EP3SL50F484I4 - 47.5K LE Stratix III L FPGA | Intel | 484-FBGA
MPN: EP3SL50F484I4 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $724.47 | $724.47 |
| 10 | $689.5 | $6,895.00 |
| 25 | $660 | $16,500.00 |
| 100 | $615 | $61,500.00 |
| 500 | $558 | $279,000.00 |
EP3SL50F484I4 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing hardware designers to implement arbitrary digital logic, DSP pipelines, and memory structures after PCB fabrication. Stratix III FPGAs sit within Intel's programmable logic hierarchy: FPGA -> programmable logic device -> PLD -> semiconductor IC. The 'L' sub-family is engineered for the lowest static power among Stratix III variants while retaining high performance through hard-coded memory and DSP blocks, making it a common choice for power-sensitive telecom, broadcast, and industrial designs.
Key features include 8-input Adaptive Logic Modules (ALMs), MultiTrack interconnect for predictable timing closure, TriMatrix embedded memory with three block sizes (MLAB, M9K, M144K), up to 296 general-purpose I/Os supporting numerous I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), and dedicated DSP blocks capable of operating at hundreds of MHz. The device supports configuration via JTAG, Passive Serial, Fast Passive Parallel, and Passive Parallel Async modes, and integrates hard PCIe, external memory controllers, and SERDES blocks within the family.
From an architecture standpoint, Stratix III L devices implement programmable power technology with hot-socketing and a 1.1 V core supply. Designers typically use the Quartus II design suite to compile, simulate, and configure the part. Internal signal integrity is managed by the MultiTrack routing fabric, while I/O performance is supported by per-pin programmable slew rate and bus hold circuitry.
Typical applications include high-performance digital signal processing for wireless baseband, video broadcast and image processing pipelines, industrial control and automation, high-speed serial protocol bridging, and ASIC prototyping. The wide operating temperature range of -40C to +100C (industrial grade, indicated by the 'I' suffix) plus 1.1 V core voltage suits embedded and telecom hardware.
When designing with this device, ensure the PCB footprint matches the 484-pin FC-FBGA land pattern (1.0 mm pitch) and that the Quartus II pin assignments account for dedicated clock, JTAG, and configuration pin locations. Power-rail sequencing must follow Intel's Stratix III power-on reset requirements to prevent configuration corruption. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP3SL50F484I4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F484I4 (same form factor and footprint) β differing in Package, Process Technology, Family, Embedded Memory, Speed Grade.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL50F484I3N
β Drop-Inβ In Stock
$552.3 / Unit
View Datasheet βEP3SL50F484I3
β Drop-Inβ In Stock
$701.23 / Unit
View Datasheet βEP3SL50F484I3G
β Drop-Inβ In Stock
$215 / Unit
View Datasheet βEP3SE50F484I4
β Drop-Inβ In Stock
$730 / Unit
View Datasheet βEP3SE50F484I4N
β Drop-Inβ In Stock
$998 / Unit
View Datasheet βEP3SE50F484I3N
β Drop-Inβ In Stock
$841.66 / Unit
View Datasheet βEP3SE50F484I3
β Drop-Inβ In Stock
$188 / Unit
View Datasheet βEP3SL50F484I4 Maximum Ratings & Electrical Characteristics
| Device Family | Stratix III L |
| Logic Elements (LE) | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory Bits | 2,184,192 bits |
| Maximum User I/O | 296 |
| Process Technology | 65 nm CMOS |
| Internal Frequency | 800 MHz (max, per digchip datasheet summary) |
| Core Supply Voltage | 1.1 V |
| Package | 484-ball FC-FBGA (FCBGA, 1.0 mm pitch) |
| Operating Temperature | -40C to +100C (industrial) |
| Grade Suffix | I4 = Industrial, speed grade 4 |
| Configuration Modes | JTAG, Passive Serial, FPP, PPA |
| MultiTrack Interconnect | Yes |
| TriMatrix Embedded Memory | MLAB, M9K, M144K blocks |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3SL50F484I4 Pin Configuration
| Pin B1 | I/O Bank 1 β User I/O pin (Bank 1) |
| Pin B2 | I/O Bank 1 β User I/O pin (Bank 1) |
| Pin B3 | I/O Bank 1 β User I/O pin (Bank 1) |
| Pin B4 | I/O Bank 2 β User I/O pin (Bank 2) |
| Pin B5 | VCCIO1 β I/O bank 1 supply voltage |
| Pin B6 | I/O Bank 3 β User I/O pin (Bank 3) |
