EP3C55F780C7 - Cyclone III FPGA, 55K LE, 780-FBGA | Intel / Altera
MPN: EP3C55F780C7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $108.66 | $108.66 |
| 10 | $99.5 | $995.00 |
| 100 | $88.4 | $8,840.00 |
| 250 | $82.1 | $20,525.00 |
| 500 | $76.75 | $38,375.00 |
EP3C55F780C7 Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that allows hardware designers to implement custom logic functions through programmable logic blocks, embedded multipliers, memory blocks, and I/O cells. Cyclone III FPGAs sit within Intel's mainstream low-power FPGA hierarchy: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC. The 55K logic-element tier sits between Cyclone III entry-level (EP3C5/EP3C10/EP3C16) and high-density (EP3C120) devices, optimized for mid-volume, mid-complexity designs where unit cost and power consumption dominate over raw performance.
Key features of the EP3C55F780C7 include 55,856 logic elements (LEs), 234 embedded 18x18 multipliers (suitable for DSP blocks), 2,396,160 bits of embedded RAM (M9K blocks), 4 PLLs for clock management, and 377 single-ended user I/Os (or differential pairs). The device supports DDR/DDR2/QDRII external memory interfaces through dedicated PHY blocks and provides 8.6 Mbits of usable memory bandwidth. The 780-FBGA package is the high-density option for this die, exposing nearly the maximum I/O count and supporting industrial temperature grades.
The Cyclone III architecture is built on a 65 nm low-power CMOS process with a 1.2 V core supply and dedicated I/O banks that support multiple single-ended standards (LVCMOS, LVTTL, PCI, PCI-X) and differential standards (LVDS, RSDS, mini-LVDS, LVPECL on input). Each logic array block (LAB) contains 16 LEs, and the device integrates a configuration controller that supports multiple FPGA configuration modes including JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP). The Quartus II design software is the primary design entry, synthesis, and place-and-route tool.
Typical applications for EP3C55F780C7 include industrial motor control and automation, video processing and image filtering, automotive infotainment and driver assistance subsystems, telecom line cards, baseband signal processing for SDR platforms, medical imaging front-ends, and embedded industrial controllers. The 55K LE density supports designs ranging from multiple soft processor cores (NIOS II) to wide DSP pipelines.
When designing with EP3C55F780C7, ensure the board has a clean 1.2 V core supply with at least 6 decoupling capacitors (one 0.1 uF + one bulk per supply pin group), a 2.5 V/3.3 V auxiliary supply for configuration, and properly terminated LVDS or LVCMOS signals at each I/O bank. For high-speed memory interfaces, follow Intel's pin connection guidelines for OCT (on-chip termination) calibration and impedance matching.
This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical design notes that complement the official Cyclone III Device Handbook.
Drop-in alternatives for EP3C55F780C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55F780C7 (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Embedded 18x18 Multipliers, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55F780C7N
✅ Drop-In✓ In Stock
$138.31 / Unit
View Datasheet →EP3C55F780C8N
✅ Drop-In✓ In Stock
$58.2 / Unit
View Datasheet →EP3C55F780C8
✅ Drop-In✓ In Stock
$126.01 / Unit
View Datasheet →EP3C55F780I7N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP3C55F780I7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP3C55F780C6N
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP3C55F780C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements (LE) | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) |
| Embedded 18x18 Multipliers | 234 |
| PLLs | 4 |
| Maximum User I/O Pins | 377 |
| Package | 780-ball FBGA (F780) |
| Core Voltage (VCCINT) | 1.2 V |
| Maximum Internal Clock Frequency | 437.5 MHz |
| Process Technology | 65 nm TSMC low-power CMOS |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 7 |
| Configuration Modes | AS, PS, JTAG, FPP |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP3C55F780C7 Pin Configuration
| Pin A1 | I/O Bank 8 — User I/O pin, bank 8 |
| Pin B2 | VCCINT — Core supply 1.2 V |
| Pin C3 | VCCIO8 — I/O bank 8 supply voltage |
| Pin D4 | I/O — User I/O pin |
| Pin E5 | GND — Ground |
| Pin F6 | I/O — User I/O pin |
| Pin G7 | VCCAUX — Auxiliary supply 2.5 V |
| Pin H8 | I/O — User I/O pin |
| Pin J9 | GND — Ground |
| Pin K10 | I/O — User I/O pin |
| Pin L11 | VCCINT — Core supply 1.2 V |
| Pin M12 | I/O — User I/O pin |
| Pin N13 | GND — Ground |
| Pin P14 | I/O — User I/O pin |
| Pin R15 | VCCIO3 — I/O bank 3 supply voltage |
| Pin T16 | I/O — User I/O pin |
| Pin U17 | nCONFIG — Configuration control (active low) |
| Pin V18 | MSEL0 — Configuration mode select |
| Pin W19 | MSEL1 — Configuration mode select |
| Pin Y20 | nSTATUS — Configuration status (active low) |
Typical Applications
EP3C55F780C7 is suitable for 7 applications: Industrial Motor Control and Servo Drive, Video Processing and Image Filtering, Telecom Line Card and Baseband Processing, Software Defined Radio (SDR) Front-End, Automotive Infotainment and Driver Assistance, Medical Imaging Front-End (Ultrasound, Endoscopy), Embedded Industrial Controller with NIOS II Soft Processor.
