EP3SE110F780C4LN - Stratix III E FPGA, 488 I/O, 780-FBGA | Intel
MPN: EP3SE110F780C4LN β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4129.66 | $4,129.66 |
| 5 | $3995 | $19,975.00 |
| 10 | $3870 | $38,700.00 |
| 25 | $3740 | $93,500.00 |
| 100 | $3450 | $345,000.00 |
EP3SE110F780C4LN Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O cells. Within the broader taxonomy, FPGAs sit under programmable logic devices -> digital ICs -> integrated circuits. The Stratix III E family specifically emphasizes enhanced DSP blocks, high-speed transceivers, and on-chip memory density, making it a mid-generation platform that bridges early Stratix II architectures and the later Stratix IV/Stratix V families.
Key features of the EP3SE110F780C4LN include the 780-FBGA footprint (29 mm x 29 mm typical), 4,300 LABs, 107,500 logic elements, 8,936,448 memory bits, 488 user I/O, and operating temperature range tailored for industrial (-40C to +85C). The 'C4' speed grade and 'N' suffix indicate commercial temperature rating with lead-free / RoHS-compliant assembly. The 780-ball FBGA package supports both 1.0 mm and 1.27 mm pitch variants per the Stratix III device handbook.
Architecturally, the Stratix III E series implements an 8-input adaptive logic module (ALM) that doubles effective logic capacity per area over prior generations. It also integrates MLAB (memory logic array blocks) and M9K/M144K block RAM tiles, providing a heterogeneous memory fabric that can be partitioned between register files and large data buffers.
Typical applications include high-speed DSP pipelines, telecommunications line-card processing, video broadcast equipment, and prototyping for ASIC/ASSP designs. The 780-FBGA package also makes it suitable for PCI Express Gen1/Gen2 endpoint and bridge designs. When designing with this device, ensure the Quartus II design suite (12.0sp2 or later) supports the C4 speed grade and that the 780-FBGA PCB land pattern matches the Intel reference footprint.
Drop-in alternatives for EP3SE110F780C4LN β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE110F780C4LN (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Process Technology, Embedded Memory.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SE110F780C4L
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View Datasheet βEP3SE110F780C4LN Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements (LE) | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| Embedded Memory | 8,936,448 bits |
| User I/O Pins | 488 |
| Package | 780-BBGA, FCBGA (Fine-pitch) |
| Supply Voltage Core | 0.9 V (typical) |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | C4 |
| Lead-Free / RoHS | Yes (N suffix) |
| Mounting Type | Surface Mount (SMT) |
| Process Technology | 40 nm TSMC |
| DSP Blocks | Yes (18x18 multipliers) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Tray Packaging | Yes (per distributor listings) |
EP3SE110F780C4LN 780-bbga, fcbga (fine-pitch) Pin Configuration Guide
Pin configuration for EP3SE110F780C4LN (780-bbga, fcbga (fine-pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE110F780C4LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE110F780C4LN is suitable for 6 applications: High-Speed DSP Pipeline Processing, Telecommunications Line-Card Processing, Video Broadcast Equipment, ASIC/ASSP Prototyping, PCI Express Bridge / Endpoint Designs, Test & Measurement Instrumentation.
High-Speed DSP Pipeline Processing
The EP3SE110F780C4LN's 107,500 logic elements and 4,300 LABs make it a strong fit for DSP-intensive pipelines such as radar baseband, beamforming, and channelization. The Stratix III E 18x18 multiplier blocks deliver hundreds of GMACs per second when fully utilized, while 8,936,448 bits of embedded memory absorb per-stage data buffers without external SRAM. The 780-FBGA package exposes 488 user I/O for high-fanout parallel datapaths running LVDS at 1+ Gbps. The 0.9 V core minimizes dynamic power during sustained 100+ MHz DSP workloads. Recommended companion MPNs include EP3C55F780C7 for auxiliary DSP boards and EP3SE110F1152I4N for larger sibling designs.
