EP3SL340F1517C3 - 337,500-Cell FPGA | Intel | Digital Logic
MPN: EP3SL340F1517C3 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $15590.4777 | $15,590.48 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3SL340F1517C3 Overview
An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic blocks, routing resources, memory elements, and configurable I/O. Engineers configure these resources to implement digital functions after manufacturing. In the system hierarchy, EP3SL340F1517C3 belongs to FPGA devices, programmable logic, digital integrated circuits, and ultimately semiconductors. Unlike a fixed-function ASIC, the FPGA can be revised through configuration data without changing the silicon device.
The verified 337,500-cell capacity supports large control engines, interface aggregation, and custom high-speed digital functions. The device provides 976 I/O pins for connecting numerous peripheral buses, memory interfaces, converters, and control signals. Its 13,500 LABs provide a broad fabric for implementing combinational and sequential logic. The 1517-pin FCBGA package offers high interconnection density but requires advanced PCB design, controlled impedance routing, reliable power distribution, and careful thermal management.
The part is identified as a 65 nm Stratix III L device with a 500 MHz specification reported by the supplied FPGAkey result and a 1.1 V core-voltage value also reported there. Another distributor result describes 18,822,144 bits and 337,500 logic elements/cells. These values establish a large programmable architecture, but detailed timing, transceiver count, memory capacity, operating temperature, and package dimensions remain subject to the manufacturer datasheet. The configuration interface, supported I/O standards, embedded resources, and exact speed grade must be confirmed before release to production.
Typical applications include communications equipment, industrial automation, test and measurement, video and imaging systems, and high-channel-count data acquisition. In these systems, the FPGA can consolidate control logic, protocol conversion, parallel data processing, and timing functions into one programmable platform. The 976 I/O count is particularly useful where many external devices or parallel buses must be connected.
Designers should treat the FCBGA as a high-density system-in-package challenge rather than a conventional low-pin-count IC. Validate the complete Intel pin assignment, power-up sequence, decoupling network, signal-integrity constraints, and thermal solution from the manufacturer documentation. A board redesign is normally required when moving to another FPGA family, density, package, or pinout.
This data set combines verified distributor specifications, package information, indicative commercial data, and clearly marked engineering gaps. It is intended to support early component selection, sourcing research, and architecture planning, not to replace the manufacturer datasheet, qualification records, or final signal-integrity and thermal analysis.
Drop-in alternatives for EP3SL340F1517C3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340F1517C3 (same form factor and footprint) β differing in Speed Grade, Package, Embedded Memory Bits, Logic Elements, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL340F1517C2N
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$13200 / Unit
View Datasheet βEP3SL340F1517C2
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$3050 / Unit
View Datasheet βEP3SE260F1517C3N
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$9850 / Unit
View Datasheet βEP3SE260F1517C3
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$10800 / Unit
View Datasheet βEP3SL200F1517I4N
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$4400 / Unit
View Datasheet βEP3SL340F1517C3 Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Series | Stratix III L |
| Logic Cells | 337,500 |
| Logic Elements/Cells | 337,500 |
| LABs | 13,500 |
| User I/O | 976 |
| Memory Bits | 18,822,144 bits |
| Process Technology | 65 nm |
| Maximum Reported Frequency | 500 MHz |
| Core Voltage | 1.1 V |
| Package | 1517-BBGA, FCBGA |
| Terminal Count | 1517 pins |
| Package Shape | Square |
| Terminal Form | Ball |
EP3SL340F1517C3 square Pin Configuration Guide
Pin configuration for EP3SL340F1517C3 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340F1517C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340F1517C3 is suitable for 6 applications: Industrial Automation Controllers, Communications Protocol Aggregation, Test and Measurement Equipment, Video and Imaging Processing, High-Channel Data Acquisition, Aerospace and Defense Digital Systems.
