EP3SL340F1517I4LN - Stratix III L FPGA 337K Cells 1517-FCBGA | Intel
MPN: EP3SL340F1517I4LN ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $19701.25 | $19,701.25 |
| 10 | $18716.18 | $187,161.80 |
| 100 | $16549.05 | $1,654,905.00 |
| 500 | $13880.88 | $6,940,440.00 |
| 1,000 | $11820.75 | $11,820,750.00 |
EP3SL340F1517I4LN Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit in the broader taxonomy of programmable logic -> logic semiconductor -> integrated circuit. Unlike ASICs, FPGAs can be reconfigured in-system, enabling rapid prototyping, hardware acceleration, and low-volume custom silicon replacement.
Key features include 337,500 logic elements, 18,822,144 bits of embedded memory, 13,500 LABs (Logic Array Blocks), 384 embedded 18x18 multipliers, integrated high-speed transceivers, and 976 user I/O pins. The device supports up to 8 PLLs and includes hard memory controller blocks, supporting DDR/DDR2/DDR3 external memory interfaces. The 1517-FCBGA package provides high I/O count with multi-row ball array on a 40x40 mm substrate.
Architecturally, the Stratix III L FPGA uses Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables (LUTs), delivering higher effective logic density than the previous Stratix II generation. The device supports hot-socketing, allowing insertion into a live backplane without damage, and offers multiple temperature grades (commercial, industrial, military) with the I4 industrial speed grade targeting -40C to +100C operation.
Typical applications include high-performance digital signal processing, telecom baseband processing, ASIC prototyping, high-speed serial protocol bridging (PCIe, Serial RapidIO, Gbps Ethernet), video processing and broadcast equipment, and military/aerospace signal processing. The Stratix III L family was Altera's mainstream high-density FPGA family before being superseded by Stratix IV and Stratix V.
Design consideration: Stratix III FPGAs require Quartus II design software (legacy, EOL replaced by Quartus Prime with limited Stratix III support). Power estimation requires the Playback Power Analyzer tool, and PCB designers must follow Intel's flip-chip BGA layout guidelines including microvia stack-up and 1.0 mm pitch escape routing.
Drop-in alternatives for EP3SL340F1517I4LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340F1517I4LN (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL340F1517I4L
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View Datasheet →EP3SL340F1517I4LN Maximum Ratings & Electrical Characteristics
| Family | Stratix III L (low power variant) |
| Logic Elements | 337,500 |
| Embedded Memory | 18,821,144 bits |
| Logic Array Blocks (LABs) | 13,500 |
| User I/Os | 976 |
| Package | 1517-BBGA, FC-FBGA (Flip-Chip) |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Operating Temperature | -40C to +100C (industrial, I4 grade) |
| Speed Grade | I4 (industrial, fast) |
| Embedded Multipliers (18x18) | 384 |
| PLLs | Up to 8 |
| Package Pitch | 1.0 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes (per package) |
| Design Software | Quartus II / Quartus Prime (legacy) |
EP3SL340F1517I4LN 1.0 mm Pin Configuration Guide
Pin configuration for EP3SL340F1517I4LN (1.0 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340F1517I4LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340F1517I4LN is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Baseband Processing, Broadcast Video Processing, Military Radar and Signal Processing, High-Speed Serial Protocol Bridging, Industrial Machine Vision Systems.
ASIC Prototyping and Emulation
The EP3SL340F1517I4LN with 337,500 logic elements and 18.8 Mbits of embedded memory provides sufficient density to partition and emulate multi-million-gate ASICs in modular arrays. Quartus II synthesis can map RTL from Synopsys Design Compiler or Cadence Genus into the Stratix III fabric, while 976 user I/Os support wide bus interfaces for ASIC netlist bring-up. Designers benefit from 384 embedded 18x18 multipliers for DSP-heavy ASIC blocks, and the 0.9 V core voltage plus L-variant low-power fabric reduces emulation-array thermal load versus standard Stratix III. Compared to ASIC respins costing $1M+, prototype validation on this FPGA can be amortized across tens of designs.
Recommended
Telecom Baseband Processing
The EP3SL340F1517I4LN's combination of 13,500 LABs, 384 18x18 multipliers, and high LVDS bandwidth per I/O bank makes it suitable for WCDMA, LTE, and WiMAX baseband PHY layer implementation. The embedded memory supports large constellation demapping buffers, while hard PLLs generate the multi-rate clocks required for downlink OFDM demodulation. Industrial -40C to +100C operation covers outdoor base-station enclosures. Compared to DSP clusters, a single Stratix III L device replaces 4-6 discrete DSPs while consuming similar board area, with the L-variant low-static-power fabric reducing idle current between burst transmissions.
Recommended
Broadcast Video Processing
The EP3SL340F1517I4LN's 976 user I/Os and high embedded-memory bandwidth enable real-time processing of HD-SDI, 3G-SDI, and emerging 4K video streams. The 1517-FCBGA package exposes enough I/O pins to ingest multiple parallel SDI streams plus HDMI/DisplayPort interfaces for monitoring output. Designers implement color-space conversion, frame-rate conversion, and chroma keying in the ALM fabric, while the 18.8 Mbits of block RAM buffer entire HD frames for temporal processing. Compared to ASSP video processors, FPGAs allow format-agnostic designs that support new broadcast standards via firmware updates.
