EP3SL340H1152C4N - 340K LE Stratix III L FPGA, 1152-BGA | Intel
MPN: EP3SL340H1152C4N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1560 | $156,000.00 |
| 500 | $1395 | $697,500.00 |
| 1,000 | $1245 | $1,245,000.00 |
EP3SL340H1152C4N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined by user-supplied configuration data rather than hard-wired masks. Stratix III FPGAs occupy the high-performance tier of the Intel (Altera) programmable-logic hierarchy, sitting above Cyclone (low-cost) and Arria (mid-range) families and below the newer Stratix IV/V/10 families. Within Stratix III, the L sub-family is engineered for low-power operation while retaining the same MultiTrack interconnect, TriMatrix memory blocks, and DSP block architecture as the E sub-family.
Key features of the EP3SL340H1152C4N include 13500 Logic Array Blocks (LABs), dedicated high-speed transceivers, embedded multiplier and accumulator DSP blocks, programmable power technology (the only Stratix III device with this feature), and integrated PLLs for clock synthesis. The device supports configuration via passive serial, fast passive parallel, and active serial modes and includes built-in security features for bitstream encryption. Programmable Power Technology allows unused logic and routing resources to be biased to a low-power state, reducing dynamic power by up to 50 percent compared to fixed-bias designs.
The silicon architecture combines adaptive logic modules (ALMs) packed in 13500 LABs with embedded SRAM organised as TriMatrix memory (MLAB, M9K, M144K blocks) and dedicated 18x18 multipliers. High-speed serial transceivers support multi-gigabit interfaces, and the device is qualified for commercial temperature operation only (0C to 85C).
Typical applications include high-end telecommunications line cards, military radar baseband preprocessing, ASIC prototyping, high-performance DSP pipelines, and high-throughput data-acquisition systems. For aerospace and industrial applications where extended temperature is required, designers should select the I-grade variant (EP3SL340H1152I4N). The large 1152-ball package also enables very high pin-count interfaces such as DDR3 memories, multi-port Ethernet, and PCI Express Gen1/Gen2 hard IP.
A key design consideration for the EP3SL340H1152C4N is that the FCBGA package requires a multi-layer PCB with controlled-impedance routing, microvia or via-in-pad construction, and a heatsink or thermal pad to keep junction temperature within the 0C to 85C commercial window during sustained high toggle-rate workloads. Engineers should follow the Stratix III handbook pin connection guidelines to leave unused transceiver and clock pins tied to defined states.
This page synthesises distributor pricing, drop-in alternatives within the Stratix III family, and practical design notes that are not collated in any single source on the manufacturer datasheet.
Drop-in alternatives for EP3SL340H1152C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340H1152C4N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Core Voltage, Operating Temperature Grade.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL340H1152C4LN
β Drop-Inβ In Stock
$1980 / Unit
View Datasheet βEP3SL340H1152C4
β Drop-Inβ In Stock
$11000 / Unit
View Datasheet βEP3SL340H1152C3N
β Drop-Inβ In Stock
$1895 / Unit
View Datasheet βEP3SL340H1152C3
β Drop-Inβ In Stock
$2550 / Unit
View Datasheet βEP3SL340H1152C2N
β Drop-Inβ In Stock
$3400 / Unit
View Datasheet βEP3SL340H1152I4N
β Drop-Inβ In Stock
$2150 / Unit
View Datasheet βEP3SL340H1152C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Embedded Memory Bits | 18,821,144 |
| User I/Os | 744 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Maximum Internal Frequency | 800 MHz (data); 500 MHz (logic) |
| Package | 1152-ball FCBGA (FineLine BGA) |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | 4 |
| Configuration Methods | Passive Serial, Fast Passive Parallel, Active Serial |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3SL340H1152C4N 1152-ball fcbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3SL340H1152C4N (1152-ball fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340H1152C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340H1152C4N is suitable for 6 applications: Telecommunications Line Cards, ASIC Prototyping, High-Performance DSP Pipelines, Military Radar Baseband Processing, High-Throughput Data Acquisition Systems, Industrial Test and Measurement.
Telecommunications Line Cards
The EP3SL340H1152C4N's 337,500 logic elements, 18,821,144 bits of embedded TriMatrix memory, and high-speed serial transceivers make it well-suited to multi-protocol line-card designs. With 744 user I/Os, the device can simultaneously interface to multiple external memories and backplane SERDES links. The Programmable Power Technology reduces dynamic power by up to 50% on lightly-loaded logic paths, lowering system heat dissipation versus the Stratix III E sub-family. In a typical OTN/SONET framer or packet-processor application, the L340 fabric runs at 500 MHz logic while transceiver channels handle multi-gigabit links, all in the FCBGA-1152 footprint that fits standard AMC/ATCA board areas.
Recommended
ASIC Prototyping
The EP3SL340H1152C4N delivers 337,500 equivalent LEs, making it large enough to prototype multi-million-gate ASICs by partitioning the design across multiple FPGAs via the dedicated high-speed transceivers. The TriMatrix embedded memory (18,821,144 bits) accurately emulates SRAM blocks used in ASIC designs, while the 65 nm CMOS process preserves real-world timing behaviour. Quartus II design software supports rapid multi-FPGA partitioning, and the FCBGA-1152 package provides enough user I/Os (744) for the chip-to-chip interconnect required in prototype boards. Compared with the E sub-family, the L variant offers lower static power, allowing longer soak tests without thermal runaway.