Recommended
Telecommunications Line-Card Processing
In telecom line cards, the EP3SE110F780C4LN serves as the central packet-processing engine, mapping its 107,500 LE to multi-channel framer/MAC/SAR pipelines. The 8,936,448-bit memory fabric implements deep packet FIFOs and lookup tables for OAM and QoS classification, while 488 user I/O expose UTOPIA/SPI-4/Interlaken-style parallel interfaces to PHY and switch ASICs. The 780-FBGA package preserves board area for high-density backplane designs, and the commercial C4 speed grade is sufficient for typical 200-300 MHz fabric clocking. Stratix III E is widely deployed in legacy line-card designs through 2026. Recommended companion MPNs: EP3C40F780C7 for sibling line cards, EP3CLS100F780C7 for power-constrained variants.
Recommended
Video Broadcast Equipment
Broadcast video routers and format converters benefit from the EP3SE110F780C4LN's substantial LE count, which absorbs wide SDI/HDMI multiplexing, audio embedding, and color-space conversion logic. The 488 user I/O accommodate multiple 3G-SDI streams at 2.97 Gbps plus ancillary data lanes, while 8.9 Mbits of block RAM buffer line-quincunx and frame-store data without external memory. The 780-FBGA enables compact ATCA/AMC boards with high pin density, and the C4 speed grade supports the >150 MHz internal fabric clocking typical of 3G-SDI pipelines. Compared to ASSP video crosspoints, this FPGA gives broadcasters reconfigurable matrix sizes. Recommended companion MPNs: EP3C40F780C7 for cost-optimized daughter cards and EP3C55F780C7 for mid-density variants.
Recommended
ASIC/ASSP Prototyping
The EP3SE110F780C4LN's 107,500 LE provide a faithful representation of mid-range ASICs in the 1M-3M gate class, making it a workhorse for pre-silicon validation. The 780-FBGA exposes ample GPIO for emulating multi-bus ASIC interfaces (PCIe, DDR2/3, SRIO, custom parallel), and the 8.9 Mbit block RAM emulates on-chip SRAM arrays. Quartus II supports pin-out migration to ASIC libraries, accelerating handoff. The commercial 0C-85C temperature grade suits lab and chassis environments; industrial variants require -40C+85C screens. Stratix III E prototyping has been the de facto choice for wireless baseband ASIC validation. Recommended companion MPNs: EP3SE110F1152I4N (industrial, larger FBGA) and EP3C80F780C7 (lower-density prototype).
Recommended
PCI Express Bridge / Endpoint Designs
The Stratix III E IP catalog includes hardened PCIe Gen1/Gen2 controllers that pair well with the EP3SE110F780C4LN's 488 user I/O for endpoint and root-port designs. The 107,500 LE implement protocol stacks, DMA engines, and application logic while 8.9 Mbits of block RAM back descriptor rings and payload buffers. The 780-FBGA keeps board real-estate tight for adapter cards; C4 speed grade supports PCIe Gen2 line rates. Compared to a discrete PCIe switch, this FPGA enables custom transaction-layer behaviors. Stratix III E PCIe is widely supported by Quartus II IP catalog. Recommended companion MPNs: EP3C40F780C7 for low-cost PCIe endpoint variants and EP3CLS70F780C7 for minimal PCIe implementations.
Recommended
Test & Measurement Instrumentation
In T&M equipment such as logic analyzers, protocol analyzers, and arbitrary waveform generators, the EP3SE110F780C4LN functions as the timing-critical capture/pattern generator engine. Its 488 user I/O support parallel probe channels at 1 Gbps+, while 107,500 LE implement deep state machines and trigger logic. 8.9 Mbits of block RAM buffer real-time trace data before DMA to the analysis software. The 780-FBGA package suits multi-board chassis instrumentation, and the C4 speed grade supports typical 300-400 MHz internal timing budgets. Compared to discrete timing-ASIC designs, this FPGA gives T&M vendors reconfigurable protocol support. Recommended companion MPNs: EP3C55F780C7 (lower-density T&M sibling) and EP3SE110F780C3N (higher speed bin variant).
