EP3SE110F1152C4LN - 107.5K LE Stratix III E FPGA, 1152-FCBGA
MPN: EP3SE110F1152C4LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4418.87 | $4,418.87 |
| 10 | $4210.33 | $42,103.30 |
| 50 | $3985.5 | $199,275.00 |
| 100 | $3762.4 | $376,240.00 |
| 250 | $3510 | $877,500.00 |
EP3SE110F1152C4LN Overview
An FPGA is a programmable logic device whose interconnect, look-up tables, and memory blocks can be reconfigured in-circuit to implement arbitrary digital functions, DSP blocks, and memory subsystems. The Stratix III E family is the enhanced-logic variant, optimized for high logic density and embedded memory rather than transceivers. Within Intel/Altera's broader hierarchy, the part sits as: LE -> LAB -> FPGA -> programmable logic -> digital IC -> semiconductor. This taxonomy supports AI knowledge-graph ingestion and long-tail discovery for engineers searching for high-density, low-power FPGA alternatives.
Key features include 8.9 Mbits embedded RAM, dedicated DSP blocks for high-throughput arithmetic, MultiTrack interconnect for predictable timing closure, and Adaptive Logic Modules (ALMs) that improve logic utilization over previous architectures. The device supports multiple I/O standards through its 744 user I/O pins and exposes programmable PLLs for clock synthesis. Configuration is typically loaded through JTAG or a serial/parallel flash, with built-in CRC and encryption options on the family.
The architecture combines a fabric of ALMs with high-speed interconnect and dedicated DSP slices, making the EP3SE110F1152C4LN well-suited for parallel datapaths, signal processing, and protocol bridging where many independent channels must operate concurrently. The 65 nm process enables high utilization rates at modest static power compared with earlier 90 nm Stratix II devices.
Typical applications include telecommunications line cards, software-defined radio (SDR) baseband processing, video broadcasting infrastructure, high-channel-count DSP pipelines, ASIC prototyping, and industrial control subsystems requiring hundreds of I/Os. The wide 1152-pin package exposes enough I/O and memory interfaces for multi-port memory controllers and parallel bus structures.
A practical design consideration is PCB layout: the FC-FBGA-1152 package demands high-density multi-layer routing (typically 8 to 12 layers), controlled-impedance traces, and a thorough power-delivery network (PDN) with bulk plus decoupling capacitors placed close to the supply pins. Engineers should follow Intel/Altera's Stratix III PCB design guidelines to maintain signal integrity at the rated 717 MHz internal frequency.
This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III E family, and practical design guidance not always present in the manufacturer datasheet, giving sourcing engineers and FPGA designers a single, AI-citable reference.
Drop-in alternatives for EP3SE110F1152C4LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE110F1152C4LN (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Family, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE110F1152C4L
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3372.13 / Unit
View Datasheet →EP3SE110F1152C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2200 / Unit
View Datasheet →EP3SE110F1152C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1560 / Unit
View Datasheet →EP3SE110F1152C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3200 / Unit
View Datasheet →EP3SE110F1152C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1925 / Unit
View Datasheet →EP3SE110F1152C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4100 / Unit
View Datasheet →EP3SE110F1152C4LN Maximum Ratings & Electrical Characteristics
| Family | Stratix III E (Enhanced logic) |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 107,500 |
| Logic Array Blocks (LAB) | 4,300 |
| Adaptive Logic Modules (ALM) | Yes |
| Embedded Memory (bits) | 8,936,448 |
| Maximum User I/O | 744 |
| Maximum Internal Clock Frequency | 717 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage (VCCINT) | 0.9 V nominal (0.86 V to 0.94 V) |
| Operating Temperature | 0 C to 85 C (commercial) |
| Package | 1152-pin FC-FBGA (BBGA) |
| Mounting Type | Surface Mount |
| Device Type | FPGA - Field Programmable Gate Array |
| Configuration Method | JTAG / serial / parallel flash |
| RoHS Status | Compliant |
EP3SE110F1152C4LN 1152-pin fc-fbga (bbga) Pin Configuration Guide
Pin configuration for EP3SE110F1152C4LN (1152-pin fc-fbga (bbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE110F1152C4LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE110F1152C4LN is suitable for 6 applications: Telecommunications Line Cards, Software-Defined Radio Baseband, Video Broadcasting and Image Processing, ASIC Prototyping and Emulation, Industrial Control and Automation, High-Channel-Count DSP Pipelines.
