key.
Compliance Information
RoHS compliant per DigiKey listing. Lead-free per the N suffix designation. AEC-Q100 not applicable for FPGAs. Halogen-free status not confirmed in provided data.
