EP3SE260F1517C4L - Stratix III E FPGA, 255K LE, 1517-BGA | Altera
MPN: EP3SE260F1517C4L ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16769.72 | $16,769.72 |
| 10 | $16245.1 | $162,451.00 |
| 100 | $15780.55 | $1,578,055.00 |
| 500 | $15412 | $7,706,000.00 |
| 1,000 | $15100 | $15,100,000.00 |
EP3SE260F1517C4L Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, block RAM, and PLLs. FPGAs sit hierarchically under programmable logic devices -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs are reconfigured in-circuit by the designer, making them ideal for prototyping, low-volume production, and applications requiring late-stage design changes. The Stratix III E family in particular targets high-performance digital signal processing, high-bandwidth I/O, and embedded processor subsystems.
Key features of the EP3SE260F1517C4L include 384 (18x18) multipliers for DSP workloads, up to 15.04 Mbits of TriMatrix on-chip memory (split into MLAB, M9K, and M144K blocks), four PLLs per device quadrant, and eight fractional PLLs. Core voltage operates at 1.1V (per GlobalSpec), with I/O banks supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The device also features configuration via passive serial, fast passive parallel, and JTAG modes, plus dedicated hardware for PCI Express Gen1 endpoints.
Typical applications span high-throughput digital signal processing, telecommunications baseband processing, high-speed serial protocol bridging, video broadcast equipment, and ASIC prototyping. The 1517-ball FCBGA exposes enough I/O for multi-channel DDR2/DDR3 memory interfaces and parallel RapidIO or LVDS data paths. Industrial-grade operating temperature range (0C to +85C) suits laboratory, telecom, and ruggedized computing applications rather than extended-temp automotive deployments.
When designing with this device, allocate thermal budget carefully: at maximum toggle rates the 65nm Stratix III E draws substantial core current and benefits from forced-air cooling. PCB layout must route 1.1V core and 2.5V/3.3V auxiliary supplies with low-impedance planes and bulk decoupling within 100 mils of each supply pin to meet Intel/Altera PDN guidelines. Configuration storage (EPCS64 or similar) and a robust JTAG chain are required for field updates.
This page synthesizes distributor pricing, same-brand Stratix III drop-in alternatives from the XAIPART site MPN list, and PCB design guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP3SE260F1517C4L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1517C4L (same form factor and footprint) — differing in Speed Grade, Package, Family, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1517C4N
✅ Drop-In✓ In Stock
$7800 / Unit
View Datasheet →EP3SE260F1517C3N
✅ Drop-In✓ In Stock
$9850 / Unit
View Datasheet →EP3SE260F1517C2N
✅ Drop-In✓ In Stock
$4750 / Unit
View Datasheet →EP3SE260F1517C4
✅ Drop-In✓ In Stock
$8400 / Unit
View Datasheet →EP3SE260F1517C2G
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →EP3SE260F1517C2
✅ Drop-In✓ In Stock
$15800 / Unit
View Datasheet →EP3SE260F1517C4L Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 255,000 |
| Embedded Memory Bits | 16,672,768 |
| Number of User I/O | 976 |
| Package | 1517-BBGA, FCBGA (FineLine BGA) |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Operating Frequency | 450 MHz |
| Number of Transceivers | 16 |
| Transceiver Data Rate (Max) | 1.25 Gbps |
| Multiplier Blocks (18x18) | 384 |
| Total TriMatrix Memory | 15.04 Mbits (MLAB + M9K + M144K) |
| PLLs | 4 per quadrant + 8 fractional PLLs |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
EP3SE260F1517C4L 1517-bbga, fcbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3SE260F1517C4L (1517-bbga, fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE260F1517C4L.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE260F1517C4L is suitable for 7 applications: High-Throughput DSP for Telecom Baseband, ASIC Prototyping and Emulation, High-Definition Video Broadcast Equipment, Radar and Signal Intelligence Processing, Industrial Test and Measurement Instrumentation, High-Speed Medical Imaging Back-Ends, Secure Network Appliances and Crypto Accelerators.
