EP3SL50F484C4 - Stratix III L FPGA, 47.5K LE, 484-FBGA | Altera
MPN: EP3SL50F484C4 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $520.9 | $520.90 |
| 10 | $468.81 | $4,688.10 |
| 100 | $416.72 | $41,672.00 |
| 250 | $390.68 | $97,670.00 |
| 500 | $364.63 | $182,315.00 |
EP3SL50F484C4 Overview
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows designers to configure custom digital logic, memory hierarchies, and I/O protocols after fabrication. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> digital ICs -> semiconductors. The Stratix III family is engineered around a logic-rich, power-optimized architecture that balances the per-cell static leakage of 65 nm CMOS with rich DSP and memory blocks for DSP-centric applications.
Key features include 47,500 LEs, 2,184,192 embedded memory bits, 296 user I/Os, 1,900 LABs, and a high-speed transceiver capability supporting data rates up to 3.125 Gbps on the L device family. The device also integrates hard memory controllers, a programmable power technology that reduces dynamic power by up to 50% relative to previous generations, and a MultiTrack interconnect for predictable timing closure. Operating temperature spans 0C to 85C for the commercial "C" grade with 1.1 V core supply.
The architecture leverages adaptive logic modules (ALMs) with 8-input fracturable look-up tables, allowing efficient implementation of wide combinational and registered logic. TriMatrix embedded memory blocks include 64 Kb MLAB, 9 Kb M9K, and 144 Kb M144K blocks that can be cascaded for deep FIFOs, packet buffers, and DSP coefficient storage.
Typical applications include high-performance DSP for wireless baseband processing, high-speed serial protocol bridging (PCIe Gen1/2, Serial RapidIO, Gigabit Ethernet), broadcast video processing, and military/aerospace signal acquisition. The 296 user I/Os support parallel LVDS and DDR2/DDR3 memory interfaces without external bridge devices.
When designing with this device, consider that the 484-FBGA package has a 1.0 mm ball pitch and requires 4 to 6 layer PCB stack-up with controlled-impedance routing for high-speed transceivers. Power integrity analysis is essential because the device can exceed 8 W dynamic dissipation in transceiver-heavy designs.
This page synthesizes distributor pricing, drop-in Stratix III alternatives, and practical design notes not found on the manufacturer datasheet, including thermal envelope estimates for typical configuration bitstreams.
Drop-in alternatives for EP3SL50F484C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F484C4 (same form factor and footprint) — differing in Package, Operating Temperature, Family, Speed Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL50F484C4N
✅ Drop-In✓ In Stock
$325 / Unit
View Datasheet →EP3SL50F484C3
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP3SL50F484C3N
✅ Drop-In✓ In Stock
$458 / Unit
View Datasheet →EP3SL50F484C3G
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP3SL50F484C2
✅ Drop-In✓ In Stock
$478.8 / Unit
View Datasheet →EP3SL50F484C2N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP3SL50F484C2G
✅ Drop-In✓ In Stock
$335 / Unit
View Datasheet →EP3SE50F484C4
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP3SL50F484C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 47,500 |
| Embedded Memory Bits | 2,184,192 |
| Logic Array Blocks (LABs) | 1,900 |
| User I/Os | 296 |
| Package | 484-Ball FBGA |
| Ball Pitch | 1.0 mm |
| Operating Temperature | 0C to 85C (Commercial) |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm CMOS |
| Maximum Internal Frequency | 717 MHz |
| DSP Blocks | Yes (variable count) |
| Hard Memory Controllers | Yes |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
EP3SL50F484C4 484-ball fbga Pin Configuration Guide
Pin configuration for EP3SL50F484C4 (484-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F484C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F484C4 is suitable for 6 applications: Wireless Baseband DSP Processing, High-Speed Serial Protocol Bridging, Broadcast Video Processing, Military / Aerospace Signal Acquisition, Industrial Automation & Motor Control, Medical Imaging Acceleration.
Wireless Baseband DSP Processing
The EP3SL50F484C4's 47,500 LEs combined with dedicated DSP blocks and hard memory controllers make it well-suited for wireless baseband DSP chains including channelization, FFT/iFFT, and digital up/down-conversion. The Stratix III L family's power-optimized 65 nm architecture targets 50% dynamic power reduction vs Stratix II while preserving DSP throughput, and the 1.0 mm FBGA package integrates 296 user I/Os - enough to parallel-connect multiple antenna streams and DDR2/QDRII memories without external bridge chips.
Recommended
High-Speed Serial Protocol Bridging
With up to 3.125 Gbps transceiver capability and the L-family's power-efficient serializer/deserializer (SERDES) hard IP, the EP3SL50F484C4 enables bridging between PCIe Gen1/2, Serial RapidIO, and Gigabit Ethernet domains on a single chip. The 484-FBGA package exposes 296 user I/Os plus dedicated transceiver channels, allowing designers to fan-out multiple serial lanes to parallel LVCMOS or DDR3 interfaces without an external bridge ASIC. Real-world reference designs include PCIe-to-GE packet processors and multi-protocol radar front-end interfaces.
Recommended
Broadcast Video Processing
The EP3SL50F484C4's 2.18 Mbit embedded memory plus 6.5 Mbit distributed RAM provides sufficient frame-buffer and line-store capacity for SD/HD video processing at broadcast frame rates. The 296 user I/Os accommodate wide parallel video buses (e.g., 30-bit RGB at 1080p60) plus dedicated video sync, genlock, and serial digital interface (SDI) control pins. Designers can implement deinterlacers, scalers, color-space converters, and overlay mixers entirely in programmable logic, with the L family delivering better power efficiency than the E family for predominantly register-heavy video pipelines.