Recommended
Military Radar and Signal Processing
Industrial-grade -40C to +100C operation of EP3SL340F1517I4LN and its 65 nm low-static-power process variant suit deployed radar signal-processing systems where thermal envelope matters. The 384 18x18 multipliers enable parallel FFT and pulse-compression kernels, while 18.8 Mbits of block RAM holds range-Doppler maps. Hot-socketing support simplifies field-replaceable module designs in active radar arrays. Designers benefit from Altera's mature SignalTap II embedded logic analyzer for in-field firmware debugging, and the 1517-FCBGA package is rated for the vibration profiles of airborne and naval platforms.
Recommended
High-Speed Serial Protocol Bridging
The EP3SL340F1517I4LN integrates multi-gigabit transceivers supporting PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and Interlaken at up to 6.375 Gbps per channel. Embedded hard IP blocks reduce soft-logic overhead and free ALMs for protocol conversion logic. The 976 I/O pins support multiple parallel PHY interfaces alongside the serial links, enabling bridging cards that translate between proprietary backplane protocols and standard fabrics. Compared to ASSP bridge chips, the FPGA-based design supports custom protocols and field updates via PCIe partial reconfiguration.
Recommended
Industrial Machine Vision Systems
The EP3SL340F1517I4LN's combination of high logic density, 384 dedicated 18x18 multipliers for convolution operations, and large embedded memory for frame buffering suits multi-camera industrial inspection lines. The industrial -40C to +100C temperature grade covers factory-floor deployments without additional cooling. The 976 I/O count accommodates Camera Link, CoaXPress, or GigE Vision interfaces for 4-8 simultaneous cameras. Designers implement defect detection, dimensional measurement, and OCR pipelines in the ALM fabric, with the L-variant low-power process variant reducing cabinet cooling requirements.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340F1517I4LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340F1517I4L | EP3SL340F1517I3N | EP3SL340F1517C4N | EP3SL340F1517C3N | EP3SL340F1517C4 |
|---|---|---|---|---|---|---|
| Package | 1517-FCBGA | 1517-FCBGA | 1517-FCBGA | 1517-FCBGA | 1517-FCBGA | 1517-FCBGA |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Speed Grade | I4 (industrial, fastest) | I4 | I3 (-1 bin) | C4 (commercial) | C3 (commercial, -1 bin) | C4 (commercial, non-RoHS) |
| Temperature Grade | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| RoHS / Lead-Free | Yes (N suffix) | No (non-RoHS) | Yes | Yes | Yes | No |
| Embedded Memory | 18.8 Mbits | 18.8 Mbits | 18.8 Mbits | 18.8 Mbits | 18.8 Mbits | 18.8 Mbits |
| User I/Os | 976 | 976 | 976 | 976 | 976 | 976 |
Key Differentiators
- Highest industrial speed grade (I4) in the Stratix III L 337K-LE family (vs EP3SL340F1517I3N)
- Lead-free / RoHS compliant (N suffix) industrial-grade variant (vs EP3SL340F1517I4L (no N suffix))
- Industrial temperature grade (-40C to +100C) for harsh environments (vs EP3SL340F1517C4N (commercial 0-85C))
Design Notes
The 1517-FCBGA package uses 1.0 mm ball pitch and requires a high-density PCB stack-up with laser-drilled microvias (typically 4-6 layer stack-up with 1 oz copper). Escape routing must use via-in-pad or dog-bone fan-out patterns per Altera AN-532 (now Intel FPGA AN-532). Thermal vias under the center die area are mandatory, with at least a 6x6 thermal via array at 0.3 mm drill on 0.6 mm pitch to conduct 5-15W dissipation to internal copper planes. Estimate: junction-to-ambient theta_JA is approximately 12-15 C/W with 100 sq cm of inner copper plane.
The Stratix III L family uses a multi-rail power architecture requiring VCC (0.9 V core), VCC_PLL (0.9-1.1 V), VCCIO (1.2-3.0 V per bank), and VCCA (2.5 V). Power sequencing must follow Intel AN-571: VCC before VCCIO before VCCA. Estimated power for a 70% utilization EP3SL340 with 50% toggle rate at 300 MHz: ~8-12 W core + I/O. Use the PowerPlay Early Power Estimator spreadsheet (free download) before final board design. Decoupling requires 200+ 0402 ceramic capacitors distributed across the bottom-side of the BGA footprint.
Common pitfalls when designing with EP3SL340F1517I4LN: (1) DO NOT use the Stratix III configuration scheme with a Stratix IV/V bitstream - the families are bitstream-incompatible; (2) Configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[0:4]) must be pulled to correct logic levels via 4.7 kohm resistors; (3) JTAG chain ordering matters when daisy-chaining with other devices - consult AN-370; (4) The 1517-FCBGA requires nitrogen reflow with controlled ramp rates below 2 C/sec to prevent BGA non-wet opens. Estimated reflow profile: 150C preheat to 245C peak with 60-90 sec TAL.
Compliance Information
RoHS compliant per N suffix in ordering code. AEC-Q100 not applicable (FPGA, not automotive discrete). REACH compliance assumed per Intel product environmental statements. Halogen-free per package marking.
