EP3SL340H1152C4 - 340K LE Stratix III FPGA, 1152-BGA | Intel
MPN: EP3SL340H1152C4 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13164.49 | $13,164.49 |
| 10 | $12500 | $125,000.00 |
| 100 | $11800 | $1,180,000.00 |
| 250 | $11500 | $2,875,000.00 |
| 500 | $11000 | $5,500,000.00 |
EP3SL340H1152C4 Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit containing configurable logic blocks, dedicated DSP slices, embedded memory blocks, and programmable interconnect. FPGAs occupy the hierarchy of programmable logic -> logic ICs -> digital integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs allow designers to implement and re-implement custom digital hardware, making them ideal for prototyping, low-volume production, and applications requiring post-deployment updates such as high-speed networking, video processing, and DSP.
Key features of the EP3SL340H1152C4 include 96 transceivers (per Stratix III L family) supporting data rates up to 3.75 Gbps, dedicated hardware multipliers for DSP, embedded 18x18 multipliers, and on-chip M-RAM/RAM blocks. The C4 speed grade indicates a 4-speed-grade timing bin for commercial temperature operation (0C to 85C), and the H1152 package designation identifies the 1152-pin flip-chip BGA form factor with H denoting the high-pin-count variant. The device integrates PLLs, clock networks, and configuration circuitry supporting passive serial, fast passive parallel, and JTAG configuration modes.
Architecturally, the Stratix III family introduced the ALM (Adaptive Logic Module) providing 8-input fracturable LUT capability for higher logic density per LE. The 65 nm process and 1.1 V core reduce dynamic power versus prior generations while maintaining performance through programmable power technology that automatically tunes logic speed versus leakage. The 1152-BGA package supplies extensive I/O bandwidth for memory interfaces (DDR3/QDRII+) and parallel high-speed connectivity.
Typical applications include ASIC prototyping and emulation, high-end telecommunications line cards, broadcast video processing, military/aerospace signal processing, high-performance computing accelerators, and test-and-measurement instrumentation. Stratix III devices are well-suited for designs requiring high logic density, large memory bandwidth, and integration of high-speed serial interfaces.
When designing with the EP3SL340H1152C4, ensure PCB layout supports BGA fan-out with controlled-impedance routing for transceiver channels, multi-layer PCB with dedicated power/ground planes, and thermal management via heatsink or airflow for high-utilization designs. The 65 nm core operating at 1.1 V requires core voltage rails within 3% tolerance; use low-noise LDO or DC-DC regulators for VCCINT and VCCAUX. Configuration memory is volatile, requiring a configuration device (EPCS) or system-level flash for bitstream storage at power-up.
This page synthesizes distributor pricing, FPGA family positioning, and Stratix III same-package drop-in alternatives not found in the manufacturer datasheet alone, supporting BOM risk assessment and long-lifecycle procurement decisions.
Drop-in alternatives for EP3SL340H1152C4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340H1152C4 (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Operating Temperature Grade, Core Voltage.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL340H1152C3
β Drop-Inβ In Stock
$2550 / Unit
View Datasheet βEP3SL340H1152C3N
β Drop-Inβ In Stock
$1895 / Unit
View Datasheet βEP3SL340H1152C2
β Drop-Inβ In Stock
$15800 / Unit
View Datasheet βEP3SL340H1152C2N
β Drop-Inβ In Stock
$3400 / Unit
View Datasheet βEP3SL340H1152C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements (LE) | 337,500 |
| Adaptive Logic Modules (ALM) | 135,000 |
| Logic Array Blocks (LAB) | 13,500 |
| User I/Os | 744 |
| Total I/O Pins | 1,152 |
| Package | 1152-pin FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm |
| Core Voltage (VCCINT) | 1.1 V |
| Speed Grade | C4 (commercial, speed grade 4) |
| Operating Temperature | 0C to 85C (commercial) |
| Configuration | Passive Serial, Fast Passive Parallel, JTAG |
| Mounting Type | Surface Mount (BGA) |
EP3SL340H1152C4 1152-pin fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP3SL340H1152C4 (1152-pin fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340H1152C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340H1152C4 is suitable for 6 applications: ASIC Prototyping and Emulation, High-Speed Telecommunications Line Cards, Broadcast Video Processing and Encoding, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, High-Performance Computing Accelerators.
