EP3SL50F484I3N - 47.5K LE Stratix III L FPGA 484-FBGA | Intel
MPN: EP3SL50F484I3N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $751.9 | $751.90 |
| 10 | $698.5 | $6,985.00 |
| 100 | $642.1 | $64,210.00 |
| 250 | $595 | $148,750.00 |
| 500 | $552.3 | $276,150.00 |
EP3SL50F484I3N Overview
An FPGA (Field Programmable Gate Array) is a programmable semiconductor device that engineers configure after manufacture to implement custom digital logic, DSP blocks, memory controllers, and high-speed serial interfaces. FPGAs sit at the top of the digital IC hierarchy: programmable logic device -> FPGA -> high-performance programmable logic. Unlike an ASIC or a fixed-function microcontroller, an FPGA's interconnect and logic fabric are rewritable in-system, making it ideal for prototyping, low-volume production, and applications that demand hardware-level parallelism such as signal processing, packet inspection, and high-speed I/O bridging.
Key features of the EP3SL50F484I3N include 47,500 logic elements, 2.1 Mbit embedded SRAM distributed across M9K memory blocks, dedicated 18x18 hardware multipliers for DSP, programmable signal integrity support with adaptive logic modules (ALMs), and Stratix III's low-power core logic with hot-socketing capability. The 484-pin FBGA (23x23 mm, 1.0 mm pitch) package supports high-speed transceiver-friendly board layouts while maintaining PCB escape routability. The Industrial temperature grade is denoted by the trailing 'I' in the part number.
From an architectural standpoint, the Stratix III L family uses an ALM-based logic fabric rather than the legacy 4-input LUT architecture, delivering higher packing density and lower dynamic power at equivalent performance. The device supports LVDS, SSTL, HSTL, and LVPECL I/O standards and integrates up to 8 phase-locked loops (PLLs) for multi-domain clock management.
Typical applications include high-performance digital signal processing, telecommunications baseband and packet processing, military and aerospace signal intelligence, test and measurement instrumentation front-ends, medical imaging accelerators, and high-speed serial protocol bridging. Designers choose the EP3SL50F484I3N when Stratix III L density with industrial temperature grading is required and the design will be migrated to Quartus II design software.
A critical design consideration: the EP3SL50F484I3N is part of the legacy Stratix III family, which is in long-term support mode. New designs should evaluate Cyclone IV/V or Stratix 10 alternatives, but existing hardware designs can continue to use this part with mature Quartus II tooling.
Drop-in alternatives for EP3SL50F484I3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F484I3N (same form factor and footprint) β differing in Package, Speed Grade, Embedded Memory, Process Technology, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL50F484I4N
β Drop-Inβ In Stock
$435 / Unit
View Datasheet βEP3SL50F484I3G
β Drop-Inβ In Stock
$215 / Unit
View Datasheet βEP3SL50F484I3
β Drop-Inβ In Stock
$701.23 / Unit
View Datasheet βEP3SE50F484I3N
β Drop-Inβ In Stock
$841.66 / Unit
View Datasheet βEP3SL50F484I3N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory | 2,184,192 bits (2.1 Mbit) |
| Embedded 18x18 Multipliers | 218 |
| Maximum User I/O | 296 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 0.9 V / 1.1 V |
| Maximum Core Frequency | 500 MHz |
| Package | 484-ball FBGA (FC-FBGA, 23x23 mm, 1.0 mm pitch) |
| Operating Junction Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (SMT) |
| Lead-Free / RoHS | Lead Free / Compliant |
| Programming Tool | Quartus II (legacy) |
EP3SL50F484I3N 484-ball fbga (fc-fbga, 23x23 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP3SL50F484I3N (484-ball fbga (fc-fbga, 23x23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F484I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F484I3N is suitable for 6 applications: Telecom Baseband and Packet Processing, Military and Aerospace Signal Intelligence, Test and Measurement Instrumentation, Medical Imaging and Ultrasound, High-Speed Serial Protocol Bridging, Industrial Motor Control and Automation.
Telecom Baseband and Packet Processing
The EP3SL50F484I3N's 47.5K logic elements, 218 18x18 multipliers, and 2.1 Mbit on-chip SRAM deliver 500 MHz DSP throughput for telecom baseband and packet processing nodes. Its 65 nm low-power Stratix III L fabric reduces dynamic power per MHz versus Stratix II, which is critical for line cards that aggregate thousands of channels. The 296 user I/Os provide ample LVDS/SSTL lanes to connect to external SFP+ cages and CPRI framer ASICs. Engineers pair this FPGA with TI clocks and Analog Devices ADCs to build multi-gigabit protocol bridges in legacy 3G/4G base stations. The I3 speed grade is selected when timing margins are tight on critical DSP paths.
Recommended
Military and Aerospace Signal Intelligence
The EP3SL50F484I3N's industrial -40C to +100C junction range and high-density programmable fabric suit radar, electronic-warfare, and SIGINT subsystems. The 484-ball FBGA supports ruggedized board layouts with multiple ground planes and shielding vias needed for sensitive RF chains. Its 218 hardware multipliers accelerate FFT and chirp correlators in real-time signal intelligence. Designers choose this part for legacy defense programs with established Intel/Altera design flows and long hardware lifecycles. The I3 speed grade sustains high clock rates on pipelined DSP chains used in adaptive beamforming. Note that MIL-STD-810 qualified variants or extended temperature grades are required for some aerospace programs.