Industrial Automation Controllers
EP3SL340F1517C3 fits industrial automation controllers that require large programmable logic resources and extensive external connectivity. Its 337,500 logic cells and 13,500 LABs can host multiple machine-control state machines, motion-control interfaces, protocol bridges, safety-related sequencing, and real-time data processing on one FPGA. The 976 user I/O pins provide capacity for connecting encoders, sensors, actuators, industrial communication PHYs, and parallel control devices. Use the FPGA as a central deterministic controller between field devices and a processor or supervisory computer. The main design trade-off is the 1517-ball FCBGA package: it supports dense interconnect but increases PCB-routing, assembly, power, and thermal requirements. Confirm the target temperature grade, I/O standards, clock resources, and configuration method from the manufacturer datasheet before selecting this device.
Recommended
Communications Protocol Aggregation
EP3SL340F1517C3 is suitable for communications equipment that must aggregate or convert many digital protocols while retaining programmable timing and control. The verified 337,500-cell capacity can support packet inspection, framing, channelization, error handling, buffering, and hardware protocol acceleration. Its 976 I/O pins allow connection to several line interfaces, serializer/deserializer devices, network processors, memories, and management controllers. Place the FPGA between physical-layer devices and a host processor, using separate clock domains and carefully planned I/O banks. The supplied data does not verify the number or speed of transceivers, so confirm those resources before choosing the part for high-rate serial traffic. The 1517-ball FCBGA package supports the required interface density, but signal integrity, power integrity, controlled impedance, and thermal testing are essential.
Recommended
Test and Measurement Equipment
EP3SL340F1517C3 can serve as the programmable timing, capture, and processing fabric in high-channel-count test and measurement equipment. The 337,500 logic cells provide room for trigger generation, waveform sequencing, parallel correlation, digital filtering, and instrument control, while the 976 I/O pins support many measurement channels, relays, ADCs, DACs, and timing devices. Use the FPGA to combine deterministic hardware capture with a host processor that performs analysis or user-interface functions. The 500 MHz figure appears in one supplied distributor result, but it is not a substitute for device-specific timing analysis; verify the exact speed grade, clocking limits, setup and hold margins, and I/O electrical characteristics in the manufacturer documentation. Dense FCBGA assembly also requires controlled stack-up design, local decoupling, and careful management of simultaneous switching noise.
Recommended
Video and Imaging Processing
EP3SL340F1517C3 is a strong candidate for video and imaging systems that need configurable pixel processing and many parallel data connections. Its 337,500 logic cells can implement synchronization, color-space conversion, region-of-interest logic, frame buffering interfaces, overlays, and custom image filters. The 976 I/O count is valuable when the FPGA must connect several image sensors, displays, memory devices, serializers, and control processors simultaneously. Place the FPGA after image sensors or before display interfaces, using matched clock domains and documented I/O timing. The supplied data does not establish the available memory blocks, DSP resources, supported video standards, or maximum clock performance, so validate those resources in the Intel datasheet and design tools. The 1517-ball FCBGA package offers the necessary pin density but requires high-quality PCB fabrication and assembly.
Recommended
High-Channel Data Acquisition
EP3SL340F1517C3 fits high-channel-count data acquisition systems that require deterministic parallel processing. The device can aggregate ADC and DAC interfaces, implement channel calibration, timestamp data, perform digital filtering, and route processed records to memory or a host processor. Its 976 user I/O pins provide substantial connectivity for converters, clocks, control signals, and parallel memory buses, while 337,500 logic cells support reusable acquisition and processing datapaths. Use the FPGA as a timing and control layer between converters and the system processor, with careful partitioning across clock domains. Confirm converter data rates, I/O voltage support, memory bandwidth, and timing constraints from the manufacturer documentation because the supplied web data does not provide those detailed specifications. The 1517-ball FCBGA package is appropriate for dense channel integration but makes power integrity and thermal validation critical.