Recommended
Military / Aerospace Signal Acquisition
Military and aerospace signal acquisition systems benefit from the EP3SL50F484C4's combination of 47,500 LEs, hardened DSP blocks, and 296 I/Os for radar, electronic warfare, and SIGINT front-ends. The 65 nm CMOS process and integrated PLLs support sampling rates up to 717 MHz on internal clocks, enabling real-time FFT and beamforming pipelines. While the C4 commercial-grade part (0C to 85C) is specified for benign environments, the I-grade variant (EP3SL50F484I4) extends to -40C to +100C for harsh-embedded applications, using the same F484 footprint for drop-in thermal upgrade.
Recommended
Industrial Automation & Motor Control
Industrial motion-control and process-automation designs leverage the EP3SL50F484C4's high I/O count (296) to interface directly with multi-axis encoder arrays, resolver-to-digital converters, and isolated gate drivers. The hard memory controllers interface to DDR2/DDR3 SDRAM for trajectory table storage, and the DSP blocks accelerate Park/Clarke transformations and PID loops in firmware-free hardware. Compared to microcontroller alternatives, the L-family Stratix III delivers deterministic microsecond-cycle latency critical for multi-axis servo loops and fieldbus protocol offload.
Recommended
Medical Imaging Acceleration
Medical imaging modalities such as ultrasound beamforming, CT reconstruction, and MRI signal processing rely on the EP3SL50F484C4's combination of 47,500 LEs, embedded DSP blocks, and 2.18 Mbit block RAM to deliver real-time image reconstruction at clinical frame rates. The L-family's power-optimized ALM architecture enables integration of complete beamformer + image-processing pipelines in a single device while staying within thermal envelopes suitable for portable cart-based systems. The 484-FBGA's 296 I/Os connect directly to high-channel-count analog front ends and DDR2/DDR3 image buffers without bridge logic.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F484C4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F484C4N | EP3SL50F484C3 | EP3SL50F484C3N | EP3SL50F484C2 | EP3SE50F484C4 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-Ball FBGA | 484-Ball FBGA | 484-Ball FBGA | 484-Ball FBGA | 484-Ball FBGA | 484-Ball FBGA |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | ~50,900 (E family, ~7% more) |
| Embedded Memory Bits | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | ~2,234,112 (E family) |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | C4 (717 MHz Fmax) | C4 (717 MHz Fmax) | C3 (~80% of C4 Fmax) | C3 (~80% of C4 Fmax) | C2 (~70% of C4 Fmax) | C4 |
| Lead-Free (RoHS) | No | Yes | No | Yes | No | No |
| Operating Temperature | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
| Family Variant | Stratix III L (low power) | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (logic rich) |
Key Differentiators
- RoHS lead-free drop-in alternative (vs EP3SL50F484C4 (this product))
- Lower speed grade for thermal-constrained applications (vs EP3SL50F484C3)
- Logic-rich family variant for DSP-heavy designs (vs EP3SE50F484C4)
Design Notes
The 484-Ball FBGA package uses a 1.0 mm ball pitch and requires 4-6 layer PCB stack-up with laser-drilled microvias for the breakout. Per Altera's Stratix III hardware reference design AN 503, route all high-speed transceiver channels on the top layer with a continuous reference ground plane, and keep trace lengths matched within 0.127 mm to avoid transmitter pre-emphasis issues. All configuration, JTAG, and clock pins must be length-matched within 50 mil if the design uses dynamic phase alignment.
Estimated: at 50% resource utilization with all transceivers active and 200 MHz clock tree utilization, the EP3SL50F484C4 dissipates approximately 8-12 W. The 484-FBGA package's theta_JA of approximately 14 C/W (with 4-layer JEDEC test board) requires forced-air cooling or thermal vias to a 4-oz internal copper pour to keep junction below 100C. For OPN commercial-grade parts, derate above 70C ambient to preserve timing margin in hot industrial enclosures.
Power sequencing must follow Altera's recommended order: 2.5 V VCCPD before 1.1 V VCCINT, then 3.3 V VCCIO. Each supply should ramp within 0.2-100 ms with monotonic slew; use a sequencer IC such as the LTC2923 to enforce the order if hot-swap insertion is possible. Estimated: budget 4.0 W for core, 1.5 W for I/O, and 2.5 W for transceivers when sizing the 1.1 V regulator, and select an inductor with less than 30 mOhm DCR to minimize conduction loss at peak current draw.
Do not assume pinout compatibility between EP3SL50F484C4 and EP3SE50F484C4 - although both use the F484 FBGA, the I/O bank assignments for transceivers and PLL clock inputs differ between L and E variants per the Stratix III pin connection guidelines. Always run pin assignment verification in Quartus II after substituting an E-family part for an L-family part. Also note that configuration bitstreams are not interchangeable across families; regenerate the .sof/.pof files using the correct device selection.
Compliance Information
EP3SL50F484C4 uses lead-bearing terminal finish; choose EP3SL50F484C4N for RoHS-compliant designs. REACH compliance per manufacturer declaration. Not AEC-Q100 qualified (FPGAs are not typically AEC-Q100 qualified; industrial grade is the appropriate qualification level). Conflict-mineral compliance per Altera declaration.
