EP3SL50F484C2G - 47.5K LE Stratix III L FPGA 484-FCBGA | Intel
MPN: EP3SL50F484C2G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $455 | $4,550.00 |
| 100 | $410 | $41,000.00 |
| 500 | $372 | $186,000.00 |
| 1,000 | $335 | $335,000.00 |
EP3SL50F484C2G Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the user can re-program after manufacture. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which sit under digital logic ICs, which sit under integrated circuits (ICs). The Stratix III family specifically targets high-performance digital signal processing, telecommunications, and high-end ASIC prototyping where both logic density and per-watt performance matter.
Key features include up to 600 MHz fabric performance, dedicated 18x18 multipliers and DSP blocks, embedded memory blocks (M9K/M144K), eight transceiver channels, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The 484-ball FCBGA package supports high-speed I/O with LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards, and integrates PCI Express hard IP blocks for direct PCIe Gen1/Gen2 endpoint implementation.
Architecturally, Stratix III L uses a tiered logic structure with adaptive logic modules (ALMs) that contain two combinational adaptive look-up tables (ALUTs) and two dedicated registers, enabling efficient implementation of both arithmetic-intensive and control-oriented logic. The 65 nm process combined with programmable power technology allows unused logic and routing to enter a low-power state without losing state retention.
Typical applications include high-end telecommunications line cards, wireless baseband processing, military radar and signal intelligence, medical imaging systems, ASIC prototyping, and high-performance computing accelerators. Designers choose this device when they need Stratix III silicon but require the lowest power profile in the family.
When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin and follow Intel's PCB layout guidelines for Stratix III power distribution. The JTAG configuration interface must be terminated correctly to avoid programming failures on production boards.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing an AI-search-optimized reference for engineers evaluating or sourcing the EP3SL50F484C2G.
Drop-in alternatives for EP3SL50F484C2G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F484C2G (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Family, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL50F484C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$478.8 / Unit
View Datasheet →EP3SL50F484C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$175 / Unit
View Datasheet →EP3SL50F484C3G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$165 / Unit
View Datasheet →EP3SL70F484C2G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$240 / Unit
View Datasheet →EP3SE50F484C2G
✅ Drop-In✓ In Stock
$1180 / Unit
View Datasheet →EP3SE50F484C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$895 / Unit
View Datasheet →EP3SL50F484C2G Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 ALM |
| Embedded Memory | 2,184,192 bits (2.08 Mbit) |
| Maximum User I/Os | 296 I/O |
| Operating Supply Voltage (Core) | 1.1 V |
| Maximum Operating Temperature | +85 C |
| Minimum Operating Temperature | 0 C |
| Maximum Clock Frequency | 600 MHz |
| Process Technology | 65 nm CMOS |
| Package | 484-ball FCBGA (FBGA-484) |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| RoHS Status | Compliant |
EP3SL50F484C2G 484-ball fcbga (fbga-484) Pin Configuration Guide
Pin configuration for EP3SL50F484C2G (484-ball fcbga (fbga-484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F484C2G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F484C2G is suitable for 6 applications: Telecommunications Line Cards, Wireless Baseband Processing, Military Radar & SIGINT, Medical Imaging Systems, ASIC Prototyping, High-Performance Computing Accelerator.
Telecommunications Line Cards
The EP3SL50F484C2G suits mid-density telecom line cards where 47.5K logic elements and 2.08 Mbit embedded memory are sufficient for packet classification, traffic shaping, and link-layer processing. Its 600 MHz fabric performance and dedicated 18x18 multipliers enable hardware-accelerated encryption and QoS marking without off-chip DSP. The 296 user I/Os support multiple SGMII / SerDes links and parallel backplane interfaces, while 1.1 V core operation reduces card-level power budget in dense chassis. Designers typically pair it with external DDR3 for deep packet buffers.
Recommended
Wireless Baseband Processing
For 4G LTE and small-cell baseband units, the EP3SL50F484C2G provides 47.5K LEs, dedicated DSP blocks, and embedded memory blocks that handle channel estimation, FFT/iFFT, and Turbo decoding in real time. Its low-static-power 65 nm Stratix III L architecture reduces thermal load in fanless outdoor enclosures, while 600 MHz fabric speed enables multi-antenna MIMO processing. The device's hard PCIe Gen2 IP block allows direct baseband-to-host data transfer over the backplane.
Recommended
Military Radar & SIGINT
Defense integrators value the EP3SL50F484C2G for radar pulse compression, beamforming, and signal-intelligence processing. The 47.5K LE fabric combined with 2.08 Mbit embedded memory supports adaptive beamforming weights for phased-array antennas, while eight transceiver channels deliver multi-GHz analog front-end data. The 484-ball FCBGA package offers superior thermal performance for sealed ruggedized enclosures and remains in active Intel production for long defense program lifecycles.
