EP3SL340F1517C4N - Stratix III L FPGA 337K LE | 1517-FCBGA
MPN: EP3SL340F1517C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11741.5957 | $11,741.60 |
| 10 | $10567.44 | $105,674.40 |
| 50 | $9393.28 | $469,664.00 |
| 100 | $8219.12 | $821,912.00 |
| 250 | $7044.96 | $1,761,240.00 |
EP3SL340F1517C4N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. Within the broader hierarchy, an FPGA belongs to programmable logic devices, sitting alongside CPLDs and structured ASICs. Stratix III FPGAs implement a logic-element fabric with adaptive logic modules (ALMs), on-chip M9K/M144K memory blocks, and dedicated DSP blocks, enabling parallel processing of wide data paths with deterministic latency.
Key features of the EP3SL340F1517C4N include 13,500 LABs, up to 450 MHz fabric performance, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCIe), embedded transceivers at multi-gigabit data rates, and a 1.1 V core supply. The "C4" speed grade indicates a specific Fmax bin, while the trailing "N" denotes lead-free / Pb-free termination. The 1517-ball flip-chip BGA package provides high signal density for designs requiring hundreds of differential pairs and high fanout.
Typical applications include high-performance digital signal processing (radar, software-defined radio), ASIC prototyping, high-speed serial protocol bridging (PCI Express, Serial RapidIO, GIGABIT Ethernet), broadcast video processing, and high-end test and measurement instrumentation. The combination of 18.8 Mbits of embedded memory and 13,500 LABs makes this device suitable for designs that require both deep buffering and complex state machines.
When designing with this part, ensure your PCB BGA layout supports 1.0 mm ball pitch fanout, and that thermal management accounts for the larger die. Quartus II design software (legacy) or Intel Quartus Prime is required for synthesis, place-and-route, and bitstream generation. Static power is a key metric in Stratix III L - use the PowerPlay Early Power Estimator to validate thermal envelopes before PCB commitment.
This page synthesizes distributor stock levels, drop-in package-compatible alternatives from the Stratix III / Stratix III L / Stratix IV families, and practical PCB thermal guidance not consolidated in any single manufacturer or distributor page.
Drop-in alternatives for EP3SL340F1517C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340F1517C4N (same form factor and footprint) — differing in Package, Operating Temperature, Embedded Memory Bits, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL340F1517C4LN
✅ Drop-In✓ In Stock
$11200 / Unit
View Datasheet →EP3SL340F1517C4L
✅ Drop-In✓ In Stock
$14500 / Unit
View Datasheet →EP3SL340F1517C4
✅ Drop-In✓ In Stock
$3300 / Unit
View Datasheet →EP3SL340F1517C3N
✅ Drop-In✓ In Stock
$3750 / Unit
View Datasheet →EP3SL340F1517C2N
✅ Drop-In✓ In Stock
$13200 / Unit
View Datasheet →EP3SE260F1517C4N
✅ Drop-In✓ In Stock
$7800 / Unit
View Datasheet →EP3SL340F1517C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements (LE) | 337,500 |
| LABs / CLBs | 13,500 |
| Embedded Memory Bits | 18,821,144 (18.8 Mbit) |
| Number of I/O | 976 user I/Os |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Fabric Frequency | 450 MHz |
| Package | 1517-BBGA, FCBGA (flip-chip) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C4 |
| Lead-Free / Pb-Free | Yes (N suffix) |
| RoHS Status | Compliant |
| Total Memory Bits | 18,821,144 |
EP3SL340F1517C4N 1517-bbga, fcbga (flip-chip) Pin Configuration Guide
Pin configuration for EP3SL340F1517C4N (1517-bbga, fcbga (flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340F1517C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340F1517C4N is suitable for 7 applications: High-Performance Digital Signal Processing (DSP), ASIC Prototyping, High-Speed Serial Protocol Bridging, Broadcast Video Processing, Test and Measurement Instrumentation, Aerospace and Defense Data Acquisition, Medical Imaging Systems.
High-Performance Digital Signal Processing (DSP)
The EP3SL340F1517C4N's 337,500 logic elements and dedicated DSP blocks make it well-suited for high-performance DSP applications such as radar signal processing, software-defined radio (SDR), and base-station channel cards. Placed at the heart of a multi-channel receiver chain, its parallel DSP fabric processes wide datapaths with deterministic latency. Compared with a discrete DSP+FPGA partitioning, the integrated fabric eliminates inter-chip bus bottlenecks.
Recommended
ASIC Prototyping
With 337,500 LEs and 976 user I/Os, the EP3SL340F1517C4N can prototype mid-complexity ASICs (typically 5-15M ASIC gates) before tapeout. The 1517-ball FC-BGA exposes enough I/O to map multi-bank ASIC designs including DDR3/4 memory controllers, PCIe endpoints, and SERDES. Quartus Prime supports incremental compile flows so multiple engineers can partition the design. The "L" (low static power) variant is critical for multi-FPGA prototyping racks.