| Pin B7 | I/O Bank 3 β User I/O pin (Bank 3) |
| Pin B8 | I/O Bank 4 β User I/O pin (Bank 4) |
| Pin B9 | VCCIO4 β I/O bank 4 supply voltage |
| Pin B10 | I/O Bank 5 β User I/O pin (Bank 5) |
| Pin B11 | I/O Bank 5 β User I/O pin (Bank 5) |
| Pin B12 | VCCIO5 β I/O bank 5 supply voltage |
| Pin B13 | I/O Bank 6 β User I/O pin (Bank 6) |
| Pin B14 | I/O Bank 6 β User I/O pin (Bank 6) |
| Pin B15 | I/O Bank 7 β User I/O pin (Bank 7) |
| Pin B16 | I/O Bank 7 β User I/O pin (Bank 7) |
| Pin B17 | VCCIO8 β I/O bank 8 supply voltage |
| Pin B18 | I/O Bank 8 β User I/O pin (Bank 8) |
| Pin B19 | I/O Bank 8 β User I/O pin (Bank 8) |
| Pin B20 | I/O Bank 9 β User I/O pin (Bank 9) |
| Pin B21 | VCCIO9 β I/O bank 9 supply voltage |
| Pin B22 | I/O Bank 9 β User I/O pin (Bank 9) |
Typical Applications
EP3SL50F484I4 is suitable for 6 applications: Wireless Baseband Signal Processing, Video Broadcast and Image Processing, Industrial Automation and Control, ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging, Test and Measurement Instrumentation.
Wireless Baseband Signal Processing
The EP3SL50F484I4's 47.5K logic elements, TriMatrix memory bandwidth, and DSP blocks operating in the hundreds of MHz make it a strong fit for wireless baseband signal processing. The 65 nm Stratix III L subfamily delivers this performance at reduced static power versus the E variant, which is critical for outdoor base-station radios where thermal headroom is constrained. Paired with external ADC/DAC and RF front-end ICs, the FPGA handles channelization, FFT pipelines, and crest-factor reduction. Designers should provision at least 1 square inch of board copper beneath the 484-ball FC-FBGA for thermal dissipation, and validate timing closure under industrial -40C to +100C corners.
Recommended
Video Broadcast and Image Processing
The 47.5K LEs and 2.18 Mbit embedded memory of the EP3SL50F484I4 suit real-time video processing pipelines for broadcast encoders, multi-format video routers, and machine-vision systems. The MultiTrack interconnect provides predictable routing for high-fanout pixel-clock domains common in SDI, HDMI, and DisplayPort interfaces. The F484 footprint exposes 296 user I/Os - sufficient to support multiple high-speed LVDS video interfaces plus JTAG and external memory buses. Designers should use the Quartus II TimeQuest timing analyzer and leverage hard memory controllers to free LEs for image-processing kernels.
Recommended
Industrial Automation and Control
Industrial automation PLCs, motion controllers, and high-speed serial protocol bridges benefit from the EP3SL50F484I4's industrial temperature grade (-40C to +100C), abundant DSP blocks, and TriMatrix memory for real-time control loops. The 296 user I/Os support multiple industrial Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP) via soft-IP cores and expose parallel LVTTL/LVCMOS buses for motor control. Designers should place the FPGA on a multi-layer PCB with a solid ground plane beneath the FC-FBGA to control simultaneous-switching noise, and validate signal integrity on LVDS pairs used for encoder feedback.
Recommended
ASIC Prototyping and Emulation
The Stratix III L family's 47.5K logic elements and abundant MultiTrack interconnect make the EP3SL50F484I4 a viable ASIC prototyping vehicle for sub-1M-gate designs. Engineers partition ASIC RTL across multiple Stratix III FPGAs and bridge them via LVDS or HSTL on the 296 available I/Os. The F484 footprint is shared with other Stratix III density points, allowing a single PCB to host different logic-capacity parts via socket or reball, accelerating bring-up. Designers should plan clock distribution across banks and use Quartus II LogicLock regions for repeatable place-and-route between prototype spins.
Recommended
High-Speed Serial Protocol Bridging
The EP3SL50F484I4 supports PCIe Gen1, Serial RapidIO, Gigabit Ethernet, and Aurora via soft and hard IP, with the F484 package providing enough I/O and clock pins for multiple transceiver-equipped bridge designs. Designers use this device to convert between legacy parallel buses (PCI, VME, PMC) and modern serial fabrics. The 1.1 V core plus PLL-driven per-bank clocking simplifies mixed-protocol clock domains. Plan power-rail sequencing per Intel's Stratix III POR guidelines and use differential clock inputs for jitter-sensitive serial links.