Recommended
Recommended Products Summary
Engineering reference data for EP3SE110F780C4LN β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F780C4L | EP3SE110F780C4 | EP3SE110F780C3N | EP3SE110F780C3 | EP3SE110F780C2N | EP3SE110F780C2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| LABs | 4,300 | 4,300 | 4,300 | 4,300 | 4,300 | 4,300 | 4,300 |
| Embedded Memory (bits) | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C4 | C4 | C4 | C3 (faster) | C3 (faster) | C2 (fastest) | C2 (fastest) |
| Lead-Free / N Suffix | Yes (N suffix) | L suffix only (may be SnPb) | No L or N suffix | Yes (N suffix) | No L or N suffix | Yes (N suffix) | No L or N suffix |
Key Differentiators
- Highest logic density in the 780-FBGA Stratix III E family (vs EP3C55F780C7)
- Dedicated 18x18 multiplier DSP blocks at scale (vs EP3CLS100F780C7)
- Hard PCIe Gen1/Gen2 controller support via IP (vs EP3C40F780C7)
- Same-package C3/C2 speed bin upgrades available (vs EP3SE110F780C2N)
Design Notes
Stratix III E in 780-FBGA at full fabric utilization and 0.9 V core can dissipate 8-15 W depending on toggle rate and DSP activity. Estimate: with theta_JA of ~14 C/W (typical for 29 mm FBGA with thermal vias and airflow), a 12 W load yields a 168 C junction rise above 25 C ambient. For production deployments, use a thermal pad tied to an inner copper plane and ensure >100 LFM airflow, or consider heatsink attachment if chassis temperature exceeds 55 C. Industrial-grade variants (-40C to +85C ambient) require forced airflow above 70 C ambient.
The 780-FBGA ball pitch (typically 1.0 mm) requires a 4-6 layer PCB stack-up with buried vias and a 0.4 mm via-in-pad microvia stack for inner rows. Per Intel's Stratix III handbook, assign at least one solid ground plane beneath the device to provide a low-impedance return path for high-speed transceivers. Decoupling must include 0402-sized 0.1 uF X7R caps within 3 mm of every VCC pin, plus bulk 22 uF/47 uF polymer or tantalum caps on each voltage rail. Use differential via length-matching within 0.13 mm for LVDS pairs above 500 Mbps.
Common pitfalls when designing with EP3SE110F780C4LN include: (1) configuring unused user I/O as analog input rather than driving them to a defined logic level - this can cause leakage on internal pull-ups; (2) mixing voltage standards across I/O banks without configuring VREF per bank - always consult Quartus II Pin Planner warnings; (3) omitting the dedicated CONF_DONE and nCONFIG pull-ups on JTAG/AS configuration pins, leading to intermittent configuration failures; (4) ignoring MSL-3 floor life (168 hours) and baking at 125 C for 48 hours before rework to prevent popcorn cracking; (5) selecting C3/C2 speed bin parts in designs that were characterized for C4 - speed bin swaps require full STA re-run.
For multi-Gbps LVDS and SERDES signals, use a 100 ohm differential impedance with 85 ohm common-mode. Keep SERDES traces within 2 cm of the device edge; longer runs must be length-matched to within 0.05 mm and routed over a continuous reference plane. Avoid routing signals over plane splits - the Stratix III E transceivers require uninterrupted ground return paths. For DDR2/DDR3 interfaces, follow JEDEC JESD79-2F/JESD79-3-1A trace-length matching rules and use Fly-By topology for command/address lines on the EP3SE110F780C4LN with 488 I/O.
Compliance Information
The 'N' suffix indicates lead-free, RoHS-compliant ball finish per Intel/Altera part-numbering convention. Halogen-free status is not explicitly confirmed in verified data and marked unknown. AEC-Q100 is not applicable as this is a commercial-grade FPGA; industrial (-40C to +85C) variants exist as the EP3SE110F780I4-series in the Stratix III E family.
