EP3SL50F484C2N - Stratix III L FPGA, 47.5K LE, 484-FBGA | Altera
MPN: EP3SL50F484C2N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 100 | $230 | $23,000.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $175 | $175,000.00 |
EP3SL50F484C2N Overview
An FPGA is a programmable logic device containing an array of configurable logic blocks (CLBs / LABs) interspersed with programmable interconnect, surrounded by hardened peripherals such as transceivers, memory controllers, PLLs, and DSP blocks. FPGAs differ from microcontrollers by offering hardware parallelism with deterministic timing, and differ from ASICs by being field-reprogrammable. Within the power-management and signal-processing hierarchy, FPGAs typically sit between the data converters / sensors and the host processor, performing real-time pre-processing, protocol bridging, and high-bandwidth glue logic.
The Stratix III L family positions itself in the low-power tier of the Stratix III generation, reducing static and dynamic power versus the standard Stratix III while preserving 600 MHz fabric performance and abundant DSP blocks for fixed- and floating-point arithmetic. The device integrates up to 4 phase-locked loops, 296 user I/Os, and supports configuration via JTAG, passive serial, or Altera-specific fast passive parallel schemes. Memory interfaces up to DDR3/DDR2 are hardened through dedicated PHY blocks, simplifying high-bandwidth external memory attachment.
The FC-FBGA-484 package is a high-pin-count organic substrate BGA with flip-chip die attach, providing excellent thermal and electrical performance for the 600 MHz fabric. The high I/O count supports wide parallel buses, multiple high-speed serial lanes, and abundant LVDS pairs. Industrial-grade temperature screening and Pb-free (RoHS-compliant) materials make the part suitable for harsh-environment deployment in telecom base stations, radar front-ends, software-defined radio platforms, and digital video broadcast equipment.
Typical applications include high-speed packet processing in network switches, channel aggregation in wireless base stations, image processing pipelines in machine vision, and ASIC prototyping where fast iteration is required. Designers select the EP3SL50F484C2N when low static power is mandatory but logic capacity must remain sufficient for complex state machines and DSP filter chains.
Designers should pay attention to power supply decoupling (multiple low-impedance rails with bulk + ceramic capacitors near every supply pin), JTAG chain integrity for configuration, and I/O bank supply grouping β I/O standards such as LVDS, LVPECL, HSTL, and SSTL require dedicated VCCIO rails per bank. Thermal management through PCB copper pours and the package thermal pad is recommended given the 600 MHz operating frequency.
Drop-in alternatives for EP3SL50F484C2N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F484C2N (same form factor and footprint) β differing in Package, Operating Temperature, Family, Process Technology, Speed Grade.
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EP3SL50F484C3N
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View Datasheet βEP3SE50F484C2N
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View Datasheet βEP3SE50F484C2G
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View Datasheet βEP3SE50F484C2
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View Datasheet βEP3SL50F484C2N Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory | 2,184,192 bits |
| User I/Os | 296 |
| Operating Frequency | 600 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.1 V |
| Package | 484-ball FC-FBGA (Flip-Chip) |
| Package Code | BGA |
| Package Shape | Square |
| Mounting Type | Surface Mount |
| Temperature Grade | Industrial (C2) |
| Lead-Free / RoHS | Yes (compliant) |
| Configuration Method | JTAG / Passive Serial / FPP |
EP3SL50F484C2N square Pin Configuration Guide
Pin configuration for EP3SL50F484C2N (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F484C2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F484C2N is suitable for 7 applications: Software Defined Radio (SDR), High-End ASIC Prototyping, Industrial Motor Control & Drive, Medical Imaging Acceleration, Network Packet Processing, Military / Aerospace Avionics, High-Performance Test & Measurement.