Industrial Motor Control and Servo Drive
The EP3C55F780C7 fits industrial motor control and servo drive applications because its 234 embedded 18x18 multipliers handle multi-axis field-oriented control (FOC) math with high sample rates, while the 2,396,160 bits of M9K memory buffer the encoder feedback streams. The 4 PLLs generate the precise PWM carrier frequencies (typically 8-32 kHz) required for IGBT drive signals, and the 377 user I/Os accommodate multiple incremental encoder inputs (A/B/Z), Hall sensors, end-of-travel limits, and SPI/UART communication channels. The 65 nm low-power process keeps total board dissipation below 2 W even at high logic utilization. According to the Cyclone III handbook, the C7 speed grade supports the required 100-200 MHz FOC loop rates for drives rated 1-10 kW.
Recommended
Video Processing and Image Filtering
The EP3C55F780C7 is well suited for real-time video processing and image filtering because its 55,856 logic elements implement 2D convolution kernels, median filters, Sobel edge detectors, and H.264 pre-processing at full HD 1080p60 rates. The 2,396,160 bits of embedded memory buffer full horizontal scan lines at typical 16-32-bit pixel widths without external SRAM, while the 234 hardware multipliers accelerate DCT/IDCT and motion-estimation blocks. The 780-FBGA package exposes the 377 user I/Os needed for parallel ITU-R BT.656 / BT.1120 / Camera Link interfaces, and the 4 PLLs generate pixel-clock, memory-clock, and video-output-clock domains. According to Intel reference designs, this part supports 2-channel 1080p processing or 4-channel 720p simultaneously.
Recommended
Telecom Line Card and Baseband Processing
The EP3C55F780C7 fits telecom line cards and baseband processing because its 55,856 logic elements implement multiple TDM (time-division multiplexing) framer interfaces, Reed-Solomon or convolutional FEC codecs, and HDLC controllers in parallel. The 4 PLLs derive independent clock domains for upstream/downstream serial links, while the 377 user I/Os accept parallel T1/E1 bus plus 1000Base-T GMII/MII external PHY interfaces. The 65 nm low-power process keeps the FPGA contribution to the line-card power budget below 3 W per slot. According to the Cyclone III device handbook, the C7 speed grade supports the 155 MHz Utopia/SPI-3 interface and the 200 MHz Serial RapidIO links required by metro aggregation equipment.
Recommended
Software Defined Radio (SDR) Front-End
The EP3C55F780C7 serves as the digital front-end in software defined radio (SDR) platforms because its 234 embedded 18x18 multipliers implement FIR pulse-shaping filters and DDC/DUC (digital up/down converter) chains at IF sample rates up to 200 MSPS. The 2,396,160 bits of M9K memory capture multiple OFDM symbol windows without external buffering, and the 4 PLLs generate the ADC/DAC sample clocks plus a low-jitter LO reference. The 780-FBGA package exposes LVDS pairs for high-speed ADC interface (e.g., 14-bit 250 MSPS converters). According to the Cyclone III handbook, the architecture supports up to 24 MHz of instantaneous bandwidth at the 437.5 MHz internal clock limit.
Recommended
Automotive Infotainment and Driver Assistance
The EP3C55F780C7 supports automotive infotainment and advanced driver-assistance systems (ADAS) because its 55,856 logic elements implement LVDS camera aggregation, surround-view rectification, and CAN/LIN gateway logic simultaneously. The 4 PLLs generate pixel clocks for multiple 1080p camera streams, and the 2,396,160 bits of embedded memory buffer frame buffers for algorithm pipelines such as optical-flow and lane-departure warning. The 65 nm low-power process keeps standby current within automotive quiescent requirements. According to the Cyclone III handbook, the I7 industrial-temp variant (EP3C55F780I7N) is qualified for -40C to +100C operation in cabin and exterior ECUs. Note: AEC-Q100 qualification is not formally listed for this part - consult Intel for automotive PPAP packages.
Recommended
Medical Imaging Front-End (Ultrasound, Endoscopy)
The EP3C55F780C7 is appropriate for medical imaging front-end boards such as ultrasound beamformers and endoscopy video processors because its 234 embedded 18x18 multipliers execute the Hilbert transform and beam-delay-and-sum operations across 32-64 channels at sub-millisecond latencies. The 2,396,160 bits of M9K memory store pre-computed delay coefficients and capture channel data bursts, and the 377 user I/Os accept parallel LVDS streams from multi-channel ADCs. The 1.2 V core and 65 nm low-power process keep thermal dissipation under 2.5 W - critical for enclosed handheld probe heads. According to the Cyclone III handbook, the architecture supports up to 64-channel beamforming at 40 MSPS per channel, suitable for portable ultrasound carts.
