EP3SL70F780I4LG - Stratix III L FPGA 67.5K LE 780-FBGA | Altera
MPN: EP3SL70F780I4LG ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $550.95 | $550.95 |
| 10 | $525 | $5,250.00 |
| 50 | $495 | $24,750.00 |
| 100 | $470 | $47,000.00 |
| 500 | $425 | $212,500.00 |
EP3SL70F780I4LG Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM (BRAM), transceivers, and PLLs. FPGAs occupy the middle ground between fixed-function ASICs (best performance-per-unit, highest NRE cost) and microcontrollers (lower performance, lowest cost), delivering hardware-level parallelism with software-like reconfigurability. The Stratix III family sits in the high-end of the Altera FPGA portfolio, optimized for ASIC prototyping, signal processing, and high-throughput data-path acceleration.
Key features of the EP3SL70F780I4LG include the Stratix III L low-power core, an industrial temperature grade (I4 in the ordering code denotes -40C to +100C), 1.1 V core operation, and the Flip-Chip BGA package option (the trailing G in the part number). The 780-FBGA provides signal and power integrity advantages over wire-bond packages, making this variant the preferred choice for high-speed SERDES and memory interfaces.
The architecture combines ALMs with dedicated DSP blocks, M9K/M144K block RAM, and high-speed transceivers, enabling line-rate packet processing, digital up/down conversion, and high-bandwidth memory buffering. Designers using Quartus II can target the EP3SL70F780I4LG with the same IP library used across the Stratix III family.
Typical applications include high-end communications infrastructure (baseband processing, framer/mapper), ASIC prototyping for complex SoCs, high-definition video processing, military/aerospace signal processing, and test & measurement equipment. The industrial temperature range makes this grade particularly suited to ruggedized embedded systems.
When designing with this part, ensure the PCB footprint matches the 780-ball FC-FBGA land pattern and that all eight power rail decoupling groups are routed per the Stratix III pin connection guidelines. Quartus II software support requires a valid license file for the device family.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical design notes that go beyond the manufacturer datasheet to accelerate component selection and PCB bring-up.
Drop-in alternatives for EP3SL70F780I4LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F780I4LG (same form factor and footprint) — differing in Package, Embedded Memory, Process Technology, Series, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL70F780I4L
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1150 / Unit
View Datasheet →EP3SL70F780I4G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1455 / Unit
View Datasheet →EP3SL70F780I4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1850 / Unit
View Datasheet →EP3SL50F780I4LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1895 / Unit
View Datasheet →EP3SL50F780I4L
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$695.09 / Unit
View Datasheet →EP3SE50F780I4LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2380 / Unit
View Datasheet →EP3SL70F780I4LG Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 67,500 LE |
| Adaptive Logic Modules (ALMs) | 27,000 ALM |
| Embedded Memory | 2.57 Mbit |
| Number of I/Os | 488 I/O |
| Core Voltage | 1.1 V |
| Operating Temperature | -40C to +100C (Industrial, I4) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) |
| Process Technology | 40 nm |
| Mounting Style | SMD/SMT |
| Number of Logic Array Blocks (LABs) | 2700 |
| Total Block RAM Bits | 2,699,264 bits |
| DSP Blocks | Present (refer to device handbook) |
| RoHS Status | Compliant |
| Ordering Code Suffix 'G' | Indicates Flip-Chip BGA package |
EP3SL70F780I4LG 780-bbga, fcbga (flip-chip) Pin Configuration Guide
Pin configuration for EP3SL70F780I4LG (780-bbga, fcbga (flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL70F780I4LG.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL70F780I4LG is suitable for 6 applications: ASIC Prototyping, High-Speed Signal Processing, High-Definition Video Processing, Communications Infrastructure (Baseband Processing), Test & Measurement Equipment, Military/Aerospace Embedded Systems.
ASIC Prototyping
The EP3SL70F780I4LG's 67,500 logic elements and 27,000 ALMs provide sufficient density to map mid-complexity ASIC RTL into a Stratix III for pre-silicon validation. Engineers typically prototype multi-million-gate ASICs by partitioning across multiple Stratix III FPGAs using the company's proven FPGA-internal partitioning methodology. The 488 user I/Os allow mapping of wide on-chip buses and external interfaces for realistic system-level validation before committing to silicon.
Recommended
High-Speed Signal Processing
Stratix III L FPGAs like the EP3SL70F780I4LG integrate dedicated DSP blocks and high-speed transceivers suited to digital up/down conversion, FIR filtering, and radar baseband processing. The 40 nm low-power process reduces thermal load in densely packed DSP pipelines. Industrial temperature grade (-40C to +100C) supports deployment in outdoor base-station or ruggedized defense signal-processing units where thermal headroom is limited.
Recommended
High-Definition Video Processing
With 2.57 Mbit of embedded block RAM and 488 I/Os, the EP3SL70F780I4LG can drive multi-stream HD video processing pipelines including scaling, deinterlacing, and overlay composition. The on-chip M9K/M144K RAM provides line buffers and frame store for real-time processing without external memory pressure. Industrial temperature grade suits professional broadcast equipment and digital signage controllers operating in uncontrolled thermal environments.