Recommended
Test and Measurement Instrumentation
The EP3SL50F484I3N is widely deployed in high-end oscilloscopes, logic analyzers, and protocol testers where 500 MHz fabric and 296 I/Os sample many channels in parallel. Its on-chip M9K memory blocks buffer deep acquisitions before off-loading to host processors via PCIe or USB 3.0 soft cores. The ALM-based logic fabric reduces gate count on complex trigger sequencers used in mixed-signal test equipment. Industrial temperature grade allows integration into laboratory chassis without forced-air cooling. Designers pair the FPGA with high-speed TI DACs and ADCs to build arbitrary waveform generators and protocol analyzers with deterministic latency.
Recommended
Medical Imaging and Ultrasound
The EP3SL50F484I3N's 218 18x18 hardware multipliers accelerate beamforming in real-time ultrasound systems, where the FPGA processes 64 to 256 channels simultaneously. The 2.1 Mbit embedded memory stages beamformed samples per scan line, while the 296 I/Os receive data from multi-channel ADC front ends. Industrial temperature is adequate for cart-based ultrasound carts in clinical environments. Designers also leverage the same device in MRI gradient controllers and patient monitor DSP backbones. The I3 speed grade sustains continuous beamforming rates above 30 MHz on parallel channel paths.
Recommended
High-Speed Serial Protocol Bridging
The EP3SL50F484I3N integrates Stratix III transceivers supporting data rates up to 1.25 Gbps per channel, making it a fit for protocol bridges between PCIe, Serial RapidIO, Aurora, and custom serial interfaces. Designers use it as a multi-protocol aggregation FPGA in industrial backplanes and storage controllers. Its 65 nm low-power fabric minimizes heat in sealed enclosures where airflow is limited. The 484-ball FBGA offers controlled-impedance escape for high-speed serial lanes. Industrial temperature grade allows outdoor or cabinet-mounted operation in telecommunications equipment.
Recommended
Industrial Motor Control and Automation
The EP3SL50F484I3N handles multi-axis motor control loops where deterministic latency and parallel PWM generation matter more than raw throughput. Its 296 user I/Os drive numerous encoder, Hall-sensor, and gate-driver signals, while 218 hardware multipliers execute field-oriented control (FOC) math in microsecond loop times. The industrial temperature grade allows mounting in factory-floor cabinets with wide ambient swings. Designers integrate this FPGA alongside TI C2000 microcontrollers for hierarchical control. The I3 speed grade provides headroom for high-Kv servo loops in CNC machines and robotics.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F484I3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F484I4N | EP3SL50F484I3G | EP3SL50F484I3 | EP3SE50F484I3N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Logic Elements | 47,500 | 47,500 - same | 47,500 - same | 47,500 - same | 47,500 - same |
| Embedded Memory | 2.1 Mbit | 2.1 Mbit - same | 2.1 Mbit - same | 2.1 Mbit - same | 4.5 Mbit (Stratix III E) |
| Speed Grade | -3 (500 MHz) | -4 (slower) | -3 (same) | -3 (same) | -3 (same) |
| Temperature Grade | Industrial -40C to +100C | Industrial - same | Industrial - same | Commercial 0C to +85C | Industrial - same |
| Family | Stratix III L (low-power) | Stratix III L - same | Stratix III L - same | Stratix III L - same | Stratix III E (enhanced memory) |
| Process Technology | 65 nm CMOS | 65 nm CMOS - same | 65 nm CMOS - same | 65 nm CMOS - same | 65 nm CMOS - same |
| Approximate 1k-piece Price (USD, 2026-09-09) | $552.30 | Similar / slightly lower | Similar | Similar | Similar |
Key Differentiators
- Lowest-power Stratix III variant (vs EP3SE50F484I3N)
- Industrial temperature grading on speed-grade -3 (vs EP3SL50F484I3)
- Pin-compatible speed-grade flex (vs EP3SL50F484I4N)
Design Notes
The Stratix III 484-ball FBGA is a large thermally-enhanced package with a high theta_JA; design engineers should provide at least 4 thermal vias under the central ball array and connect them to internal ground planes for heat spreading. Forced airflow of 200 LFM is recommended for industrial-grade operation at maximum junction temperature per the manufacturer datasheet thermal guidelines.
The EP3SL50F484I3N requires multiple supply rails (0.9V core, 1.1V analog, 2.5V/3.0V I/O, 1.2V transceiver PLL) with strict sequencing per Intel's Stratix III Device Handbook Power Management chapter. Use a dedicated Power Management Unit such as the TI UCD9222 or LT1771 with POR monitoring to avoid latch-up during ramp-up. Decoupling requires 100 nF X7R capacitors within 0.1 inch of every VCC/VCCIO ball pair, plus bulk capacitors per the device handbook reference schematics.
Route the 484-FBGA escape using 0.1 mm traces with microvia stacks (laser-drilled or sequential build-up). Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for SSTL. Keep configuration JTAG traces away from clock and high-speed serial lines to avoid coupling per the Stratix III PCB Design Guidelines. Provide a clean 4-layer stack-up with continuous reference planes for BGA breakout.
Engineers often forget that the EP3SL50F484I3N is in Last Time Buy (LTB) and may accidentally enter it into new designs; verify lifecycle status before release. Confirm that the Quartus II version in use supports the device - some legacy Quartus releases do not include the latest errata. Always use the speed-grade specific timing models and run TimeQuest timing analysis at -40C / +100C corners for industrial designs.
Compliance Information
Lead-free / Pb-free / RoHS compliant per the 'N' suffix and distributor descriptions. Not AEC-Q100 qualified - FPGAs typically do not carry automotive qualification. Industrial temperature grade per the 'I' in the part number.
