EP3SE50F484C4N - Stratix III E FPGA, 47.5K LE, 484-FBGA | Altera
MPN: EP3SE50F484C4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $780.19 | $780.19 |
| 10 | $702.17 | $7,021.70 |
| 100 | $624.15 | $62,415.00 |
| 500 | $546.13 | $273,065.00 |
| 1,000 | $468.11 | $468,110.00 |
EP3SE50F484C4N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), which also include SPLDs and CPLDs. Compared to ASICs, FPGAs offer rapid prototyping and in-field reconfigurability, while modern high-end FPGAs like the Stratix III E integrate hard IP cores (transceivers, memory controllers, DSP blocks) that compete with mid-range DSP and ASSP devices in performance-per-watt. The Stratix III E family specifically targets high-speed parallel processing, telecom backplanes, and signal-processing applications.
Key features of the EP3SE50F484C4N include 47,500 logic elements, 5,760 Kbits embedded RAM, 1,900 LABs, 296 user I/O pins, and 4 PLLs for clock management. The device integrates dedicated DSP blocks optimized for high-speed arithmetic operations and supports multiple I/O standards including LVDS, LVPECL, HSTL, and SSTL for flexible board-level integration. Programmable via JTAG and supported by the Quartus II design suite, the device offers robust configuration options.
Architecturally, the Stratix III E FPGA uses Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables (LUTs), enabling efficient implementation of arbitrary logic functions. The 65 nm low-k dielectric process reduces power consumption by up to 50% compared to the previous Stratix II generation while maintaining timing margin. The device supports partial reconfiguration and dynamic phase alignment for clock domains.
Typical applications include high-performance digital signal processing (DSP), telecom baseband processing, high-speed serial protocol bridges, military radar and signal intelligence systems, ASIC prototyping, and high-throughput data acquisition. The 484-ball FC-FBGA package supports board densities required for industrial and aerospace signal-processing cards.
Designers should note the 484-ball BGA package requires careful PCB layout with microvia or via-in-pad technology, controlled-impedance routing, and matched-length differential pairs for LVDS interfaces. Power-rail decoupling must follow the Stratix III E PowerPlay early-power estimator guidelines to manage inrush current during configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the Stratix III E FPGA, providing engineering context not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP3SE50F484C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F484C4N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE50F484C3N
✅ Drop-In✓ In Stock
$832.1 / Unit
View Datasheet →EP3SE50F484C2N
✅ Drop-In✓ In Stock
$5934.83 / Unit
View Datasheet →EP3SE50F484C4
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP3SE50F484C4LN
✅ Drop-In✓ In Stock
$772.12 / Unit
View Datasheet →EP3SE50F484C4LG
✅ Drop-In✓ In Stock
$370.6 / Unit
View Datasheet →EP3SE50F484C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 47,500 |
| Number of LABs/CLBs | 1,900 |
| Total RAM Bits | 5,760 Kbit |
| Number of I/O | 296 |
| Number of PLLs | 4 |
| Maximum Operating Frequency | 450 MHz |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Package | 484-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| Supplier Device Package | 484-FBGA (23x23 mm) |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
EP3SE50F484C4N 484-fbga (23x23 mm) Pin Configuration Guide
Pin configuration for EP3SE50F484C4N (484-fbga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F484C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F484C4N is suitable for 6 applications: High-Performance DSP / FFT Processing, Telecom Baseband Processing, High-Speed Serial Protocol Bridge, ASIC Prototyping, Military Radar / Signal Intelligence, High-Throughput Data Acquisition.
High-Performance DSP / FFT Processing
The EP3SE50F484C4N fits high-performance DSP / FFT processing applications through its 47,500 logic elements and dedicated hardware DSP blocks capable of delivering up to ~300 GMACs of fixed-point throughput. According to the Stratix III Device Handbook, the integrated DSP blocks support 9x9, 18x18, and 36x36 multipliers with optional accumulator and chain-out modes, eliminating external DSP chips for radar and beamforming pipelines. The 5,760 Kbits of embedded RAM (M9K and M144K blocks) provide on-chip buffering for sliding-window FFTs without external memory roundtrips, while the 4 PLLs enable precise multi-clock-domain alignment for sample-rate conversion. For multi-antenna systems, the 296 user I/Os accommodate parallel LVDS data acquisition from multiple ADC channels with deterministic latency.
Recommended
Telecom Baseband Processing
Telecom baseband processing benefits from the EP3SE50F484C4N's balance of logic capacity, embedded memory, and flexible I/O. According to the Stratix III Device Handbook, the device's 450 MHz maximum operating frequency and dedicated hardware multipliers enable real-time implementation of Turbo, Viterbi, and LDPC decoders used in 3G/4G base stations. The 296 I/Os at LVDS/LVPECL speeds support multi-channel CPRI or OBSAI fronthaul links to remote radio heads without external transceivers, while embedded 5,760 Kbit RAM buffers baseband symbols between antenna-carrier processing stages. Four PLLs and 48 global clock networks provide clean clock distribution across high-speed parallel paths, critical for deterministic latency in TDD systems.
