EP3SE50F780I4G - Stratix III E FPGA 47.5K LE 780-FBGA | Intel
MPN: EP3SE50F780I4G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1600 | $160,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP3SE50F780I4G Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and embedded memory that can be re-programmed to implement arbitrary digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA, providing higher logic density and richer IP than CPLDs. Stratix III E devices target high-performance digital signal processing, memory-intensive processing, and high-speed serial interconnect.
Key features include 488 user I/Os, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) through dedicated I/O banks, embedded transceivers for high-speed serial protocols, dedicated DSP blocks for fixed- and floating-point math, and up to 5.76 Mbits of embedded RAM (tri-memory distributed + block RAM + MLAB). The device supports configuration via JTAG, passive serial, fast passive parallel, and active serial schemes.
The EP3SE50F780I4G is built on a 40 nm low-power CMOS process with 12-layer metal interconnect, leveraging Stratix III's programmable power technology (PPT) that dynamically adjusts logic and interconnect performance to reduce dynamic power. Programmable Power Technology combined with hard IP for PCI Express Gen1/Gen2, multi-port memory controllers (DDR/DDR2/DDR3) and 8B/10B encoder/decoder blocks lets designers target >1 GHz internal core frequencies and >6 Gbps transceiver rates while reducing system cost and power.
Typical applications include high-end wireline communication line cards, wireless baseband processing, military and aerospace signal processing, ASIC prototyping, high-performance test and measurement, broadcast video processing, and high-port-count networking line cards where parallel processing and high memory bandwidth are required simultaneously.
When designing with this part, pay close attention to power architecture: at full utilization the Stratix III E50 can exceed 20 W, demanding a 1.1 V core regulator sized for 25 A+ load and a thermally aware PCB with at least 8+ thermal vias under the BGA thermal balls. The FBGA-780 land pattern requires 1.00 mm or 1.27 mm ball pitch and a reflow profile that complies with JEDEC J-STD-020.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving you actionable procurement and engineering guidance.
Drop-in alternatives for EP3SE50F780I4G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F780I4G (same form factor and footprint) — differing in Package, Family, Speed Grade, Adaptive Logic Modules (ALMs), RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE50F780I4N
✅ Drop-In✓ In Stock
$1295 / Unit
View Datasheet →EP3SE50F780I4
✅ Drop-In✓ In Stock
$1195 / Unit
View Datasheet →EP3SE50F780I3N
✅ Drop-In✓ In Stock
$1550 / Unit
View Datasheet →EP3SE50F780I3G
✅ Drop-In✓ In Stock
$1082.02 / Unit
View Datasheet →EP3SE50F780I3
✅ Drop-In✓ In Stock
$1245.75 / Unit
View Datasheet →EP3SE50F780C4N
✅ Drop-In✓ In Stock
$1430 / Unit
View Datasheet →EP3SE50F780I4G Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 ALM |
| Embedded Memory | 5,760,000 bit (5.49 Mbit) |
| Maximum User I/Os | 488 I/O |
| Package | 780-ball FBGA (FCBGA) |
| Mounting Type | Surface Mount |
| Operating Supply Voltage (Core) | 1.1 V |
| Operating Temperature Range | -40C to +100C (Industrial) |
| Speed Grade | I4 |
| Configuration Method | JTAG, Passive Serial, FPP, Active Serial |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3SE50F780I4G 780-ball fbga (fcbga) Pin Configuration Guide
Pin configuration for EP3SE50F780I4G (780-ball fbga (fcbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F780I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F780I4G is suitable for 6 applications: High-Speed Wireline Communication Line Card, Wireless Baseband Processing, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, Broadcast Video Processing and Display Walls, Test and Measurement Instrumentation.
High-Speed Wireline Communication Line Card
The EP3SE50F780I4G is well suited for high-port-count wireline line cards where 488 user I/Os and embedded high-speed transceivers deliver multi-gigabit SerDes for SONET/SDH, OTN, and Ethernet aggregation. Its 19,000 ALMs handle packet classification and queuing at line rate, while 5.49 Mbits of block RAM absorb bursts without off-chip memory round trips. Designers typically pair it with DDR3 memories via dedicated multi-port controllers and pin it to external PHY devices via LVDS or HSTL I/O. Compared with ASIC turn-around times of 12+ months, an FPGA solution compresses time-to-market and supports late protocol changes.
Recommended
Wireless Baseband Processing
The Stratix III E50's dedicated DSP blocks accelerate FIR filters, FFTs, and channelization functions for LTE and WiMAX baseband cards. Its 488 user I/Os interface to ADC/DAC devices (such as the AD9125 or AD6655) on the RF chain, while embedded transceivers handle backhaul links to base-station controllers. Industrial -40C to +100C temperature range supports outdoor cabinet deployments. The 1.1 V core operates at >1 GHz internal frequency, enabling real-time processing of multiple spatial streams in MIMO systems.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP3SE50F780I4G as a building block in multi-FPGA ASIC prototyping platforms where 47,500 LEs emulate RTL blocks and run validation suites hundreds of times faster than simulation. The 780-ball FCBGA exposes enough I/O for chip-to-chip interconnect between multiple FPGAs on the same prototyping board. The 5.49 Mbit on-chip memory models common memory blocks; the I4 speed grade provides comfortable timing closure. Quartus II synthesis fits typical SoC subsystems with proper partitioning, and the Stratix III device handbook provides MIB-based timing constraints.
