EP3SL50F484C3 - 47,500-Cell, 500MHz FPGA | Intel
MPN: EP3SL50F484C3 ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3SL50F484C3 Overview
An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic, routing resources, and configurable input/output blocks. It belongs to the hierarchy programmable logic device -> FPGA -> digital integrated circuit -> semiconductor. Unlike a fixed-function ASIC, an FPGA can be configured after manufacturing, allowing interface timing, datapaths, control logic, and protocol functions to be adapted without producing a new physical chip.
The principal verified features are 47,500 cells, 1,900 logic array blocks, 296 I/Os, 484 package pins, 500 MHz listed frequency, and 800 MHz internal frequency. The 65-nm process and 1.1 V supply identify the device as a member of the low-power, high-performance Stratix III generation. The FC-FBGA package provides a high-density ball-grid interface for complex board designs with many external connections.
EP3SL50F484C3 is suitable for applications requiring parallel processing, custom interfaces, and hardware-level protocol handling. Its 296 listed I/Os can support multiple external buses, while its programmable logic fabric can implement state machines, filters, memory controllers, and signal-processing datapaths. The distinction between the 500 MHz listed frequency and 800 MHz internal frequency should be considered when comparing device families or interpreting aggregate distributor specifications.
Typical applications include industrial automation controllers, telecommunications equipment, test and measurement systems, and high-speed data-acquisition platforms. It can also serve in networking and communications systems where custom packet processing or interface conversion is required. Designers should use the complete manufacturer documentation and Intel FPGA tool flow to validate timing, power, configuration, and pin assignments before release.
A key design consideration is package complexity: the 484-ball FC-FBGA footprint requires controlled PCB layout, correct escape routing, and exact ball mapping. Because the verified sources do not provide a complete 484-pin net list, engineers should obtain the manufacturer pinout and device-family documentation before schematic capture, PCB design, or replacement analysis.
This page combines verified distributor specifications, commercial availability, package context, application guidance, and explicit data-gap reporting. It helps engineers distinguish confirmed EP3SL50F484C3 values from parameters that require the official manufacturer datasheet.
Drop-in alternatives for EP3SL50F484C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F484C3 (same form factor and footprint) — differing in Package, Operating Temperature, Family, Process Technology, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL50F484C2N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP3SL50F484C2G
✅ Drop-In✓ In Stock
$335 / Unit
View Datasheet →EP3SL50F484C2
✅ Drop-In✓ In Stock
$478.8 / Unit
View Datasheet →EP3SL50F484C3N
✅ Drop-In✓ In Stock
$458 / Unit
View Datasheet →EP3SL50F484C3G
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP3SL50F484C3 Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | Stratix III L |
| Logic Cells | 47,500 cells |
| Technology | 65 nm |
| Listed Frequency | 500 MHz |
| Internal Frequency | 800 MHz |
| Supply Voltage | 1.1 V |
| Logic Array Blocks | 1,900 LABs |
| User I/O | 296 I/Os |
| Package | 484-pin FC-FBGA |
| Pin Count | 484 pins |
| Package Type | FBGA-484 |
| Operating Temperature | 0 °C to 85 °C |
| Device Category | Programmable logic IC |
| Mounting Type | Surface Mount |
| Manufacturer Technology Description | 65-nm low-power high-performance FPGA |
EP3SL50F484C3 fbga-484 Pin Configuration Guide
Pin configuration for EP3SL50F484C3 (fbga-484 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F484C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F484C3 is suitable for 6 applications: Industrial Automation Controllers, Telecommunications Equipment, Test and Measurement Systems, High-Speed Data Acquisition, Networking and Communication Controllers, Custom Digital Signal Processing.