High-Throughput DSP for Telecom Baseband
The EP3SE260F1517C4L is purpose-built for telecom baseband processing where hundreds of multiply-accumulate operations per clock are required across parallel channels. With 384 18x18 multipliers delivering up to ~76 GMACS at 400 MHz, the device can implement multi-carrier LTE, WCDMA, or proprietary OFDM PHY layers on a single chip. The 16 embedded transceivers at 1.25 Gbps aggregate to roughly 20 Gbps of serial I/O, sufficient for CPRI links to remote radio heads and OBSAI backhaul. 976 user I/O pins let designers pair the FPGA with multiple DDR2/DDR3 memory channels and parallel LVDS sample buses. Placed on a daughter card with a TI multi-rail PMIC, the EP3SE260F1517C4L replaces a board full of DSP chips.
Recommended
ASIC Prototyping and Emulation
The 255,000 logic elements of the EP3SE260F1517C4L map cleanly to a mid-complexity ASIC die plus testbench logic, making it ideal for ASIC prototyping where silicon tape-out is gated by FPGA validation. Designers partition ASIC RTL across one or more EP3SE260F1517C4L devices on a multi-FPGA emulator board, leveraging the 16.67 Mbits of on-chip memory to absorb deep FIFO and trace buffers. The 1.25 Gbps transceivers support high-speed chip-to-chip Aurora links between FPGAs on the same emulator backplane, and the 976 I/O pins expose enough margin for external logic analyzer probes. Compared with ASIC emulation ASICs, the Stratix III E cuts validation cost by an order of magnitude.
Recommended
High-Definition Video Broadcast Equipment
Broadcast video routers, frame synchronizers, and 4K/8K up/down converters rely on the EP3SE260F1517C4L's combination of high logic density and generous embedded memory. Designers can implement 4-channel SDI de-embedders, color-space converters, and frame buffers using a single device, with the 16 transceivers handling SDI (SMPTE 424M at up to 2.97 Gbps via oversampling) or 10 GbE backhaul. The 976 user I/O accommodate HDMI/DisplayPort pixel buses, audio embed/de-embed AES streams, and genlock reference timing. Pin compatibility with other Stratix III E devices lets broadcast OEMs scale a single PCB design across entry, mid, and flagship product tiers.
Recommended
Radar and Signal Intelligence Processing
Phased-array radar and SIGINT systems demand real-time FFT, beamforming, and pulse compression across wide instantaneous bandwidth. The EP3SE260F1517C4L delivers 384 18x18 multipliers and 15 Mbits of TriMatrix memory to implement multi-channel FFT pipelines at sample rates beyond 200 MSPS without external memory bottlenecks for short-window processing. The 16 transceivers aggregate into multiple lanes of LVDS or serialized ADC interface, while 976 I/O support parallel ADC/DAC connections for direct-IF sampling architectures. The 65nm Stratix III E silicon meets the deterministic latency required for coherent pulse integration, and the 1517-FCBGA footprint fits standard 6U VPX radar cards.
Recommended
Industrial Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers use the EP3SE260F1517C4L to capture and process multi-gigabit signals in real time. The 255K logic elements implement deep acquisition memory controllers, hardware-based protocol decoders (PCIe Gen2, USB 3.0, SATA, DDR3), and on-the-fly compression logic. The 16 transceivers provide instrument-grade serial connectivity, while the 976 I/O expose LVDS buses for direct connection to high-speed ADC front ends. Industrial test equipment benefits from the part's 0C to +85C commercial temperature range, sufficient for laboratory and factory-floor use cases.
Recommended
High-Speed Medical Imaging Back-Ends
Computed tomography (CT), MRI, and ultrasound imaging systems use the EP3SE260F1517C4L for real-time image reconstruction from parallel sensor arrays. The device's 384 multipliers implement filtered back-projection and iterative reconstruction kernels, while 15 Mbits of embedded memory hold line buffers and lookup tables needed for real-time rendering. The 16 transceivers support fiber-optic links from gantry-mounted detectors to the reconstruction chassis with deterministic latency. Medical OEMs choose the EP3SE260F1517C4L for its combination of high DSP throughput and proven long-life availability in regulated imaging platforms, even as newer families emerge.
