EP3SL340F1517C2N - Stratix III L FPGA 337.5K LE 1517-FCBGA | Intel
MPN: EP3SL340F1517C2N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18500 | $18,500.00 |
| 10 | $17200 | $172,000.00 |
| 100 | $15800 | $1,580,000.00 |
| 500 | $14500 | $7,250,000.00 |
| 1,000 | $13200 | $13,200,000.00 |
EP3SL340F1517C2N Overview
An FPGA (Field Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks, programmable interconnects, and dedicated hardware resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the hierarchy of programmable logic devices (PLD) alongside CPLDs and are the densest members, used to implement custom parallel datapaths, protocol bridges, signal-processing pipelines, and ASIC prototyping. The Stratix III L sub-family is the lower-static-power variant of Stratix III, optimized for power-sensitive applications without sacrificing logic density or DSP capability.
Key features of the EP3SL340F1517C2N include 384 18x18 multipliers (configurable as 192 36x36 multipliers) for high-throughput DSP workloads, fractional PLLs for multi-domain clock generation, programmable power technology that dynamically tunes logic and routing quiescent power, and partial reconfiguration support. The 1517-ball FCBGA package provides substantial I/O bandwidth for memory, networking, and parallel bus interfaces, while the C2 speed grade and 0 °C to +85 °C commercial operating temperature envelope target mainstream embedded and compute-acceleration platforms.
The architecture uses 8-input adaptive look-up tables (ALUTs) inside ALMs, delivering roughly 1.4x the logic capacity of a comparable Stratix II design at lower power. Combined with dedicated hard IP for PCI Express Gen1/Gen2, multiple 10/100/1000 Ethernet MACs, and high-speed DDR3 memory controllers (via soft IP), the EP3SL340F1517C2N is well suited for telecom line cards, military radar, medical imaging, and high-end ASIC prototyping.
Typical applications include digital signal processing, high-speed data acquisition, software-defined radio (SDR), video and image processing, network packet processing, and ASIC/ASSP emulation. It is also deployed in aerospace and defense beamforming systems and in industrial machine vision where parallel processing throughput outweighs the cost-per-volume penalty of an FPGA.
When designing with this device, pay close attention to power integrity - the FCBGA's high I/O count demands a fully balled power/ground array and multiple decoupling tiers (0402/0201 ceramics plus bulk polymer). Use Altera's PowerPlay early power estimator and the Quartus II design tools (now Intel Quartus Prime) for place-and-route, timing closure, and SignalTap logic analysis.
This page synthesizes distributor pricing, parametric history, drop-in same-family alternatives, and practical design notes that are not aggregated on any single distributor listing for the EP3SL340F1517C2N.
Drop-in alternatives for EP3SL340F1517C2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340F1517C2N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL340F1517C2
✅ Drop-In✓ In Stock
$3050 / Unit
View Datasheet →EP3SL340F1517C3N
✅ Drop-In✓ In Stock
$3750 / Unit
View Datasheet →EP3SL340F1517C4N
✅ Drop-In✓ In Stock
$7044.96 / Unit
View Datasheet →EP3SL340F1517I4N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP3SL200F1517C2N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SL340F1517C2N Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Family | Stratix III L (low-static-power) |
| Process Technology | 65 nm CMOS |
| Logic Elements | 337,500 |
| Adaptive Logic Modules (ALMs) | 135,000 |
| Embedded Memory (bits) | 18,821,184 |
| User I/O Pins | 976 |
| Maximum Core Clock Frequency | 600 MHz |
| Core Supply Voltage | 1.1 V |
| DSP Block Multipliers (18x18) | 384 |
| Package | 1517-ball FCBGA (FineLine BGA) |
| Speed Grade | C2 |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Lead-free process; RoHS status per shipment |
| MSL Level | MSL3 (typical for large FCBGA) |
EP3SL340F1517C2N 1517-ball fcbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3SL340F1517C2N (1517-ball fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340F1517C2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340F1517C2N is suitable for 6 applications: High-Speed Digital Signal Processing (DSP), Telecom Line Cards and Packet Processing, ASIC and ASSP Prototyping, Military Radar and Beamforming, Software-Defined Radio (SDR), Medical Imaging and Diagnostics.