Industrial Automation Controllers
EP3SL50F484C3 fits industrial automation controllers that require parallel deterministic logic and numerous external connections. Its 47,500 cells and 1,900 LABs can support state machines, sensor-data aggregation, motion-control sequencing, and custom communication bridges, while the listed 296 I/Os provide capacity for multiple digital interfaces. The 1.1 V supply and 65-nm technology are consistent with a programmable logic platform designed for dense logic integration. A 500 MHz listed frequency and 800 MHz internal-frequency specification should not be treated as a guarantee for every user design; timing closure depends on the implemented configuration, clock architecture, routing, and manufacturer constraints. The 0 °C to 85 °C operating range supports commercial and controlled industrial environments. Designers should reserve pins for configuration, clocks, debugging, and I/O-bank compatibility, then validate signal integrity at the actual board edge.
Recommended
Telecommunications Equipment
EP3SL50F484C3 is suitable for telecommunications equipment requiring configurable datapaths, protocol adaptation, and hardware-based traffic handling. The FPGA’s 47,500 cells provide a substantial resource base for packet classification, framing, error detection, and interface conversion, while 296 listed I/Os can connect multiple parallel data streams. Its Stratix III L-family identity and 65-nm process provide a high-density programmable-logic foundation. The verified 500 MHz listed frequency and 800 MHz internal frequency are useful as family-level reference points, but actual throughput depends on clock rates, logic utilization, memory implementation, and I/O standards. The 484-pin FC-FBGA package supports dense board placement but requires careful signal routing, controlled impedance, and power-delivery planning. For telecom designs, confirm transceiver availability, supported I/O standards, jitter performance, configuration mode, and timing constraints from the official device documentation before committing to the device.
Recommended
Test and Measurement Systems
EP3SL50F484C3 can support test and measurement systems that need simultaneous signal capture, deterministic processing, and flexible instrument interfaces. The 47,500-cell fabric can implement timing generators, trigger logic, digital filters, counters, and custom measurement algorithms, while 296 I/Os offer many connections for acquisition modules and control buses. The listed 500 MHz frequency and 800 MHz internal frequency help describe the device family’s performance class, although they are not substitutes for application-specific timing analysis. The 0 °C to 85 °C range is appropriate for many controlled test environments. Because the package is a 484-pin FC-FBGA, layout should account for high-speed escape routing, simultaneous-switching noise, decoupling, and thermal paths. Engineers should also verify the supported configuration interface, clocking resources, I/O voltage compatibility, and any required intellectual-property functions in the manufacturer tool flow.
Recommended
High-Speed Data Acquisition
EP3SL50F484C3 is a candidate for high-speed data-acquisition platforms that combine parallel converters, custom buffering, and real-time digital processing. Its 47,500 cells and 1,900 LABs can implement acquisition sequencing, channel synchronization, filtering, decimation, and host-interface logic, while the listed 296 I/Os can support multiple converter or sensor interfaces. The 65-nm process and 1.1 V supply provide a dense logic implementation, but the system designer must separately validate converter data rates, clock jitter, setup and hold timing, and signal integrity. The 500 MHz listed frequency and 800 MHz internal frequency do not establish an end-to-end sampling rate; converter and board performance remain limiting factors. The 484-pin FC-FBGA package requires a controlled stack-up and close attention to power integrity. Confirm exact pin assignments, I/O-bank voltage rules, and supported configuration modes before schematic and PCB sign-off.
Recommended
Networking and Communication Controllers
EP3SL50F484C3 fits networking and communication controllers that require programmable protocol handling and deterministic hardware execution. The 47,500-cell architecture can support packet parsing, traffic shaping, queue management, framing, and custom interface adaptation, and the 296 listed I/Os allow connection to several buses or control channels. The 65-nm Stratix III L family is identified in the verified data as a low-power, high-performance FPGA family. The 500 MHz listed frequency and 800 MHz internal frequency are device-family figures, not guaranteed application throughput; design performance depends on clocking, routing congestion, memory behavior, and implemented interfaces. A 484-pin FC-FBGA package offers high connection density but makes power, grounding, impedance, and thermal layout important. Before selection, confirm supported I/O standards, clock resources, embedded memory, transceiver configuration, and the exact configuration interface in the official documentation.