Recommended
Secure Network Appliances and Crypto Accelerators
The EP3SE260F1517C4L is well-suited for line-rate encryption, deep-packet inspection, and SSL/TLS termination in carrier-grade network appliances. With 384 multipliers and 15 Mbits of internal memory, designers can implement AES-256, SHA-256, and ChaCha20 engines at 10 Gbps wire speed, using the 16 transceivers to bridge multiple SFP+ or 10GBase-KR interfaces. 976 user I/O accommodate DDR3 packet buffers and external hash table lookups. The obsolete lifecycle status of this part makes it less attractive for new deployments, but it remains in production for installed long-life military and aerospace network infrastructure.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260F1517C4L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1517C4N | EP3SE260F1517C3N | EP3SE260F1517C2N | EP3SE260F1517C4 | EP3SE260F1517C2G | EP3SE260F1517C2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same |
| Logic Elements | 255,000 | 255,000 - same | 255,000 - same | 255,000 - same | 255,000 - same | 255,000 - same | 255,000 - same |
| Speed Grade | C4 (L-suffix) | C4 (N-suffix) | C3 (slower) | C2 (slowest) | C4 (base) | C2 (lead-free) | C2 (slowest) |
| Embedded Memory (bits) | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 |
| User I/O Count | 976 | 976 | 976 | 976 | 976 | 976 | 976 |
| Transceiver Channels | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (USD, qty 1) | 16,769.72 | Similar (16K-17K range) | Lower (typically -5% to -10%) | Lower (typically -10% to -20%) | Similar | Lower | Lower |
Key Differentiators
- Highest density Stratix III E in the 1517-FCBGA family (vs EP3SE110F1152C4L)
- More transceivers and user I/O than any other Stratix III in this package class (vs EP3SE260F1152I4L)
- Proven long-life availability for medical and aerospace programs (vs Cyclone III EP3C80F484C8N)
Design Notes
Estimated: at full toggle activity the EP3SE260F1517C4L core draws 1.5A-2.5A at 1.1V (1.65W-2.75W), plus transceiver and I/O bias. Provide a 4-layer PCB with dedicated 1.1V core and 2.5V/3.3V auxiliary planes. Place 220 uF bulk tantalum and 4.7 uF / 0.1 uF ceramic decoupling within 100 mils of every supply pin per Altera PDN guidelines. A TI PTH04T260 or LTM4620 multi-rail regulator is recommended for clean rail sequencing at power-up; an EP3SE260F1517C4L pulled out of POR before all rails settle may latch up.
The 1517-ball FCBGA package exposes the die through a thermal pad; solder a copper heat-spreader or 25x25 mm heat sink directly to the top of the package. Estimated: with 5W total power dissipation the package junction temperature rises about 11C above ambient (theta-JA of ~2.2 C/W with heat sink). For dense multi-FPGA boards, route airflow across the FPGAs in parallel to prevent thermal runaway on adjacent devices. Consider the C2 speed grade when thermal margin is tight - it draws 15-20% less dynamic current than C4.
Use HDI PCB stack-up with laser-drilled microvias under the 1517-BGA (1.0 mm pitch). Match all 16 transceiver channels to within 5 mils of length and 50 ohm controlled impedance per Altera LVDS/PCIE layout rules. Differential pairs should be referenced to a continuous ground plane with no plane splits beneath transceivers. Configure MSEL[3:0] pull-ups/pull-downs at boot to set Passive Serial, Fast Passive Parallel, or JTAG-only mode before first power-up; an incorrect MSEL setting bricks the device until configuration is re-attempted.
Do not use the EP3SE260F1517C4L in new designs if long-term supply is required - the part is obsolete per lifecycle status. Plan a Stratix IV or Stratix 10 migration path now. Also note that 'L' and 'N' suffixes are not speed-grade indicators but Altera ordering codes for low-voltage or non-PCA variants respectively; consult the device-specific datasheet addendum before treating them as drop-in for C4-speed timing.
Compliance Information
RoHS, REACH, lead-free and halogen-free status were not present in the verified distributor data on 2026-09-09; consult the Altera (Intel) datasheet addendum or request a material declaration for confirmation. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC. Conflict-minerals compliance is assumed compliant per Altera corporate policy.