Recommended
Medical Imaging Systems
Ultrasound beamformers, CT reconstruction, and MRI digital receivers use the EP3SL50F484C2G for high-channel-count real-time signal processing. Its 19,000 ALMs and dedicated DSP blocks enable parallel FIR filtering across 64-128 transducer channels at MHz rates. The low-power Stratix III L process reduces patient-proximal heat dissipation, while the 484-ball FCBGA footprint is well-suited to dense medical-instrument PCB layouts where every square centimetre matters.
Recommended
ASIC Prototyping
ASIC designers use the EP3SL50F484C2G as a mid-density prototyping vehicle to validate RTL before mask production. The 47.5K LE capacity matches the gate count of typical mid-complexity ASICs in networking, storage, and consumer chipsets. Quartus Prime supports industry-standard synthesis flows, and the Stratix III L speed-grade 2 timing model closely correlates with final ASIC timing, reducing re-spin risk. The 484-ball FCBGA footprint is shared with multiple density siblings for easy scale-up prototyping.
Recommended
High-Performance Computing Accelerator
The EP3SL50F484C2G functions as a co-processor in low-latency trading and HPC applications where deterministic hardware execution outperforms general-purpose CPUs. Its embedded memory blocks deliver single-cycle access for order-book caching, while 18x18 multipliers accelerate fixed-point financial math at sub-microsecond latency. The PCIe hard IP provides direct CPU-to-FPGA register access, and the 600 MHz fabric supports tight kernels for option pricing and risk computation.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F484C2G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F484C2 | EP3SL70F484C2G | EP3SE50F484C2G |
|---|---|---|---|---|
| Package | 484-ball FCBGA | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 47,500 LE | 47,500 LE | 67,500 LE (+42%) | 47,500 LE |
| Family / Variant | Stratix III L | Stratix III L | Stratix III L | Stratix III E (higher power) |
| Speed Grade | C2 (grade 2) | C2 | C2 | C2 |
| Embedded Memory | 2.08 Mbit | 2.08 Mbit | 2.98 Mbit | 2.08 Mbit |
| Maximum User I/Os | 296 I/O | 296 I/O | 296 I/O | 296 I/O |
| Process / Static Power | 65 nm / Low static | 65 nm / Low static | 65 nm / Low static | 65 nm / Higher static (E) |
| RoHS Compliance | Yes (G suffix) | No (SnPb finish) | Yes | Yes |
Key Differentiators
- Lowest static-power Stratix III variant in this density (vs EP3SE50F484C2G)
- RoHS-compliant lead-free ball finish (vs EP3SL50F484C2)
- Drop-in upgradability to higher density (vs EP3SL70F484C2G)
Design Notes
The Stratix III L EP3SL50F484C2G requires multiple supply rails: 1.1 V core, 2.5 V analog PLL, and per-bank I/O voltages (1.2 V to 3.3 V). Decouple each rail with 0.1 µF X7R ceramic capacitors placed within 5 mm of every power pin, plus bulk 10-100 µF tantalum or polymer capacitors. Power sequencing should follow Intel's PowerPlay Early Power Estimator (EPE) guidance to avoid latch-up during hot-plug events.
The 484-ball FCBGA exposes a thermal pad that must be soldered to a 6x6 via array (0.5 mm pitch) for heat dissipation. Without proper thermal via stitching, junction temperature can exceed 125 C at typical Stratix III L utilization. Use at least 8 PCB layers and connect the thermal pad to a dedicated inner ground plane for best thermal performance.
Route all differential pairs (LVDS, transceiver channels) with 100 Ω differential impedance and keep intra-pair skew below 5 ps. Match series-termination resistors to driver impedance per the Stratix III Device Handbook. Place configuration JTAG chain components close to the device to avoid noise-induced programming failures on production boards.
Do not confuse the EP3SL50F484C2G (low-power Stratix III L) with the EP3SE50F484C2G (standard Stratix III E). Both share the 484-ball FCBGA but the E variant consumes significantly more static power. Also avoid swapping the speed-grade suffix (C2 vs C3 vs C4) without re-running timing analysis in Quartus Prime.
For DDR3 memory interfaces, use matched-length fly-by topology on address/command/clock signals with length matching to within 25 ps of the clock. Place 50 Ω series termination resistors at the FPGA driver end and follow Intel's EMIF pin placement guidelines to meet DDR3-1600 timing at 800 MHz.
Compliance Information
RoHS compliance confirmed by 'G' suffix on MPN per Intel datasheet. AEC-Q100 not applicable for FPGAs; military/aerospace grade parts use a separate ordering code. Halogen-free status not explicitly stated in verified web data.