High-Speed Digital Signal Processing (DSP)
The EP3SL340F1517C2N's 384 18x18 hardware multipliers and 600 MHz core clock make it a strong fit for high-throughput DSP pipelines such as FFTs, FIR/IIR filters, and radar pulse-Doppler processing. Designers typically pair the multipliers with the device's 18.8 Mbit of block RAM to build staged FFT engines that sustain hundreds of GMACS without external working memory. The C2 speed grade provides the timing margin required for fully pipelined datapaths running near the Fmax ceiling, while partial reconfiguration lets one FPGA handle multiple DSP personalities over time.
Recommended
Telecom Line Cards and Packet Processing
Stratix III L devices such as the EP3SL340F1517C2N are widely deployed in telecom line cards where their 976 user I/Os support many SFI/SGMII/QSGMII lanes and external Tri-Mode Ethernet MACs. The 18.8 Mbit of embedded memory buffers packet headers and lookup tables, while the ALM fabric implements custom classifiers, QoS engines, and traffic managers without external ASICs. Partial reconfiguration is used to swap between protocol personalities (for example, OTN versus Ethernet) on the same line card hardware, reducing OEM SKU counts.
Recommended
ASIC and ASSP Prototyping
With 337,500 logic elements and 976 I/Os, the EP3SL340F1517C2N can map multi-million-gate ASIC designs for pre-silicon validation. Engineers partition the ASIC into the FPGA's ALM fabric, then use the C2 speed grade to model worst-case ASIC timing margins. The 1517-ball FCBGA exposes enough I/Os to break out full DDR3 buses, multiple PCIe Gen1/Gen2 endpoints, and dozens of GPIO for bench instrumentation, while the Stratix III L sub-family's lower static power keeps long burn-in sessions affordable.
Recommended
Military Radar and Beamforming
Radar and electronic-warfare systems rely on the EP3SL340F1517C2N's high DSP density and parallel I/O to implement adaptive beamforming, pulse compression, and Doppler filtering in a single device. The 384 multipliers support phased-array weight computation across hundreds of antenna elements, while the 18.8 Mbit block RAM stores coefficient tables and intermediate accumulators. Designers often place the FPGA alongside ADCs and DACs on the same board to digitize wideband IF signals and push coherent samples into downstream signal processing.
Recommended
Software-Defined Radio (SDR)
The EP3SL340F1517C2N's logic density and DSP resources make it a strong choice for multi-channel SDR platforms that reconfigure modulation, coding, and bandwidth in real time. The ALM fabric implements FIR filtering, channelization, and forward error correction, while hard PLLs generate the multiple sample-clock domains required by wideband ADC front ends. Partial reconfiguration lets the platform swap waveforms on the fly without reloading the full bitstream, a feature widely used in tactical and public-safety SDRs.