Recommended
Custom Digital Signal Processing
EP3SL50F484C3 can be used in custom digital signal processing systems where fixed hardware blocks are insufficient or inflexible. Its 47,500 cells and 1,900 LABs support parallel FIR or IIR structures, correlation engines, encoders, modulators, and adaptive control logic, while 296 I/Os permit connection to ADC, DAC, memory, and host interfaces. The verified 500 MHz listed frequency and 800 MHz internal frequency describe the family’s performance context, but achieved sample rate and precision depend on arithmetic implementation, resource utilization, clock constraints, and data-converter performance. The 65-nm process and 1.1 V supply make power-aware architecture important. Designers should use manufacturer timing tools to close worst-case paths and verify whether required DSP, memory, and interface resources are available in the chosen device configuration. The 484-pin FC-FBGA package also requires a robust PCB stack-up and decoupling strategy.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F484C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F484C2N | EP3SL50F484C2G | EP3SL50F484C2 | EP3SL50F484C3N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 |
| Logic Cells | 47,500 cells | 47,500 cells | 47,500 cells | 47,500 cells | 47,500 cells |
| Logic Array Blocks | 1,900 LABs | 1,900 LABs | 1,900 LABs | 1,900 LABs | 1,900 LABs |
| User I/O | 296 I/Os | 296 I/Os | 296 I/Os | 296 I/Os | 296 I/Os |
| Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Supply Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Frequency | 500 MHz listed; 800 MHz internal | 500 MHz listed; 800 MHz internal | 500 MHz listed; 800 MHz internal | 500 MHz listed; 800 MHz internal | 500 MHz listed; 800 MHz internal |
| Cross-Reference Verification | Target MPN | Same-family candidate in Site MPN list; electrical equivalence not fully quantified | Same-family candidate in Site MPN list; electrical equivalence not fully quantified | Same-family candidate in Site MPN list; electrical equivalence not fully quantified | Same-family candidate in Site MPN list; electrical equivalence not fully quantified |
Key Differentiators
- Integrated programmable capacity (vs EP3SL50F484C2N)
- High-density I/O capability (vs EP3SL50F484C2G)
- Large FBGA interface (vs EP3SL50F484C3N)
Design Notes
The EP3SL50F484C3 uses a 484-pin FC-FBGA package, so PCB escape routing and stack-up selection should begin before schematic freeze. Use the manufacturer ball map to separate high-speed signals, clocks, configuration pins, power, and ground. Maintain continuous reference-plane continuity, verify via-in-pad or via-fanout rules, and use the exact package land pattern from the official package documentation. Do not create a footprint from a generic FBGA drawing because the verified sources do not supply ball numbering or package dimensions.
The verified specification identifies a 1.1 V supply voltage, but it does not provide rail tolerances, current demand, power-up sequencing, or decoupling values. Before design release, obtain the complete Stratix III L-family power guidance and apply the manufacturer-recommended regulators, bulk capacitance, local ceramic bypassing, and sequencing network. Estimated: using 1.1 V as the confirmed supply value only, total device power cannot be calculated without current or dissipation data, so no thermal or power figure is inferred.
Plan the configuration, clock, debug, and I/O-bank architecture together. The device exposes 296 user I/Os, but that count does not identify which signals can operate at every voltage or which banks share restrictions. Preserve access to configuration and JTAG or debug connections, place decoupling close to the relevant supply balls, and use controlled-impedance routing for fast external interfaces. Confirm exact I/O standards, differential-pair rules, termination requirements, and clock constraints in the official device documentation before layout.
The 65-nm FPGA and 484-pin FC-FBGA package create a concentrated thermal and power-delivery challenge. The supplied data does not include junction-to-air resistance, maximum junction temperature, or power consumption, so a reliable temperature-rise estimate cannot be produced. Use the official package thermal model, estimate expected utilization from the synthesized design, and provide sufficient copper, thermal vias, airflow, or board-level spreading where the application requires it. Treat 0 °C to 85 °C as the confirmed operating range, not a thermal-design limit.
Compliance Information
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Values are therefore reported as unknown rather than inferred.