ASIC Prototyping and Emulation
The EP3SL340H1152C4's 337,500 logic elements provide capacity to map large ASIC designs for pre-silicon validation. The 1152-BGA package exposes 744 user I/Os, enabling designers to bring out wide ASIC buses and memory interfaces for real-world I/O exercise. C4 speed grade typically meets timing closure at moderate clock frequencies. According to the Stratix III handbook, the high ALM/LE ratio makes it efficient for emulating ASIC random logic. Place the FPGA on a multi-layer PCB with abundant decoupling for VCCINT (1.1 V) and use an EPCS configuration device for bitstream storage. Compared to ASIC respin costs exceeding $1M, prototyping on this FPGA significantly reduces risk.
Recommended
High-Speed Telecommunications Line Cards
The EP3SL340H1152C4 supports high-bandwidth telecom line card designs requiring multiple 6G+ transceiver channels and parallel LVDS interfaces. Its 744 user I/Os across 12 banks accommodate SFP+ cages, backplane SerDes, and external memory buses. The 1.1 V core voltage at 65 nm balances performance and power for central-office deployments. According to Stratix III transceiver specifications, the family supports CPRI, OBSAI, and 10G Ethernet protocols. Drive reference clocks into dedicated PLL inputs and use the FPGA's on-chip termination for signal-integrity optimization. The 1152-BGA footprint requires careful BGA fan-out design but provides ample I/O bandwidth for multi-port line cards.
Recommended
Broadcast Video Processing and Encoding
Stratix III FPGAs like the EP3SL340H1152C4 are widely deployed in broadcast video routers, format converters, and real-time encoders. The 337,500 logic elements enable multi-channel HD/3G-SDI processing pipelines with on-chip frame buffering. C4 commercial speed grade operates in controlled studio environments. The 744 user I/Os support parallel SDI input/output, HDMI/DisplayPort bridging, and synchronization reference distribution. Use the device's PLL-based clock management to recover video clocks from SDI streams and align them to the house reference. Heat dissipation from 744 simultaneously-switching I/Os requires multi-layer PCB thermal vias and possibly airflow, even at the C4 speed bin.
Recommended
Military and Aerospace Signal Processing
For defense programs requiring secure, reprogrammable processing, the EP3SL340H1152C4's high logic density supports radar DSP, electronic-warfare signal processing, and software-defined radio baseband. Industrial-temperature variants in the same 1152-BGA footprint (EP3SL340H1152I-series) extend operation to -40C to +100C for harsh environments. The 1.1 V core minimizes in-flight power draw. Note that aerospace programs often require source-control drawings and counterfeit-prevention procedures; buy from authorized distributors. Use rad-tolerant external memory and watch the I/O bank's voltage compatibility for legacy avionics buses like ARINC 429 or MIL-STD-1553 bridges.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers leverage the EP3SL340H1152C4 to capture and process multi-gigabit data streams in real time. The 744 user I/Os handle parallel probe channels at sub-nanosecond sampling rates. C4 commercial speed grade operates in climate-controlled lab environments. Internal M-RAM blocks store capture buffers at line rate without off-chip memory bottlenecks. Designers benefit from on-chip 18x18 multipliers for FFT-based spectrum analysis directly in the FPGA. The 1152-BGA package requires careful PCB layout for the analog/digital domain split - keep probe-tip traces short and isolate the FPGA's noisy transceivers from analog front-end components.