Software Defined Radio (SDR)
The EP3SL50F484C2N is well suited to SDR baseband processing where 47,500 logic elements, 1,900 LABs, and 2,184,192 bits of embedded memory enable multi-channel I/Q demodulation, FFT pipelines, and adaptive filtering at sample rates up to 600 MHz. Its low static power (Stratix III L variant) suits portable / field-deployable radio platforms where thermal budget is constrained. The device's abundant LVDS pairs and flexible I/O banks ease interface to wide-bandwidth ADC/DAC front ends, while embedded PLLs provide the deterministic clock distribution that SDR systems require. Compared to a microcontroller, the FPGA's parallelism handles 100s of OFDM subcarriers in real time without processor loading.
Recommended
High-End ASIC Prototyping
Engineers targeting high-density ASIC designs use the EP3SL50F484C2N as a hardware-emulation vehicle for pre-silicon verification. The 47.5 KLE fabric plus 2.18 Mbit embedded memory is large enough to host modern image-processing, codec, and network-stack ASIC RTL, while the 600 MHz fabric performance provides reasonable emulation speed. The 484-FBGA package supports wide multi-bus interconnects needed for prototype-to-ASIC mapping, and the JTAG-based configuration path allows fast design iteration. Compared to smaller Cyclone-class devices, the Stratix III L provides the headroom to prototype sub-65 nm ASIC blocks before tape-out.
Recommended
Industrial Motor Control & Drive
The EP3SL50F484C2N serves as a high-performance digital motor controller in industrial drives, where the FPGA's 600 MHz fabric and abundant DSP blocks implement field-oriented control (FOC), space-vector PWM, and high-bandwidth current loops with sub-microsecond latency. The 296 user I/Os handle multi-axis encoder feedback, resolver inputs, and gate-driver interfaces, while the 1.1 V core supply enables fanless operation in sealed enclosures. The industrial temperature grade (C2, 0 Β°C to +85 Β°C) supports factory-floor deployment. Compared to microcontrollers, the FPGA runs deterministic multi-axis control with no jitter from interrupt preemption.
Recommended
Medical Imaging Acceleration
In medical imaging systems such as ultrasound and CT scanners, the EP3SL50F484C2N accelerates beamforming, image reconstruction, and signal conditioning pipelines where real-time throughput is mandatory. The 2.18 Mbit embedded memory provides local buffering for high-bandwidth transducer arrays, while the 47.5 KLE fabric runs parallel processing for back-projection or synthetic-aperture algorithms at line rates of 600 MHz. The 484-FBGA package supports the high pin counts needed for multi-channel analog-front-end integration. Compared to GPU-based accelerators, the FPGA offers deterministic latency and lower power per channel, critical in clinical point-of-care devices.
Recommended
Network Packet Processing
Telecom and datacom designers use the EP3SL50F484C2N for wire-speed packet classification, deep-packet inspection, and queue management in routers and switches. The 600 MHz fabric with abundant M9K / MLAB memory blocks performs parallel lookups, hash computations, and traffic shaping at line rates of multi-gigabit Ethernet. The 296 user I/Os support multi-lane SGMII / SerDes aggregation and external TCAM interfaces. Compared to fixed-function NPUs, the FPGA offers reprogrammable flexibility to support evolving protocols and feature rollouts without hardware changes.
Recommended
Military / Aerospace Avionics
The EP3SL50F484C2N is widely used in avionics and military signal-processing platforms where its 47.5 KLE fabric supports radar, electronic-warfare, and secure-communications payloads. The Stratix III L variant's low static power is valuable for size-, weight-, and power-constrained (SWaP) applications, while the 484-FBGA package meets ruggedization requirements through qualified substrate and assembly processes. The 600 MHz performance handles real-time beamforming and cryptoprocessing workloads that would saturate a microcontroller. Designers should pair the FPGA with industrial-extended temperature screening for worst-case mission profiles.