Recommended
Communications Infrastructure (Baseband Processing)
The EP3SL70F780I4LG is well matched to LTE/WiMAX baseband processing where high logic density meets stringent power budgets. The Stratix III L family provides hardened PHY interfaces and DSP blocks optimized for FFT/FIR operations fundamental to OFDM modulation/demodulation. Industrial temperature grade supports outdoor remote-radio-head (RRH) deployments where the device must operate across a wide thermal envelope.
Recommended
Test & Measurement Equipment
Test and measurement instruments often demand flexible, high-density logic with deterministic timing. The EP3SL70F780I4LG's 67.5K LE allow designers to implement multi-channel arbitrary waveform generators, real-time protocol analyzers, or logic analyzer back-ends. The 488 I/Os support wide parallel capture buses, and the industrial temperature range enables bench and field-deployed instrument operation across varied conditions.
Recommended
Military/Aerospace Embedded Systems
The industrial temperature grade of EP3SL70F780I4LG combined with the 780-ball FC-FBGA package's excellent thermal and electrical performance makes it suitable for ruggedized military and aerospace signal-processing systems. Stratix III L FPGAs have a long history in defense applications requiring logic density, on-chip DSP, and reliability under extreme temperature conditions. PCB designers must follow Altera's pin connection guidelines carefully for shock/vibration conformance.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F780I4LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F780I4L | EP3SL70F780I4G | EP3SL70F780I4 | EP3SL50F780I4LG | EP3SL50F780I4L | EP3SE50F780I4LG |
|---|---|---|---|---|---|---|---|
| Package | 780-BBGA FCBGA | 780-BBGA - same | 780-BBGA - same | 780-BBGA - same | 780-BBGA - same | 780-BBGA - same | 780-BBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 67,500 LE | 67,500 LE | 67,500 LE | 67,500 LE | 50,000 LE (-26%) | 50,000 LE (-26%) | 50,000 LE (-26%) |
| ALMs | 27,000 ALM | 27,000 ALM | 27,000 ALM | 27,000 ALM | 20,000 ALM (-26%) | 20,000 ALM (-26%) | 20,000 ALM (-26%) |
| Embedded Memory | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit | 2.27 Mbit (-12%) | 2.27 Mbit (-12%) | 3.10 Mbit (+21%) |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Sub-Family | Stratix III L (Low Power) | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (Enhanced) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Industrial | Industrial | Industrial |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest logic density in 780-ball FC-FBGA Stratix III L family (vs EP3SL50F780I4LG)
- Industrial temperature grade in low-power sub-family (vs EP3SE50F780I4LG (Stratix III E))
- Flip-chip BGA packaging for high-speed signal integrity (vs EP3SL70F780I4L (without G suffix))
Design Notes
The EP3SL70F780I4LG requires multiple supply rails: 1.1 V core, plus I/O bank voltages (typically 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V) selected per bank. Decoupling per the Stratix III pin connection guidelines is critical: place 0.1 uF X7R capacitors within 100 mils of every VCC pin group, with bulk 22-47 uF tantalum or polymer caps distributed around the package. Estimating ~1.5-2.5 W quiescent for a 67.5K LE design at 1.1 V with moderate toggle rate, ensure the PCB copper plane and via array can sink 3-5 W continuous.
The 780-ball FC-FBGA package has a 0.8 mm or 1.0 mm ball pitch (refer to device-specific package drawing). Use microvia-in-pad or HDI PCB technology; standard 4-layer stack-ups with 8-mil laser-drilled vias and 4-mil traces are typical. Match trace lengths within each bank to meet DDR/DDR2/DDR3 memory interface timing. A continuous ground plane beneath the package is mandatory for return-current continuity and thermal spreading.
Estimated junction temperature rise at 2 W dissipation in a JEDEC JESD51-7 still-air test environment: with a typical theta_JA of 12-18 C/W for a 780-ball FC-FBGA on a 4-layer JEDEC board, the junction rises approximately 24-36 C above ambient. For industrial temperature grade operation up to +100C ambient, derate the FPGA's utilization (toggle rate, logic density) to keep Tj below +125C. A thermal copper pour or heatsink may be required for high-utilization designs.
Do not assume all Stratix III 780-ball parts share identical pinouts - signal and power pin assignments differ between EP3SL70, EP3SL50, and EP3SE50 variants despite the same package. Always verify the pinout against the device-specific .pin file in Quartus II before PCB layout finalization. Also, the configuration scheme (AS, AP, PS, FPP) requires matching MSEL pin strap resistors - leaving MSEL floating is a common bring-up failure mode.
Place configuration flash (EPCQ256 or compatible) within 1 inch of the FPGA's dedicated configuration pins to minimize signal integrity issues. Use parallel termination on high-speed transceiver differential pairs per the Stratix III transceiver guidelines. Keep PLL analog supply (VCCA_PLL) isolated from digital switching noise with a dedicated LC filter network.
Compliance Information
RoHS and REACH compliant per Altera/Intel product environmental specifications. Lead-free (Pb-free) per JEDEC J-STD-020 reflow compatibility. Halogen-free status not explicitly listed in retrieved data - request certificate from Intel compliance portal if required. Industrial temperature grade -40C to +100C is NOT equivalent to AEC-Q100 automotive qualification; this part is not AEC-Q100 qualified.