Recommended
Aerospace and Defense Digital Systems
EP3SL340F1517C3 may be considered for aerospace and defense digital systems that need high logic density, flexible I/O, and hardware-level parallelism. The 337,500-cell architecture can implement sensor aggregation, command and telemetry processing, protocol conversion, control sequencing, and mission-specific datapaths. Its 976 I/O pins support numerous sensors, actuators, communication links, and memory interfaces, while programmable logic allows system functions to be updated without changing the silicon. The supplied data does not verify radiation tolerance, temperature grade, security features, or qualification status, so these requirements must be established from Intel documentation and project-specific testing. A 1517-ball FCBGA implementation also requires controlled impedance, robust power distribution, thermal analysis, and verified manufacturing capability. Use this device only after confirming that its package, reliability, and environmental specifications meet the program requirements.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340F1517C3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340F1517C2N | EP3SL340F1517C2 | EP3SE260F1517C3N | EP3SE260F1517C3 | EP3SL200F1517I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Pin Count | 1517 pins | 1517 pins | 1517 pins | 1517 pins | 1517 pins | 1517 pins |
| Package Family | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA |
Key Differentiators
- Highest verified logic capacity among the listed comparison candidates (vs EP3SL200F1517I4N)
- Very large external interface capacity (vs EP3SE260F1517C3)
- Large programmable logic fabric for parallel system integration (vs EP3SE260F1517C3N)
Design Notes
Treat the 1517-ball FCBGA as a high-density interconnect design. Use the exact Intel land pattern, ball numbering, stack-up, and escape geometry from the manufacturer documentation rather than reconstructing the footprint from the package name. Confirm whether the selected PCB fabricator supports the required ball pitch, via-in-pad construction, surface finish, and assembly process. Plan escape routes before freezing the schematic and reserve layer transitions for power, clock, configuration, and high-speed signals. The supplied results establish 1517 balls but do not provide package dimensions or escape recommendations.
Design the power-distribution network from the complete Intel power-supply and decoupling requirements, not from the reported 1.1 V core voltage alone. Separate core, auxiliary, I/O, and configuration-related supplies as applicable, and provide local low-impedance decoupling close to the relevant balls. Analyze voltage tolerances, sequencing, ramp rates, transient load, and simultaneous switching current at the FPGA. The supplied web data does not include current consumption, rail limits, power sequencing, or thermal-resistance values, so those inputs require the manufacturer datasheet and power-estimation workflow.
Estimate the FPGA junction temperature using the final device utilization, clock rates, I/O activity, configuration, and board thermal environment. The supplied data does not provide a verified junction-to-air or junction-to-board thermal-resistance value, so no defensible temperature-rise calculation can be made from the available inputs. After obtaining the permitted thermal data, create a power map for the design, use the recommended copper spreading and thermal-via strategy, and verify the solution with a populated-board measurement. Keep the thermal analysis synchronized with the final pinout and layout.
Use controlled-impedance routing and timing analysis for every high-speed interface connected to EP3SL340F1517C3. The 976 I/O capacity creates significant simultaneous-switching potential, especially when many pins change near a clock edge. Confirm the supported I/O standards, drive strengths, termination options, clock resources, input thresholds, and package skew from the manufacturer documentation. Maintain return-path continuity, minimize via transitions on critical nets, and simulate crosstalk and power noise with the final stack-up. The 500 MHz figure in the supplied FPGAkey result is a reported device-family or listing value, not a guarantee for every design or interface.
Do not assume that a similar Stratix III ordering suffix, 1517-ball package, or cell count guarantees a drop-in replacement. Verify the complete pin mapping, dedicated clock and transceiver resources, configuration interface, voltage rails, speed grade, temperature grade, and user-I/O compatibility. The supplied comparison identifies EP3SL340F1517I3 as related but also says that circuit structure may need modification. A package-only match is insufficient for a high-density FPGA because a ball-function change can break memory buses, clocking, configuration, or power connections. Require a formal manufacturer comparison and board-level review before substitution.
Compliance Information
The supplied verified web data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not assumed because the data does not identify an automotive qualification. Obtain the current Intel compliance declarations and qualification records before making a regulatory claim.