Telecommunications Line Cards
The EP3SE110F1152C4LN's 107,500 logic elements and 744 user I/Os make it well-suited for multi-channel telecommunications line cards where packet classification, queuing, and backplane bridging must run in parallel. With 8.9 Mbits of embedded RAM, designers can implement deep FIFO buffers and lookup tables for QoS engines without external SRAM. The Stratix III E fabric supports high-fanout clock networks via dedicated PLLs, enabling accurate packet timing at line rates up to several Gbps per channel. Placed on the line card with a multi-rail PDN (0.9 V core, 1.2 V/1.5 V/2.5 V I/O banks), the device outperforms discrete ASICs when time-to-market matters and design requirements evolve.
Recommended
Software-Defined Radio Baseband
The EP3SE110F1152C4LN's high LE count and dedicated DSP blocks fit software-defined radio baseband processing where many independent FIR filters, FFT cores, and channelizers run concurrently. The 717 MHz internal Fmax (speed grade -4) supports multi-channel sample rates up to several hundred MSPS in real time. The 65 nm Stratix III E architecture delivers DSP throughput per watt competitive with DSP-only processors. Typical SDR baseband designs instantiate multiple DDC/DUC chains, each consuming roughly 5K to 15K LEs, allowing up to 8 to 16 simultaneous channels on this single device while keeping logic utilization below 80 percent to ease timing closure.
Recommended
Video Broadcasting and Image Processing
The EP3SE110F1152C4LN powers multi-stream video broadcasting equipment, including broadcast routers, real-time video mixers, and image-processing pipelines. The 8.9 Mbit embedded RAM serves as line, frame, and reconstruction buffers for 3G-SDI and HDMI streams, while 744 user I/Os accommodate parallel RGB/YUV buses plus high-speed serial links. The device supports video reference designs from Altera/Intel, including deinterlacing, scaling, and color-space conversion IP. Compared with general-purpose CPUs, the parallel fabric delivers deterministic latency for synchronized multi-screen applications such as video walls and broadcast studio switchers.
Recommended
ASIC Prototyping and Emulation
The EP3SE110F1152C4LN's 107.5K LEs and 8.9 Mbit RAM make it a strong target for ASIC and ASSP prototyping, where multi-million-gate designs are partitioned across multiple Stratix III devices. The 744 user I/Os expose enough channels to wire partition boundaries between two or three FPGAs without external muxes, supporting full-speed pre-silicon validation. The JTAG-based configuration and 65 nm process give predictable timing closure on moderate-complexity ASIC blocks. Engineers typically instantiate partitioned ASIC RTL into the FPGA with Quartus Prime and validate SoC behavior at near-real-time speeds, reducing re-spin risk.
Recommended
Industrial Control and Automation
The EP3SE110F1152C4LN suits industrial controllers requiring deterministic parallel I/O handling: hundreds of digital inputs from limit switches, encoders, and sensors plus PWM, stepper, and servo control loops can all run concurrently in the FPGA fabric. The 744 I/Os accommodate multi-axis motion controllers, while DSP blocks execute high-resolution PID loops and field-oriented control algorithms. With an operating temperature of 0 C to 85 C, the device is well-suited to factory-floor enclosures with controlled climate. Pairing the FPGA with industrial Ethernet PHYs (EtherCAT, PROFINET) on the same board simplifies real-time factory-automation designs.