Recommended
Military and Aerospace Signal Processing
Industrial-grade Stratix III E50 devices are qualified for many defense applications requiring -40C to +100C operation, tolerance to single-event upsets, and long-term lifecycle support. The 488 user I/Os accommodate sensor arrays and high-speed analog interfaces, while embedded DSP blocks implement radar pulse compression, MTI filtering, and FFTs for SIGINT and ELINT systems. The mature-program status of Stratix III E provides supply stability for 15+ year defense lifecycles. Designers should add watchdog and ECC for safety-critical signal processing chains.
Recommended
Broadcast Video Processing and Display Walls
The EP3SE50F780I4G's 488 user I/Os and 5.49 Mbits of block RAM support multi-stream video processing at resolutions up to 4K, including scaling, color-space conversion, and genlocking. Dedicated DSP blocks accelerate motion-estimation for deinterlacing and frame-rate conversion in broadcast studio equipment. The 1.1 V core power scales well with utilization, and Stratix III's Programmable Power Technology reduces dynamic power during low-load periods. Industrial temperature range fits deployment in outdoor broadcast trucks and stadium signage.
Recommended
Test and Measurement Instrumentation
The Stratix III E50 is a workhorse for high-end oscilloscopes, logic analyzers, protocol analyzers, and BERT equipment, where 488 user I/Os feed multi-channel ADCs and high-speed sample buffers. The 5.49 Mbit embedded RAM holds deep acquisition memories and trigger histories without round-tripping to external memory, while DSP blocks implement real-time FFTs and protocol decoding. Industrial temperature range supports benchtop and production-line test fixtures. Designers can re-spin measurement IP to track evolving serial-bus standards such as USB 3.0, SATA III, and 10G Ethernet.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F780I4G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F780I4N | EP3SE50F780I4 | EP3SE50F780I3N | EP3SE50F780I3G | EP3SE50F780I3 | EP3SE50F780C4N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-780 (F780, FCBGA) | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE |
| Speed Grade | I4 (industrial) | I4 | I4 | I3 (faster, +10 to +15%) | I3 (faster, +10 to +15%) | I3 (faster, +10 to +15%) | C4 (commercial temp, I4 speed) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) |
| User I/Os | 488 I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Embedded Memory | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit |
| Lead-Free Finish | Yes (G suffix, halogen-free) | Pb-bearing finish (N suffix) | Yes | Pb-bearing finish | Yes (G suffix, halogen-free) | Yes | Pb-bearing finish |
| Price (USD, qty 1) | $1,850 | ~$1,800 | ~$1,820 | ~$2,150 | ~$2,180 | ~$2,150 | ~$1,650 |
Key Differentiators
- Same-die pin-compatible family across six orderable codes (vs EP3SE50F780I3N)
- Industrial -40C to +100C temperature range (vs EP3SE50F780C4N)
- Pb-free halogen-free finish (G suffix) (vs EP3SE50F780I4N)
Design Notes
Estimated: at full design utilization with high toggle rates, the EP3SE50F780I4G draws approximately 18 to 22 W from the 1.1 V core rail. Size the 1.1 V regulator for at least 25 A continuous load and follow Stratix III PDN guidelines with high-density ceramic decoupling placed directly under the FBGA-780 thermal balls. Multi-rail power architecture is mandatory: 1.1 V core, 2.5 V PLL analog, plus independent 1.2/1.5/1.8/2.5/3.3 V I/O rails switched by the Sequencer logic. Power sequencing must follow the Stratix III power-up sequence to avoid latch-up.
The FBGA-780 exposes dedicated thermal balls on the bottom of the package. Place at least 8 thermal vias (0.3 mm drill, 1.0 mm pitch) directly under the thermal ball array and connect them to a 2-oz copper inner-plane thermal relief pad. Without proper thermal management, junction temperature can exceed 100C at typical industrial loading. Use a thermal interface material (TIM) plus heatsink for >15 W designs, or design a copper pour of at least 6 square inches on top side for convection cooling.
The FBGA-780 land pattern uses 1.00 mm ball pitch. Route signals in stripline or microstrip geometry with controlled 50-ohm impedance, and target a maximum stackup of 8 layers with continuous GND plane adjacent to all signal layers. Length-match differential pairs to within 5 mil for LVDS, 20 mil for DDR3. Decoupling must include 0.1 uF and 0.01 uF ceramics at every device pin group plus 100 uF and 470 uF bulk capacitors within 1 cm of the FBGA. Keep at least 3 reference vias per power/ground pad.
Choose configuration mode based on boot time: Active Serial (AS) with EPCS16/EPCS64/EPCQ64 devices provides fastest 100 ms boot from flash but is limited by serial bandwidth. Fast Passive Parallel (FPP) with a parallel flash (28F256) achieves <50 ms configuration. JTAG is reserved for prototype development only. Always include a 4.7 kohm pull-up on nCONFIG and a 1 kohm pull-up on nSTATUS to ensure stable configuration. Program the EPCS/EPCQ device with Quartus II programmer.
Do not connect unused I/O banks; configure them as tri-stated in your Quartus II pin planner. Floating I/O inputs on Stratix III can draw tens of milliamps and inject noise into the substrate. Avoid running the 1.1 V core above 1.13 V or below 1.07 V; undervoltage can corrupt configuration flash. Use the SignalTap II logic analyzer integrated with Quartus II to debug in-system, and add CRC-based soft-error detection for mission-critical applications.
Compliance Information
The 'G' suffix in EP3SE50F780I4G denotes Pb-free and halogen-free finish. RoHS-compliant per Intel product page. Not AEC-Q100 qualified; the part is qualified to JEDEC industrial standards rather than automotive.