Recommended
High-Performance Computing Accelerators
The EP3SL340H1152C4 serves as a co-processor in HPC clusters and FPGA-accelerated servers, where its 337,500 logic elements implement custom compute kernels for genomic analysis, financial Monte Carlo simulation, and machine learning inference. C4 commercial grade fits data-center cooling envelopes. The 744 user I/Os include PCIe hard IP interfaces for host bus connectivity. With 1.1 V core and 65 nm process, the device achieves good performance-per-watt versus older FPGAs. Use OpenCL or Intel's DSP Builder to compile compute kernels, and pair the FPGA with DDR3/QDRII+ external memory for high-bandwidth data sets. Heatsink or forced airflow is typically required at full utilization.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340H1152C4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340H1152C3 | EP3SL340H1152C3N | EP3SL340H1152C2 | EP3SL340H1152C2N |
|---|---|---|---|---|---|
| Package | 1152-BGA FCBGA | 1152-BGA FCBGA (same) | 1152-BGA FCBGA (same) | 1152-BGA FCBGA (same) | 1152-BGA FCBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C4 (fastest commercial) | C3 (faster than C4? - see note) | C3 + lead-free | C2 (slower) | C2 + lead-free |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| User I/Os | 744 | 744 | 744 | 744 | 744 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
Key Differentiators
- Highest commercial speed grade within Stratix III L family in 1152-BGA (vs EP3SL340H1152C3)
- Lead-free C4 grade variant available (vs EP3SL340H1152C3N)
- Maintains identical 337,500 LE density across speed grades (vs EP3SL340H1152C2)
Design Notes
The 1152-BGA package requires a multi-layer PCB (minimum 8 layers recommended) with microvia or via-in-pad technology for inner-row BGA balls. Use controlled-impedance routing for all high-speed transceiver channels and provide a solid ground plane beneath the FPGA. Allocate at least 4 PCB layers for power/ground planes to deliver the 1.1 V VCCINT core rail within 3% tolerance. Keep all decoupling capacitors within 100 mils of their respective pins, with a mix of bulk (10-22 uF), mid-range (0.1 uF), and high-frequency (1 nF) ceramic capacitors. BGA fan-out should use 0.8 mm or 1.0 mm pitch escape routing.
Estimated: at full logic utilization with 744 simultaneously-switching I/Os at 100 MHz, the EP3SL340H1152C4 may dissipate 8-12 W. The 1152-BGA package has a typical theta_JA of approximately 8-12 C/W with adequate PCB thermal vias. A heatsink or forced-air cooling (200 LFM minimum) is recommended for high-utilization designs. Place multiple thermal vias in the BGA land pattern beneath the die to conduct heat to internal ground planes. Without thermal management, junction temperature can exceed 100C at full load, triggering thermal-induced timing degradation even within the commercial 0-85C ambient range.
Use a low-noise LDO or high-efficiency DC-DC regulator for the 1.1 V VCCINT rail; the Stratix III core is sensitive to voltage ripple above 2%. VCCAUX (2.5 V) and VCCPD (3.3 V or 2.5 V depending on I/O standard) require separate regulation. According to the Stratix III handbook, power-on sequencing requires VCCINT to ramp before or simultaneously with VCCAUX and VCCPD to prevent latch-up. Use a power-supply sequencer IC or design RC delays on the enable pins of each rail. Decouple each voltage domain with bulk and high-frequency capacitors near the FPGA supply pins.
Do not assume the C4 speed grade means 'fastest' - Stratix III uses a reverse numbering where lower numbers indicate faster bins (C2 > C3 > C4). Verify configuration mode pins (MSEL[2:0]) match your selected configuration scheme (AS, PS, FPP, JTAG). The configuration memory is volatile - a non-volatile configuration device (EPCS) is mandatory unless the host processor loads the bitstream via JTAG or PCIe at every power-up. Ensure all unused I/O pins are configured as tri-stated inputs with weak pull-ups in the Quartus II pin assignment file.
Compliance Information
RoHS/REACH/lead-free status not explicitly stated in verified distributor listings. The N-suffix variants (EP3SL340H1152C3N, EP3SL340H1152C2N) indicate lead-free compliance per Altera/Intel nomenclature. Confirm with the manufacturer or your distributor before committing to lead-free assembly.