Recommended
High-Speed Serial Protocol Bridge
The EP3SE50F484C4N works well as a high-speed serial protocol bridge between incompatible communication standards (PCIe, Serial RapidIO, Gigabit Ethernet, custom LVDS). According to Altera documentation, the device's 296 user I/Os support multiple I/O standards simultaneously, with dedicated SERDES-style logic available through soft IP cores for line rates up to 3.75 Gbps per channel. Embedded RAM and abundant logic resources enable on-the-fly protocol conversion, header parsing, and packet buffering without external memory in many bridging scenarios. The 484-FBGA package provides sufficient signal integrity for high-speed serial interfaces when PCB stack-up and length matching follow Stratix III guidelines.
Recommended
ASIC Prototyping
The EP3SE50F484C4N is suitable for ASIC prototyping due to its large logic capacity, abundant memory, and high I/O count that map well to mid-complexity ASIC designs. According to the Stratix III handbook, the 47,500 LE count plus 5,760 Kbit embedded RAM can hold ASIC blocks up to ~5M gates for functional verification before tape-out. The device supports JTAG configuration and partial reconfiguration via the Quartus II toolchain, allowing rapid design iteration. Engineers typically use the EP3SE50F484C4N to validate ASIC RTL, run real-world firmware, and characterize signal-integrity at the prototype stage, reducing the risk of post-silicon ASIC rework.
Recommended
Military Radar / Signal Intelligence
The EP3SE50F484C4N serves military radar and signal intelligence (SIGINT) systems through its high logic density, embedded DSP blocks, and ability to operate across wide temperature ranges when the industrial 'I' speed grade variant is chosen. According to the Stratix III handbook, the 47,500 LE count supports real-time phased-array beamforming, pulse compression, and Doppler processing for radar front-ends. Hardware DSP blocks accelerate complex FFT and correlation kernels, while 5,760 Kbit embedded memory buffers wide-bandwidth ADC samples without external buffering. For defense applications requiring MIL-STD-810 environmental compliance, the EP3SE50F484I4N industrial variant provides -40C to +100C operation in the same 484-FBGA footprint.
Recommended
High-Throughput Data Acquisition
The EP3SE50F484C4N suits high-throughput data acquisition systems used in scientific instruments, medical imaging, and industrial test equipment. According to the Stratix III handbook, the 296 user I/O count supports simultaneous sampling from multiple high-speed ADCs at LVDS or LVPECL rates, with the device's 4 PLLs providing the low-jitter clocks critical for maintaining ADC SNR. Embedded 5,760 Kbit RAM buffers acquired samples for real-time preprocessing - FFT, decimation, or filtering - before DMA to host processors. The 484-FBGA package enables compact board layouts for portable or space-constrained acquisition cards in industrial and laboratory settings.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F484C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F484C3N | EP3SE50F484C2N | EP3SE50F484C4 | EP3SE50F484C4LN |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | C4 | C3 (-1 bin) | C2 (-2 bins) | C4 (same) | C4 (same) |
| Total RAM Bits | 5,760 Kbit | 5,760 Kbit | 5,760 Kbit | 5,760 Kbit | 5,760 Kbit |
| User I/O Count | 296 | 296 | 296 | 296 | 296 |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
Key Differentiators
- Highest speed grade in the EP3SE50F484 family (vs EP3SE50F484C3N)
- Identical pinout to all EP3SE50F484 speed-grade variants (vs EP3SE110F1152C4N)
- Lead-free and RoHS-compliant (N suffix) for modern designs (vs EP3SE50F484C4 (non-N variant))
Design Notes
The 484-ball FC-FBGA uses 1.0 mm ball pitch and requires microvia or via-in-pad PCB technology to escape the inner balls. According to the Stratix III Device Handbook, a 1-2-1 or 1-3-1 stack-up with low-loss dielectric is recommended for LVDS signal integrity at >500 MHz. Matched-length routing within 50 mils is required for differential pairs.
Use the Quartus II PowerPlay Early Power Estimator before tape-out to size the 1.1 V VCCINT and 2.5 V/3.3 V VCCIO regulators. According to Altera's Stratix III power guidelines, a typical EP3SE50F484 design consumes 3-8 W depending on toggle rate and DSP utilization; design VCCINT decoupling for at least 20 A peak inrush during configuration.
The 484-FBGA package has a theta-JA of approximately 12-15 C/W with a properly designed thermal via array under the package. According to Stratix III layout guidelines, place a 6x6 thermal via grid (0.3 mm via diameter, 1.0 mm pitch) directly beneath the package's central thermal pad to maintain junction temperature below 100C at maximum power dissipation.
Do not confuse the EP3SE50F484C4N (commercial) with the EP3SE50F484I4N (industrial). According to Altera's part-numbering convention, the 'C' vs 'I' designator determines the operating temperature range; substituting one for the other in harsh-environment designs can cause thermal failure. Also verify configuration mode (AS, PS, JTAG) matches your board's boot PROM interface.
Compliance Information
EP3SE50F484C4N includes 'N' suffix per Altera ordering convention indicating lead-free / RoHS-compliant assembly, but official RoHS, REACH, and halogen-free status were not provided in verified web data and should be verified via the Intel Product Compliance page.