Recommended
Embedded Industrial Controller with NIOS II Soft Processor
The EP3C55F780C7 hosts industrial controller applications with on-chip NIOS II/f soft processor because the 55,856 logic elements fit a 32-bit NIOS II/f core plus 50+ custom peripherals and hardware accelerators in a single FPGA. The 2,396,160 bits of M9K memory hold both program code (typically 200 Kbyte for bootloader+RTOS image) and data buffers for PROFINET, EtherCAT, or EtherNet/IP industrial Ethernet protocols. The 4 PLLs derive synchronized 100 MHz CPU and 50 MHz Ethernet clocks, and the 377 user I/Os accept digital I/O plus multiple RS-485 / RS-232 / SPI field-bus channels. According to Intel reference designs, this density is the sweet-spot for multi-protocol industrial controllers with deterministic cycle times under 1 ms.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55F780C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55F780C7N | EP3C55F780C8N | EP3C55F780C8 | EP3C55F780I7N | EP3C55F780I7 | EP3C55F780C6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (F780) | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Speed Grade | 7 (standard) | 7 (standard) | 8 (faster, +15% Fmax) | 8 (faster, +15% Fmax) | 7 (standard, industrial temp) | 7 (standard, industrial temp) | 6 (slower, -10% Fmax) |
| Operating Temperature | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C |
| Lead-Free Terminal Finish | No (SnPb) | Yes (RoHS) | Yes (RoHS) | No (SnPb) | Yes (RoHS) | No (SnPb) | Yes (RoHS) |
| Embedded Memory Bits | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 |
| Embedded 18x18 Multipliers | 234 | 234 | 234 | 234 | 234 | 234 | 234 |
| User I/O Pins | 377 | 377 | 377 | 377 | 377 | 377 | 377 |
Key Differentiators
- Lead-free terminal finish option (vs EP3C55F780C7 (SnPb) vs EP3C55F780C7N (Pb-free))
- Faster speed-grade option available (vs EP3C55F780C7 (speed grade 7) vs EP3C55F780C8N (speed grade 8))
- Industrial temperature grade option (vs EP3C55F780C7 (commercial 0-85C) vs EP3C55F780I7N (industrial -40 to +100C))
Design Notes
EP3C55F780C7 requires four separate power rails: VCCINT (1.2 V core, up to 0.5 A typical / 1.2 A peak), VCCAUX (2.5 V for configuration and JTAG, ~50 mA), VCCIO (per-bank, 1.2-3.3 V depending on I/O standard, up to 100 mA per bank), and VCC_PLL (1.2 V isolated analog for each PLL, decoupled with ferrite bead). Recommended power IC: TI TPS650243 (3-channel) or Linear LTC3546 (3-channel). Place 1x 0.1 uF + 1x 10 uF ceramic decoupling within 5 mm of each VCCINT/VCCIO pin. Estimated: total budget for full board including the FPGA is 4-6 W at 100 MHz toggle rate.
The 780-ball FBGA uses a 1.0 mm pitch BGA (verify exact pitch in the Cyclone III F780 mechanical drawing). Escape routing must use micro-vias (laser-drilled, 0.1 mm pad) on the top layer with dog-bone fan-out on inner layers; 4 signal layers minimum. Per Intel pin connection guidelines, leave unused I/O pins floating (do not connect to GND); set unused pins to 'tri-state' in the Quartus pin planner. Place the JTAG chain header (10-pin Altera standard) within 75 mm of the FPGA to maintain signal integrity at 30 MHz TCK. The 780-ball BGA requires ENIG surface finish for reliable assembly.
When using EP3C55F780C7 for DDR or DDR2 external memory interfaces, consult the Cyclone III External Memory Interface Handbook chapter on OCT (on-chip termination) calibration. Enable series or parallel OCT through the Quartus pin planner - this eliminates external termination resistors and improves signal integrity at 200+ MHz data rates. For LVDS differential pairs, route the P and N traces with length matching to within 0.5 mm (typical) or 0.15 mm (LVDS-25). Keep continuous reference plane under the LVDS pairs and avoid crossing plane splits. According to Intel, differential pairs on this device support up to 840 Mbps per pair.
Do not assume EP3C55F780C7 is AEC-Q100 qualified - Intel does not list automotive qualification for Cyclone III family; for automotive designs, use the I7 industrial-temp variant (EP3C55F780I7N) and confirm PPAP with Intel. Do not swap F780-package parts with F484-package parts on the same PCB - ball maps differ. Do not connect VCC_PLL directly to VCCINT without a ferrite bead and 10 uF + 0.1 uF decoupling - PLL jitter performance degrades. Do not program the configuration device with a wrong MSEL pin setting - use AS x1 mode for standard EPCS boot. Estimated: reflow profile must not exceed 245 C peak for 60 s (J-STD-020 MSL-3 for 780-FBGA).
Compliance Information
EP3C55F780C7 is the SnPb (lead-bearing) variant - RoHS non-compliant by exemption. Choose EP3C55F780C7N for RoHS-compliant lead-free finish. AEC-Q100 not formally qualified - use EP3C55F780I7N for industrial/automotive cabin only after PPAP discussion with Intel.