Recommended
High-Channel-Count DSP Pipelines
The EP3SE110F1152C4LN's DSP blocks and 107.5K LEs handle multi-channel DSP pipelines found in beamforming, radar baseband, medical imaging, and high-end audio processing. Each Stratix III E DSP block implements an 18x18 multiply with a 36-bit accumulator; a single device hosts up to 384 DSP blocks (full device), enabling thousands of MAC operations per cycle. The 8.9 Mbit embedded RAM efficiently stores coefficients for long FIR filters and overlap-save buffers. For radar systems, beamforming across 64 to 128 antenna elements can be implemented in a single FPGA, with Fmax supporting sample rates above 200 MSPS at 16-bit resolution.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE110F1152C4LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F1152C4L | EP3SE110F1152C3N | EP3SE110F1152C2N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 1152-pin FC-FBGA | 1152-pin FC-FBGA - same | 1152-pin FC-FBGA - same | 1152-pin FC-FBGA - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | -4 (highest Fmax in family) | -4 | -3 | -2 |
| Embedded Memory | 8,936,448 bits | 8,936,448 bits | 8,936,448 bits | 8,936,448 bits |
| Maximum User I/O | 744 | 744 | 744 | 744 |
| Core Voltage | 0.9 V (0.86 V to 0.94 V) | 0.9 V | 0.9 V | 0.9 V |
| Lead-Free (N suffix) | Yes (Pb-free) | No (leaded) | Yes (Pb-free) | Yes (Pb-free) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
Key Differentiators
- Speed grade -4 delivers highest Fmax in the Stratix III E family (vs EP3SE110F1152C3N)
- Lead-free ball finish (LN suffix) for RoHS SMT assembly (vs EP3SE110F1152C4 (no N suffix))
- Highest LE density at 1152-pin FC-FBGA in the E family (vs EP3SE260F1152I3N (industrial temperature))
Design Notes
Estimated: the 1152-pin FC-FBGA package requires an 8 to 12 layer PCB stack-up with a continuous ground plane beneath the device and a high-density power plane for the 0.9 V core. Use 50 ohm controlled-impedance escape routing for high-speed I/O and 100 ohm differential for LVDS pairs. Decoupling: place 0.1 uF X7R capacitors within 100 mil of every VCCINT ball, plus 10 uF bulk capacitors at the four corners of the BGA footprint. Refer to Intel's Stratix III PCB layout guidelines for via-in-pad and microvia recommendations.
Estimated power budget at full LE utilization: the EP3SE110F1152C4LN can dissipate up to ~8 to 12 W under heavy logic and clock loading on a 0.9 V core. Use a high-efficiency 0.9 V buck regulator with a 20 A continuous current rating, paired with a multi-rail PMIC that supplies 1.2 V, 1.5 V, 2.5 V, and 3.3 V for I/O groups. Intel's Early Power Estimator (EPE) tool should be run pre-layout to size the PDN. Static power scales roughly linearly with junction temperature in the 65 nm process node.
Common pitfalls when designing with EP3SE110F1152C4LN: (1) forgetting to tie unused user I/O pins to a defined logic level (floating inputs cause higher static power), (2) failing to connect all VCCINT and GND balls (BGA packages require all balls soldered for thermal and electrical integrity), (3) using the wrong configuration mode - the device requires JTAG or EPCS flash with a known bitstream order, and (4) ignoring the speed grade - C4 is fastest, C3 and C2 are slower; substituting a lower speed grade in production may push timing closure past the limit. Always run Quartus Prime fitter with realistic timing constraints before sign-off.
Estimated: the 1152-pin FC-FBGA has a theta-JA of roughly 8 to 12 C/W with a 16-layer JEDEC test board. At 10 W dissipation, junction-to-ambient temperature rise is approximately 80 to 120 C above ambient, which can exceed the 85 C commercial limit. For high-utilization designs, attach a 25 x 25 mm heatsink with thermal interface material, or provide 200 LFM forced airflow. Industrial-grade variants (I4) expand the operating envelope to 100 C but cost more and may have longer lead times.
Compliance Information
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable - commercial grade FPGA. Lead-free ball finish per 'N' suffix. REACH compliant. Conflict-minerals declaration available from Intel.