Recommended
High-Performance Test & Measurement
In bench-top and production test equipment, the EP3SL50F484C2N acts as a programmable stimulus generator, real-time DSP engine, and protocol decoder for high-speed serial buses (PCIe, SATA, USB 3.0, custom links). The 600 MHz fabric can keep pace with multi-Gbps serial traffic while the 2.18 Mbit embedded memory buffers long capture windows for protocol analyzers. The 296 user I/Os accommodate parallel test-pin fan-out, and the JTAG chain simplifies integration into automated test frameworks. Compared to fixed-function T&M ASICs, the FPGA enables a single platform to support multiple protocols by simply reloading the configuration bitstream.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F484C2N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F484C3N | EP3SL50F484C2G | EP3SL50F484C2 | EP3SE50F484C2N | EP3SE50F484C2G | EP3SE50F484C2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Series / Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | 1,900 | 1,900 | 1,900 | 1,900 | 1,900 | 1,900 |
| Embedded Memory | 2,184,192 bits | 2,184,192 bits | 2,184,192 bits | 2,184,192 bits | 2,184,192 bits | 2,184,192 bits | 2,184,192 bits |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Operating Frequency | 600 MHz | 600 MHz (faster bin) | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V |
| Speed Grade | C2 | C3 (faster) | C2 | C2 | C2 | C2 | C2 |
| Lead-Free / RoHS | Yes (N suffix) | Yes | Yes | Leaded | Yes | Yes | Leaded |
Key Differentiators
- Lower-power Stratix III L variant for power-sensitive designs (vs EP3SE50F484C2N (Stratix III E))
- Faster speed grade available as direct upgrade path (vs EP3SL50F484C2N vs EP3SL50F484C3N)
- Drop-in lead-free / RoHS variant available (vs EP3SL50F484C2N vs EP3SL50F484C2)
Design Notes
The Stratix III L variant of EP3SL50F484C2N reduces static power versus the standard Stratix III but still requires multiple supply rails: VCCINT (1.1 V core), VCCIO (per-bank, 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V depending on I/O standard), VCCPD (3.3 V pre-driver), and VCCA_PLL (1.1 V PLL analog). Bulk decoupling of at least 220 Β΅F low-ESR ceramic per rail and 0.1 Β΅F / 0.01 Β΅F ceramic networks near every supply pin are mandatory. Estimate power consumption early using Altera's PowerPlay Early Power Estimator before laying out the PCB; underestimating can cause excessive junction temperature at industrial temperature limits.
Operating the EP3SL50F484C2N at 600 MHz in the 484-FBGA package can produce junction temperatures well above ambient under industrial-temperature conditions. Estimated theta_JA for this package is approximately 14 Β°C/W with adequate PCB copper area (>= 25 cmΒ² top + inner planes), but rises sharply with reduced copper. Add thermal vias beneath the BGA's thermal pad array and provide at least 4 inner power/ground planes stitched with a via grid to keep the silicon within its 0 Β°C to +85 Β°C junction envelope. Designers targeting the industrial-extended (I-grade) variant must perform full thermal characterization with the final bitstream loaded.
Place JTAG, MSEL (configuration mode), and POR configuration pins with strong pull-ups/down as specified by Altera's Stratix III pin connection guidelines. Match lengths within each byte group for LVDS pairs and within Β± 25 mils for DDR2/DDR3 interfaces. Use impedance-controlled stripline / microstrip routing for high-speed I/O banks; the Stratix III L is highly sensitive to mismatched impedance and over-/undershoot on high-drive I/O standards. Keep BGA fanout on a 1.0 mm pitch BGA escape pattern with at least 4 routing layers and a continuous ground reference plane beneath signal traces.
Common pitfalls with the EP3SL50F484C2N include (a) confusing the L and E family variants in a power budget, (b) ignoring MSEL configuration-mode settings and bricking the device at first power-up, (c) failing to provide clean clocks with proper PLL reference decoupling, and (d) using LVDS without matched 100 Ξ© termination at both ends. Per FindIC cross-reference data, EP3SL50F484C2N is pin-to-pin compatible with EP3SE50F484C2N, but power and timing margins differ β do not treat them as fully interchangeable without re-running the timing analyzer.
Compliance Information
RoHS / lead-free compliance inferred from the 'N' suffix per Altera / Intel FPGA Stratix III conventions. AEC-Q100 is not applicable to FPGAs. REACH and conflict-mineral declarations should be requested from the manufacturer for regulatory submissions.