Recommended
High-Speed Serial Protocol Bridging
The EP3SL340F1517C4N's embedded multi-gigabit transceivers support protocols such as PCI Express Gen1/Gen2, Serial RapidIO, GIGABIT Ethernet, and CPRI used in 4G/5G fronthaul. Placed as a bridge between a host processor and a custom ASIC, it absorbs protocol-stack overhead and custom packet processing. The C4 speed grade provides the timing margin required for multi-lane Gen2 operation at 5 Gbps.
Recommended
Broadcast Video Processing
Broadcast equipment such as 4K/8K video routers, frame synchronizers, and live production switchers benefit from the EP3SL340F1517C4N's high logic density and 976 user I/Os for SDI/HDMI aggregation. The fabric handles multi-stream de-interlacing, scaling, and color-space conversion in parallel with deterministic frame-buffer latency. LVDS-capable I/O banks directly interface SDI serializers/ deserializers without external glue logic.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers integrate the EP3SL340F1517C4N to handle parallel sample acquisition, deep state-machine triggering, and real-time protocol decoding. The 18.8 Mbit embedded memory provides deep capture buffers per channel; the C4 speed grade supports sampling rates beyond 500 MHz on parallel LVDS interfaces. Quartus Prime IP library includes PCIe, I2C, SPI, and JTAG cores for instrument control.
Recommended
Aerospace and Defense Data Acquisition
Defense and aerospace data-acquisition subsystems (radar front-ends, electronic warfare, flight recorders) use the EP3SL340F1517C4N where its 337,500 LEs and multi-Gbps transceivers ingest wideband RF data streams. The 1517-ball FC-BGA exposes dedicated SERDES channels for direct ADC/DAC interfacing via JESD204B. The "L" variant's low static power benefits thermally constrained avionic enclosures.
Recommended
Medical Imaging Systems
CT, MRI, and ultrasound imaging systems use the EP3SL340F1517C4N for real-time beamforming, image reconstruction, and DICOM-stream processing. Its large logic capacity supports parallel FIR/IIR filtering across hundreds of channels simultaneously; 18.8 Mbit on-chip memory holds intermediate reconstruction kernels. The industrial-grade (-40 to +100C) I-suffix variants are required for medical-environment thermal envelopes.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340F1517C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340F1517C4LN | EP3SL340F1517C3N | EP3SL340F1517C2N | EP3SE260F1517C4N |
|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same |
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 260,000 |
| Speed Grade | C4 | C4 | C3 | C2 | C4 |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lead-Free | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
Key Differentiators
- Highest-density Stratix III L variant in 1517-FCBGA (vs EP3SE260F1517C4N)
- Lowest static power in the Stratix III generation (vs EP3SL340H780I4N (H variant))
- C4 speed grade provides ~10-15% higher Fmax than C3 (vs EP3SL340F1517C3N)
Design Notes
Estimated: at full fabric utilization (337,500 LEs switching at 450 MHz), the 1517-ball FC-BGA may dissipate 8-12 W. With FC-BGA packages, attach a copper heat-spreader or forced-air cooling. Run the PowerPlay Early Power Estimator in Quartus Prime to validate junction temperature; target Tj below 100C for reliable long-life operation. The "L" (low static power) variant of Stratix III reduces leakage by ~30-50% vs the standard variant, easing thermal envelopes.
The 1517-ball FC-BGA uses a 1.0 mm ball pitch, requiring a high-layer-count PCB (12+ layers) with microvia and via-in-pad technology. Use a high-Tg (Tg > 170C) low-Df/Dk material such as Megastura 6 or equivalent to meet multi-Gbps SERDES signal-integrity targets. Per the Altera Stratix III handbook, follow the pin-out guidelines in the package chapter for power-pin and GND via placement to ensure solid reference planes under the BGA field.
Stratix III requires multiple regulated supplies (VCC, VCCAUX, VCCPD, VCCIO per bank, VTT for DDR). Use a dedicated power controller such as the LTM4628 or EN5339QI plus discrete LDO post-regulation. Per Quartus power-estimator output, allow at least 20% headroom on each rail; inrush at startup can exceed steady-state by 2-3x. Decoupling: place 0402/0201 ceramics directly under each BGA ball pair with via-in-pad for shortest loop inductance.
Do not omit the CFGBLK configuration clock source (typically 50 MHz TCXO) on the dedicated CFG pin pair - the device will not enumerate without it. JTAG chain order matters when multiple FPGAs share TDI/TMS - assign unique 5-bit JTAG IDCODEs in Quartus assignments. For 65 nm Stratix III devices, ensure SEU (single-event upset) scrubbing logic is implemented if used in aerospace/defense where soft-error rates exceed 1 FIT/Mbit.
Multi-gigabit transceivers require controlled-impedance routing (100 ohm differential) with matched lengths within 5 mil for lanes above 5 Gbps. Reference plane continuity must be preserved across layer transitions; avoid ground-plane splits under transceiver channels. Use IBIC-AMI models from Intel for channel simulation in tools such as Keysight ADS or Cadence Sigrity before PCB commitment.
Compliance Information
RoHS/REACH compliance per Intel/Altera product page. AEC-Q100 not applicable to FPGAs - use automotive-grade part number suffix (e.g. automotive-grade variants are typically sold under separate ordering codes). Lead-free confirmed by N suffix.