Recommended
High-Performance DSP Pipelines
With dedicated 18x18 multiplier blocks and TriMatrix memory, the EP3SL340H1152C4N efficiently implements FIR filters, FFT engines, and channeliser pipelines used in radar and software-defined radio baseband processing. The 1.1 V core at 65 nm CMOS delivers the logic throughput required for multi-gigasample-per-second aggregate data rates, while the 744 user I/Os support wide parallel ADC/DAC interfaces. Programmable Power Technology lets unused DSP slices idle in a low-power state, reducing thermal load during sparse-data intervals. Designers typically pair the L340 with external DDR2/DDR3 memories and clock the fabric at 500 MHz to balance timing-margin and power efficiency.
Recommended
Military Radar Baseband Processing
The commercial-grade EP3SL340H1152C4N (0C to +85C) is well-suited to lab and ground-station radar baseband processing where extended temperature is not required. Its 337,500 LEs and 18,821,144 bits of embedded memory enable beamforming, pulse compression, and MTI filtering at real-time rates. The integrated high-speed transceivers deliver raw digitiser data straight into the fabric, and the FCBGA-1152 package supports the wide external-memory buses required for storing radar range-Doppler maps. For fielded systems requiring -40C to +100C operation, the drop-in EP3SL340H1152I4N provides the same silicon with industrial-grade qualification per Intel's device nomenclature rules.
Recommended
High-Throughput Data Acquisition Systems
The EP3SL340H1152C4N's 744 user I/Os and TriMatrix memory blocks make it an excellent FPGA for multi-channel data-acquisition cards streaming ADC data into DDR3 memories and onward over PCIe. The 65 nm CMOS fabric runs user logic at up to 500 MHz while the integrated transceivers handle Gen1/Gen2 PCIe hard IP, eliminating an external bridge chip. The Programmable Power Technology reduces system-level power by idling unused LABs during slower acquisition scans. Designers commonly use the L340 as the central FPGA on PCIe-over-cable or 10 Gigabit Ethernet data-acquisition boards that digitise signals at hundreds of megasamples per second.
Recommended
Industrial Test and Measurement
The EP3SL340H1152C4N is widely deployed in bench-top and rack-mount test equipment where its 337,500 LEs can implement complex stimulus-response patterns, mixed-signal protocol analysers, and parallel-bit-error-rate testers. The 1152-ball FCBGA footprint accommodates the dense pin-out required for parallel LVDS channels used to interface to DUT fixtures, and the 18,821,144 bits of embedded memory buffer large capture buffers without external SRAM. The L sub-family's lower static power simplifies chassis thermal design in continuous-duty test racks, and the commercial 0C to +85C temperature grade matches most indoor lab environments. The Quartus II SignalTap logic-analyser tool is fully supported on this device.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340H1152C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340H1152C4LN | EP3SL340H1152C4 | EP3SL340H1152C3N | EP3SL340H1152C3 | EP3SL340H1152C2N | EP3SL340H1152I4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory Bits | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | 4 | 4 | 4 | 3 (faster) | 3 (faster) | 2 (fastest) | 4 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Approx. Unit Price (USD, as of 2026-09-09) | 1,850 | 1,830 | 1,810 | 1,990 | 1,950 | 2,180 | 2,150 |
Key Differentiators
- Higher density (337,500 LEs) than the Stratix III E260 in the same package (vs EP3SE260H1152C4N)
- Lowest static power in the Stratix III family (vs EP3SE260H1152C4N)
- Commercial temperature drop-in upgrade path to industrial grade (vs EP3SL340H1152I4N)
Design Notes
Estimated: at maximum core activity the Stratix III L340 core can dissipate 8 to 12 W. With FCBGA-1152 theta_JA around 8 C/W in still air, junction temperature rises 60 to 95 C above ambient. For reliable 0-85C commercial operation, design the PCB with a thermal pad connected to an inner copper plane, attach a heatsink with thermal interface material rated at 0.2 C/W or better, and verify junction temperature in worst-case corner simulation using Quartus II PowerPlay. Source: Intel Stratix III Thermal Management guidelines.
The 1152-ball FCBGA package requires a high-density interconnect (HDI) PCB with microvia or via-in-pad construction, 8 to 10 routing layers, and matched impedance traces for all high-speed interfaces. Use the Intel-provided .bsp board files from the Quartus II installation to validate stack-up and trace lengths. Recommended escape: dog-bone or via-in-pad microvias with a 0.4 mm pitch. All transceiver channels require 85 ohm differential impedance, and DDR3 interfaces need 50 ohm single-ended with matched-length matching within 25 ps. Source: Intel Stratix III Hardware Design Guidelines.
Do not leave unused transceiver and clock pins floating; tie them to defined logic levels per the Stratix III pin connection guidelines or the device may draw excess current and fail configuration. Always issue the Quartus II 'Pin-Out' check after every pin assignment change. The configuration EPCS/EPCQ flash must be programmed with the correct compression and encryption settings; mismatched files will trigger configuration errors that look like silicon faults. Source: Intel AN 521 (Stratix III configuration).
Estimated: for 250 MHz DDR3 interfaces to external memories, signal integrity simulations should be performed using the IBIS models provided by Intel. Fly-by topology is preferred over T-branch for clock and address lines. Place series-termination resistors within 200 mil of the FPGA driver pin, and add 0.1 uF decoupling capacitors within 50 mil of every VCC pin. Use a 4-layer board minimum with dedicated ground and power planes for clean return paths.
Compliance Information
RoHS and lead-free compliance per Intel material declaration. AEC-Q100 is not applicable to FPGAs (this is an automotive IC qualification standard). Halogen-free status not explicitly stated in available data; consult Intel directly for confirmation.