Recommended
Medical Imaging and Diagnostics
Ultrasound, CT, and MRI systems use the EP3SL340F1517C2N to perform real-time beamforming, image reconstruction, and digital filtering across hundreds of channels. The device's 384 hardware multipliers accelerate scanline and FFT pipelines, while the 18.8 Mbit of block RAM holds temporary image frames during reconstruction. The commercial 0-85 °C operating range suits cart-based diagnostic imaging equipment, and the low-static-power Stratix III L architecture helps meet stringent medical thermal budgets.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340F1517C2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340F1517C2 | EP3SL340F1517C3N | EP3SL340F1517C4N | EP3SL340F1517I4N | EP3SL200F1517C2N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1517-FCBGA (FineLine BGA, ~40x40 mm, 1 mm pitch) | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 200,000 |
| Embedded Memory (bits) | 18,821,184 | 18,821,184 | 18,821,184 | 18,821,184 | 18,821,184 | 11,415,936 |
| DSP Multipliers (18x18) | 384 | 384 | 384 | 384 | 384 | 192 |
| User I/O Pins | 976 | 976 | 976 | 976 | 976 | 744 |
| Speed Grade | C2 | C2 | C3 | C4 | C4 + I (industrial) | C2 |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Lifecycle Status | Last-time-buy (Stratix III mature) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Highest speed grade in the EP3SL340 family for maximum Fmax (vs EP3SL340F1517C4N)
- Highest logic density at the F1517 1517-ball FCBGA package (vs EP3SL200F1517C2N)
- Low-static-power Stratix III L architecture (vs Standard Stratix III (EP3SL340 series is 'L' variant))
Design Notes
Estimated: With a 1.1 V core, 976 I/Os at typical Stratix III L utilization (50% logic, 50% memory toggling), the EP3SL340F1517C2N can draw 3-5 A from the core rail alone. Designers must provision at least 4-6 power-supply phases for the VCCINT/VCCHIP rail group plus dedicated regulators for VCCIO banks (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V). The Stratix III L sub-family reduces static power by 30-50% vs the standard Stratix III, but dynamic power at 600 MHz Fmax can still exceed 15 W in DSP-heavy designs, so thermal analysis with the PowerPlay early power estimator is mandatory before PCB layout.
The 1517-ball FCBGA at 1 mm ball pitch requires a high-density PCB with microvia stack-ups (typically 6-8 layers of HDI build-up, laser-drilled vias, and ENIG or ENEPIG surface finish). Follow Altera's Stratix III board design guidelines for via-in-pad usage under the BGA, escape routing with 0.0762 mm (3 mil) line/space, and reference plane continuity for all high-speed transceiver and DDR3 signals. Use multiple decoupling tiers - 0402/0201 ceramics under the BGA plus bulk polymer capacitors - to control simultaneous switching noise.
Estimated: With theta-JA around 12-15 C/W on a properly designed 8-layer HDI board (per Altera thermal models), a 15 W dissipation produces a 180-225 °C junction temperature rise above ambient - well above the 85 °C commercial limit. Use thermal vias under the BGA thermal balls, copper pour on every inner layer, and consider a heatsink or heat spreader for designs running sustained DSP workloads. Industrial-temperature variants (e.g., EP3SL340F1517I4N) widen the operating range but increase the thermal design challenge.
Do not assume 'N' suffix parts are drop-in substitutes for non-N parts without checking industrial temperature screening - while the EP3SL340F1517C2N and EP3SL340F1517I4N share silicon, they differ in test flow and warranty. Another common pitfall is mis-programming MSEL pins: the EP3SL340F1517C2N uses MSEL[4..0] to select configuration mode (AS, PS, JTAG, FPP), and an incorrect setting yields a non-booting device. Finally, never share a single I/O bank between 1.5 V and 2.5 V VCCIO rails without consulting the pin information file - bank voltage mixing causes permanent damage.
Stratix III I/Os support LVDS, SSTL, HSTL, and LVPECL standards; SSTL15 Class I is the recommended interface for DDR3 memory at up to 533 MHz. According to Altera's DDR3 controller IP user guide, designers must enforce matched-length (within 25 ps), controlled-impedance (50 ohm single-ended, 100 ohm differential), and proper termination (on-die or external VTT). Use IBIS models from Intel/Altera for board-level SI simulation, and follow the Quartus II Fitter pin planner to assign DQ/DQS groups correctly.
Compliance Information
RoHS and REACH compliance per Altera/Intel product documentation. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Halogen-free status is not explicitly stated in the verified web data and is marked unknown. Conflict-minerals compliance follows Intel's standard CMRT declarations.