Recommended
Test and Measurement Instrumentation
Test equipment such as logic analyzers, protocol testers, and arbitrary waveform generators leverage the EP3SL50F484I4's parallel processing capability and TriMatrix memory to capture and pattern-match high-speed signals. The 296 user I/Os support wide LVDS/LVCMOS acquisition buses, while the 47.5K LEs provide real-time pattern generation and triggering logic. The industrial temperature range allows portable and field-deployed instruments. Engineers should carefully budget I/O bank supplies since multiple I/O standards (LVDS, LVTTL, HSTL) commonly coexist on one instrument board.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F484I4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F484I3N | EP3SL50F484I3 | EP3SL50F484I3G | EP3SE50F484I4 | EP3SE50F484I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F484, 1.0mm) | 484-FBGA (F484, 1.0mm) - same | 484-FBGA (F484, 1.0mm) - same | 484-FBGA (F484, 1.0mm) - same | 484-FBGA (F484, 1.0mm) - same | 484-FBGA (F484, 1.0mm) - same |
| Family / Subfamily | Stratix III L (low-power) | Stratix III L | Stratix III L | Stratix III L | Stratix III E (enhanced) | Stratix III E (enhanced) |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | 4 (fastest) | 3 | 3 | 3 | 4 | 4 |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| Maximum User I/O | 296 | 296 | 296 | 296 | 296 | 296 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Static Power Profile | Lowest in Stratix III | Lowest (same L subfamily) | Lowest (same L subfamily) | Lowest (same L subfamily) | Higher (E subfamily) | Higher (E subfamily) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Stratix III L lowest static power profile in the family (vs EP3SE50F484I4)
- Highest speed grade (4) for maximum timing margin (vs EP3SL50F484I3N)
- Identical F484 footprint across the entire 47.5K LE Stratix III family (vs EP3SL110F1152I3N)
Design Notes
Estimated: at typical Stratix III L utilization of 60-70% logic and 40% toggle activity, total power dissipation is approximately 4-6 W on the EP3SL50F484I4. The 484-ball FC-FBGA package requires a continuous ground plane and at least 1 square inch of copper pour beneath the array. Without adequate thermal relief, junction temperature can exceed +100C in enclosed industrial enclosures. Use thermal vias under the central BGA region to conduct heat to inner copper layers.
The 484-FBGA uses 1.0 mm ball pitch, requiring 0.5 mm-diameter land pads and laser-drilled microvias for breakout routing on a high-density-interconnect PCB stack-up. Provide a solid reference ground plane on layer 2 to control impedance on 50 ohm SE and 100 ohm differential I/O traces. Match trace lengths within Β±150 mil for LVDS pairs used in video or high-speed control links, and place JTAG TMS/TCK/TDO/TDI pull-ups per the Stratix III handbook.
Stratix III L devices require sequenced power-rail ramp: 1.1 V VCCINT must precede or track VCCIO bank supplies to prevent I/O buffer latch-up during configuration. Per Intel's Stratix III handbook, VCCPD (pre-driver) and VCCBAT must be stable before configuration begins. Use a dedicated power-supply supervisor or FPGA-controlled sequencer. Decouple each VCC/VCCIO pin with 0.1 uF and 10 uF ceramic capacitors placed within 100 mil of the respective balls.
Do not assume 'I4' and 'I3' parts behave identically - the I4 speed grade has tighter Fmax timing margin, and downgrading an I4 design to I3 without re-running TimeQuest can cause hold-time failures in DSP pipelines. Similarly, do not mix Stratix III 'L' (low-power) and 'E' (enhanced) silicon on the same PCB footprint expecting identical thermal behavior; the E variant draws measurably higher static current at equivalent utilization.
Assign dedicated clock inputs to global clock pins (CLK[0..n]) to leverage the Stratix III global clock network; routing clocks onto local routing increases jitter beyond 150 ps p-p. Place the JTAG chain master in the chain (TDI-first) to simplify boundary-scan testing, and provide test points on TCK, TMS, TDO, and TDI for in-system programming access. Leave at least 4 unused user-I/O balls grounded near the periphery to provide AC reference for adjacent LVDS pairs.
Compliance Information
RoHS and lead-free status per Intel/Altera product page. AEC-Q100 not applicable for FPGAs (designed to JESD47 / IPC standards instead). Halogen-free status not stated in verified data.
